Effect of DOPO units and of polydimethylsiloxane segments on the properties of epoxy resins

New flame retardant epoxy resins containing phosphorus and/or silicon atoms were prepared by the introduction into the epoxy chemical structure of 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO) and/or of polydimethylsiloxane segments. The structure and morphology of cured epoxy resins were evaluated by Fourier transform infrared spectroscopy and scanning electron microscopy analyses, respectively. The polymers exhibited good thermal stability, having initial decomposition temperature above 310 °C. Thermogravimetric analyses and limiting oxygen index values indicated that the incorporation of DOPO units/polydimethylsiloxane segments in the polymer structure significantly enhanced flame retardancy and thermal stability of char layer at high temperature. Broadband dielectric spectroscopy measurements over a wide range of frequency and temperature revealed two subglass transitions, γ and β. The experimental data were fitted to the Havriliak–Negami and Arrhenius models, and the obtained parameters were analyzed. An α relaxation process attributed to the glass transition was observed in the high temperature and high frequency ranges. The influence of DOPO units and polydimethylsiloxane segments on the properties of the polymers was examined.