Mechanical properties of electrodeposited nanocrystalline copper using tensile and shear punch tests
Source abstract
Abstract
Characterization of the mechanical properties of electrodeposited nanocrystalline Cu with an average grain size of 74 nm was carried out using two different testing techniques, shear punch tests and tensile tests. The grain size distribution was broad and the volume fraction of larger grains was appreciable. The electrodeposited Cu had a high yield strength combined with moderate ductility and strain hardening. Scatter in the ductility values was attributed to residual porosity and inhomogeneity in the microstructure. Measurements of the strain rate sensitivity showed a significant increase in the rate sensitivity and a decrease in the activation volume for the deformation of nanocrystalline Cu compared with similar tests on coarse-grained cold worked Cu.
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Research context
OpenAlex topics: Microstructure and mechanical properties · Aluminum Alloys Composites Properties · Advanced materials and composites
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
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