Characterisation of epoxy/BaTiO3 composites processed by dipping for integral capacitor films (ICF)
Source abstract
Abstract
Polymer composites of epoxy resin and Nb2O5 doped BaTiO3 were prepared in the form of film (thickness 30–300 μm) using a dipping technique. Samples containing various amounts of ceramic filler were examined by thermal analysis and SEM analysis. Dielectric measurements were performed from 20 Hz to 1 MHz and 20 °C to 120 °C. It was found that the final materials had high permittivities increasing with the filler concentration. Electrical relaxations were assigned to interfacial phenomena due to the particles and α-relaxation because of the resin.
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Research context
OpenAlex topics: Dielectric materials and actuators · Ferroelectric and Piezoelectric Materials · Polymer Nanocomposites and Properties
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References (10)
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1. Thongvigitmanee T, May GS (2000) Twenty Sixth IEEE/CPMT. International Electronics Manufacturing Technology, USA, p 47
2. Kuo DH, Chang CC, Su TY, Wang WK, Lin BY (2004) Mat Chem Phys 85:20110.1016/j.matchemphys.2004.01.003 ↗
3. Lee BI, Zhang J (2001) Mat Research Bull 36:106510.1016/S0025-5408(01)00558-X ↗
4. Narayan P, Hancock BC (2003) Mater Sci Eng A 355:2410.1016/S0921-5093(03)00059-5 ↗
5. CHI KAO K (2004) Dielectric Phenomena in Solid, Elsevier Academic Press, p 110
6. Psarras G, Manolakaki E, Tsangaris GM (2002) Comp Part A 33:37510.1016/S1359-835X(01)00117-8 ↗
7. Suzhu Y, Hing P, Xiao H (2000) J App Phys 88:39810.1063/1.373672 ↗
8. Tsangaris G, Psarras GC (1999) J Mat Sci 34:215110.1023/A:1004528330217 ↗
9. Cho SD, Lee JY, Hyun JG, Paik KW (2004) Mat Sci Eng B 110:23310.1016/j.mseb.2004.01.022 ↗
10. Ramajo L, Reboredo MM, Castro MS (2005) Comp Part A 38:126710.1016/j.compositesa.2005.01.026 ↗