The use of a simultaneous TGA/DSC/FT-IR system as a problem-solving tool
Bibliographic record
Abstract
No abstract is available for this record. The assistant can identify its topic from the title, but cannot infer the study’s results.
Source: Not provided · Quality: missing
Research context
OpenAlex topics: Thermal and Kinetic Analysis · Electronic Packaging and Soldering Technologies · Chemical Thermodynamics and Molecular Structure
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (14)
Show source-provided references
1. D. A.C.Compton and D.Loeb, in “Proceedings of the 16th North American Thermal Analysis Society Conference”, Washington, DC, 1987, edited by P. J. Kelleghan (North American Thermal Analysis Society, 1987) pp. 366–69.
2. D. A.C.Compton, D.J.Johnson and M.L.Mit tleman, “Integrated TGA/FT-IR system to study polymeric materials” Parts I and II Research and Development, February and April 1989 (Cahners Pub. Co., Newton, MA, US). Both articles available from Bio-Rad, Digilab Division as FTS/IR Note no. 70.
3. D.J.Johnson and D.A.C.Compton, Am. Lab. Mag. January (1991) 37. Available from Bio-Rad, Digilab Division as FTS/IR Note no. 79.
4. D. J. Johnson, D. A. C. Compton, R. S. Cass and P. L. Canale, Thermochimi. Acta, 230 (1993) 293.10.1016/0040-6031(93)80367-J ↗
5. D. J. Johnson, D. A. C. Compton and P. L. Canale, ibid. 195 (1992) 5.10.1016/0040-6031(92)80042-U ↗
6. D. A. C. Compton, D. J. Johnson and J. R. Powell, in “Structure-Property Relations in Polymers: Spectroscopy and Performance”, edited by M. W. Urban and C. D. Craver, Advances in Chemistry Series 236, (American Chemical Society, Washington, DC, 1993) pp. 661–75.
7. J. A. J. Jansen, J. H. Van Der Maas and A. Posthuma De Boer, Appl. Spectrosc. 46 (1992) 88.10.1366/0003702924444452 ↗
8. C. Lea, “A Scientific Guide to Surface Mount Technology” (Electrochemical Publications Ltd., Ayr, Scotland, 1988) p. 154.
9. I. Artaki, U. Ray, H. M. Gordon and M. S. Gervasio, in “Materials Developments in Microelectronic Packaging Conference Proceedings”, Montreal, Quebec, Canada, 19–22 August, 1991, edited by P. Singh (ASM International, Materials Park, OH, US) pp. 83–97.
10. Caroline A. Kovac, “Plastic Package Fabrication”, Electronic Materials Handbook, Vol. 1, (ASM International, Materials Park, OH, US, 1989) pp. 470–82.
11. R. M. Lum and L. G. Feinstein, Microelectron. Reliability 21 (1981) 15.10.1016/0026-2714(81)90543-6 ↗
12. W. C. Mih, in “Polymers in Electronics”, edited by T. Davidson (American Chemical Society, Washington, DC, 1984) Ch. 22.
13. T.B. Ching and W.H. Schroen, IEEE/IRPS (1988) p. 64.
14. H.Koyama, H. Shiozaki, I. Okumura, S. Mizugashira, H. Higuchi and T. Ajiki, ibid. (1988). p. 59.