journal article·1998-09

Modelling the creep rates of eutectic Bi–Sn solder using the data from its constitutive phases

C. H. Raeder, D. Mitlin, R. W. Messler

Journal of Materials Science· Volume 33· Issue 18
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Abstract

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Research context

OpenAlex topics: Aluminum Alloys Composites Properties · Microstructure and mechanical properties · High Temperature Alloys and Creep

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References (31)

Show source-provided references
1. M. Tanaka, T. Sakaki and H. Iizuka, Acta Metall. 39 (1991) 1549.10.1016/0956-7151(91)90241-R ↗
2. G. D. Schmeelk, Master Thesis, Rensselaer Polytechnic Institute (1993).
3. C. H. Raeder, G. D. Schmeelk, D. Mitlin, T. Barbieri, W. Yang, L. E. Felton, R. W. Messler, Jr, D. B. Knorr and D. Lee, in Proceedings of the 16th IEEE/CPMT IEMT Symposium, 12-14 September 1994, La Jolla, CA, p. l.
4. J. Weertman, J. Appl. Phys. 28 (1957) 362.10.1063/1.1722747 ↗
5. Idem, Trans. Met. Soc. AIME 218 (1960) 207.
6. Idem, J. Appl. Phys. 28 (1957) 1185.10.1063/1.1722604 ↗
7. S. L. Robinson and O. D. Sherby, Acta Metall. 17 (1969) 109.10.1016/0001-6160(69)90132-1 ↗
8. J. Weertman, in “Rate Processes in Plastic Deformation”, edited by J. C. M. Lui and A. K. Mukherjee (American Society for Metals, Metals Park, OH, 1975) p. 315.
9. T. G. Langdon, in “Strength of Metals and Alloys” Proceedings of the 6th International Conference 1982, p. 1105.10.1016/B978-1-4832-8423-1.50168-1 ↗
10. P. Yavari, F. A. Mohamed and T. G. Langdon, Acta Metall. 29 (1981) 1495.10.1016/0001-6160(81)90184-X ↗
11. D. L. Mcdanels, R. A. Signorelli and J. W. Weeton, ASTM STP 427 (American Society for Testing Materials, Philadelphia, PA, 1967) p. 124.
12. K. Cho and J. Gurland, Met. Trans. 19 (1998) 2027.10.1007/BF02645206 ↗
13. M. H. Poech and H. F. Fischmeister, Acta Metall. 40 (1992) 487.10.1016/0956-7151(92)90397-W ↗
14. K. S. Ravichandran, ibid. 42 (1994) 1113.10.1016/0956-7151(94)90128-7 ↗
15. S. Ankem and H. Margolin, Met. Trans. 13A (1982) 595.10.1007/BF02644424 ↗
16. K. Tanaka and T. Mori, Acta Metall. 18 (1970) 931.10.1016/0001-6160(70)90020-9 ↗
17. K. Tanaka, K. Wakashima and T. Mori, J. Mech. Phys. Solids 21 (1973) 207.10.1016/0022-5096(73)90020-3 ↗
18. J. D. Eshelby, Proc. R. Soc. A241 (1957) 376.
19. Idem, ibid. A252 (1959) 561.
20. T. Mori and K. Tanaka, Acta Metall. 21 (1973) 571.10.1016/0001-6160(73)90064-3 ↗
21. T. Mura and T. Mori, Micromechanics 23 (1976).
22. T. Mura, “Micromechanics of Defects in Solids” (Martinus Nijhoff, The Hague, 1982).10.1007/978-94-011-9306-1 ↗
23. K. Tanaka and T. Mori, Acta Metall. 18 (1970) 931.10.1016/0001-6160(70)90020-9 ↗
24. W. P. Ellis and N. H. Nachtrieb, J. Appl. Phys. 10 (1969) 472.10.1063/1.1657422 ↗
25. B. M. Drapkin and V. K. Kononenko, Izvestia Akademii Nauk SSSR Metally 2 (1987) 168.
26. E. L. Holmes and W. C. Winegard, Trans. Met. Soc. AIME 224 (1962) 945.
27. C. H. Raeder, D. Mitlin and W. Yang, in Proceedings of the Seventh International SAMPE Electronics Conference, Parsippany, NJ, 20–23 June, 1994, p. 355
28. S. Pattanaik and V. Raman, “Materials Developments in Microelectronics Packaging: Performance and Reliability”, Conference Proceedings, edited by P. J. Singh (ASM International, 1991) p. 241.
29. D. H. Avery and W. A. Backofen, Trans. ASM 58 (1965) 551.
30. T. H. Alden, J. Australian Inst. Metals 14 (1969) 207.
31. M. A. Clark and T. H. Alden, Acta Metall. 21 (1973) 1195.10.1016/0001-6160(73)90160-0 ↗