Diffusion bonding of Ti/Ni under the influence of an electric current: mechanism and bond structure
Source abstract
Abstract
The diffusion bonding between Ti and Ni was investigated in the presence and absence of an imposed electric current. Bonding was carried out over the temperature range of 873–1123 K and the current density range of 255–350 A/cm2. The formation and sequence of evolution of the three intermetallic phases, TiNi3, TiNi, and Ti2Ni, were investigated and discussed in light of calculations of Gibbs free energies of formation and interfacial energies associated with their nucleation. Within the experimental times and in the presence of a current, the growth of the three phases was parabolic. The evolution of the TiNi phase required an incubation period, while the relatively high growth rate of TiNi3 suggests the possibility of another mechanism. The growth of all phases was enhanced by the application of a direct current, with no apparent dependence on its direction.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Intermetallics and Advanced Alloy Properties · Electromagnetic Effects on Materials · Semiconductor materials and interfaces
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (24)
Show source-provided references
1. Veiga C, Davim JP, Loureiro AJR (2012) Properties and application of titanium alloys: a brief review. Rev Adv Mater Sci 32:133–148
2. Wilson SA, Jourdain RP, Zhang Q, Dorey RA, Bowen CR, Willander M, Wahab QU, Willander M, Al-Hilli SM, Nur O (2007) New materials for micro-scale sensors and actuators: an engineering review. Mater Sci Eng, R 56:1–129. doi: 10.1016/j.mser.2007.03.00110.1016/j.mser.2007.03.001 ↗
3. Hannula SP, Söderberg O, Jämsä T, Lindroos VK (2006) Shape memory alloys for biomedical applications. Adv Sci Technol 49:109–11810.4028/www.scientific.net/AST.49.109 ↗
4. Kundu S, Sam S, Chatterjee S (2013) Interfacial reactions and strength properties in dissimilar titanium alloy/Ni alloy/microduplex stainless steel diffusion bonded joints. Mater Sci Eng, A 560:288–295. doi: 10.1016/j.msea.2012.09.06910.1016/j.msea.2012.09.069 ↗
5. Cai XQ, Wang Y, Yang ZW, Wang DP, Liu YC (2016) Transient liquid phase (TLP) bonding of Ti 2AlNb alloy using Ti/Ni interlayer: microstructure characterization and mechanical properties. J Alloys Compd 679:9–17. doi: 10.1016/j.jallcom.2016.03.28610.1016/j.jallcom.2016.03.286 ↗
6. Simoes S, Viana F, Ramos AS, Vieira MT, Vieira MF (2016) Microstructural characterization of diffusion bonds assisted by Ni/Ti nanolayers. J Mater Eng Perform 2016:1–7. doi: 10.1007/s11665-016-2135-z10.1007/s11665-016-2135-z ↗
7. Chen SP, Dong F, Fan WH, Meng QS, Munir Zuhair A (2013) Interface kinetics of combustion-diffusion bonding of Ni3Al/Ni and TiAl/Ti under direct current field. J Mater Sci 48:1268–1274. doi: 10.1007/s10853-012-6869-110.1007/s10853-012-6869-1 ↗
8. Chen S, Meng Q, Zhang N, Xue P, Munir Zuhair A (2012) In situ synthesis and bonding of Ti–TiAl–TiC/Ni functionally graded materials by field-activated pressure-assisted synthesis process. Mater Sci Eng A 538:103–109. doi: 10.1016/j.msea.2012.01.02010.1016/j.msea.2012.01.020 ↗
9. Zhao K, Liu Y, Huang L, Liu B, He Y (2016) Diffusion bonding of Ti–45Al–7Nb–0.3W alloy by spark plasma sintering. J Mater Process Technol 230:272–279. doi: 10.1016/j.jmatprotec.2015.11.03010.1016/j.jmatprotec.2015.11.030 ↗
