journal article·1995-03

Interfacial reaction of alumina with Ag-Cu-Ti alloy

Hao Hongqi, Wang Yonglan, Jin Zhihao, Wang Xiaotian

Journal of Materials Science· Volume 30· Issue 5
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Abstract

No abstract is available for this record. The assistant can identify its topic from the title, but cannot infer the study’s results.

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Research context

OpenAlex topics: Electronic Packaging and Soldering Technologies · Aluminum Alloy Microstructure Properties · Intermetallics and Advanced Alloy Properties

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

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