Screen-Printed Transparent Metal Mesh for Microstrip Patch Antenna: A Scalable Approach for Next-Generation Wireless Applications
Source abstract
Abstract
Transparent and flexible antennas are in high demand due to their applications in next-generation communication systems, such as smart surfaces, wearable electronics, and Internet of Things devices. This study proposes a first-of-its-kind demonstration of a 2.35 GHz microstrip patch antenna with a transparent conductive layer in the form of a screen-printed silver nanoparticle ink metal mesh. This transparent patch antenna features optical transparency and high electrical conductivity, making it a highly suitable candidate for modern wireless devices that require a seamless integration. The transparent metal mesh was fabricated using a cost-effective screen-printing method; a used polyethylene terephthalate substrate (silver nanoparticle ink); and precise patterning with uniform conductivity, flexibility, and transparency. Simulations and experimental validation of the fabricated transparent microstrip line and microstrip patch antenna were performed to analyze their electromagnetic properties and impedance matching, ensuring minimal signal loss, transmission coefficient, reflection coefficient, and radiation characteristics. The results obtained were an antenna gain of −1 dBi, radiation efficiency of 9.92%, and transmittance of 49.09%, which are comparable to other printed antennas but benefit from conductivity, mechanical flexibility, and optical transparency. This work is the first of its kind to produce metal mesh-patterned microstrip patch antennas entirely through additive printing, establishing a pathway for cost-effective, flexible, and transparent wireless applications.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Nanomaterials and Printing Technologies · Interactive and Immersive Displays · Advanced Sensor and Energy Harvesting Materials
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Department of Electrical and Electronics Engineering
Chung-Ang University
Department of Intelligent Semiconductor Engineering
Funding
National Research Foundation of Korea · Chung-Ang University
References (41)
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