10. Pan R, Wang Q, Sun D, He P (2015) Effects of electric field on interfacial microstructure and shear strength of diffusion bonded a-Al2O3/Ti joints. J Euro Ceram Soc 35:219–226. doi: 10.1016/j.jeurceramsoc.2014.07.02510.1016/j.jeurceramsoc.2014.07.025 ↗
11. Guo Z, Zhong H, Yang M, Xiong J, Wan W, Liang M (2015) Microstructure and properties of the Ti(C,N)–xMo2C–Ni cermet/steel joint by a novel diffusion bonding method. Mater Charact 99:92–100. doi: 10.1016/j.matchar.2014.11.02210.1016/j.matchar.2014.11.022 ↗
12. Bastin GF, Rieck GD (1974) Diffusion in the titanium-nickel system. I. Occurrence and growth of the various intermetallic compounds. Metall Trans 5:1817–1826. doi: 10.1007/BF0264414610.1007/BF02644146 ↗
13. Garay JE, Anselmi-Tamburini U, Munir ZA (2003) Enhanced growth of intermetallic phases in the Ti–Ni systems by current effects. Acta Mater 51:4487–4495. doi: 10.1016/S1359-6454(03)00284-210.1016/S1359-6454(03)00284-2 ↗
14. Shao X, Guo X, Han Y, Lin Z, Qin J, Lu W, Zhang D (2014) Preparation of TiNi films by diffusion technology and the study of the formation sequence of the intermetallics in Ti–Ni systems. J Mater Res 29:2707–2716. doi: 10.1557/jmr.2014.26410.1557/jmr.2014.264 ↗
15. Nizhenko VI (2004) Free surface energy as a criterion for the sequence of intermetallic layer formation in reaction couples. Powder Metall Met Ceram 43:273–279. doi: 10.1023/B:PMMC.0000042462.03736.1810.1023/B:PMMC.0000042462.03736.18 ↗
16. Zhou Y, Wang Q, Sun DL, Han XL (2011) Co-effect of heat and direct current on growth of intermetallic layers at the interface of Ti–Ni diffusion couples. J Alloys Compd 59:1201–1205. doi: 10.1016/j.jallcom.2010.09.18210.1016/j.jallcom.2010.09.182 ↗
17. Feng D (2014) Phase transformation and mechanical performance of interface between Ti/Ni diffusion bonding couples activated by electric field. Dissertation, Taiyuan University of Technology
18. Lifang H (2014) The characterization of the interfacial microstructure and the mechanical properties of the diffusion bonded metal and ceramics/metal under multi-physics field coupling. Dissertation, Taiyuan University of Technology
19. Benedictus R, Bottger A, Mittemeijer EJ (1996) Thermodynamic model for solid-state amorphization in binary systems at interfaces and grain boundaries. Phys Rev B 54:9109–912510.1103/PhysRevB.54.9109 ↗
20. Garay JE, Glade SC, Anselmi-Tamburini U, Asoka-Kumar P, Munir ZA (2004) Electrical current enhanced defect mobility in Ni3Ti intermetallics. Appl Phys Lett 85:573–575. doi: 10.1063/1.177426810.1063/1.1774268 ↗
21. Liou KM, Liao CN (2010) Electric current enhanced defect elimination in thermally annealed Bi–Sb–Te and Bi–Se–Te thermoelectric films. J Appl Phys 108(053711):1–5. doi: 10.1063/1.347718410.1063/1.3477184 ↗
22. Locci AM, Orru R, Cao G, Munir ZA (2003) Field-activated pressure-assisted synthesis of TiNi. Intermetallics 11:555–571. doi: 10.1016/S0966-9795(03)00043-810.1016/S0966-9795(03)00043-8 ↗
23. Bertolino N, Garay J, Anselmi-Tamburini U, Munir ZA (2001) High-flux current effects in interfacial reactions in Au–Al multilayers. Scripta Mater 44:737–74210.1016/S1359-6462(00)00669-2 ↗
24. Zhao J, Garay JE, Anselmi-Tamburinin U, Munir ZA (2007) Directional electromigration-enhanced interdiffusion in the Cu–Ni system. J Appl Phys 102(114902):1–7. doi: 10.1063/1.280944410.1063/1.2809444 ↗