journal article·2025-07-22Open access

Field-Free Spin–Orbit Torque-Induced Exchange Bias Switching

Chun-Yi Lin, Tzu-Chien Huang, Tzu-Chuan Hsin, Chi-Feng Pai

ACS Applied Electronic Materials· Volume 7· Issue 14

Abstract

High Resolution Image Download MS PowerPoint Slide The ability to electrically control exchange bias (EB) in antiferromagnet/ferromagnet (AFM/FM) heterostructures is crucial for advancing energy-efficient and multifunctional spintronic devices. In this work, we systematically investigate spin–orbit torque (SOT)-induced EB switching in IrMn-based heterostructures. By tuning the sputtering power during IrMn deposition, we achieve precise control of its (111) texture and demonstrate an enhanced exchange bias field ( H ex ) exceeding 750 Oe. Detailed IrMn thickness-dependent studies further reveal that the EB saturates beyond 10 nm, consistent with the estimated domain wall width, and the SOT switching of EB is governed primarily by interfacial spin interactions. In patterned pillar devices, we demonstrate 100% deterministic SOT-induced EB switching, overcoming signal degradation in crossbar geometries. Furthermore, by introducing a tilted anisotropy through wedged deposition of the bottom Pt layer, we realize robust, field-free SOT-induced perpendicular EB switching. Our findings provide a pathway toward practical AFM-based spintronic memory with scalable and field-free operation.
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Research context

OpenAlex topics: Magnetic properties of thin films · Characterization and Applications of Magnetic Nanoparticles · Quantum and electron transport phenomena

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Department of Materials Science and Engineering

National Taiwan University

Funding

Center of Atomic Initiative for New Materials, National Taiwan University · National Science and Technology Council · Nano-Electro-Mechanical-System Research Center, National Taiwan University · Semiconductor Fabrication Lab of the Consortia of Key Technologies, National Taiwan University

References (55)

Show source-provided references
1. Song, M.; Lee, C.; Yang, S.; Chen, G.; Chen, K.; Wang, I. J.; Hsin, Y.; Chang, K.; Hsu, C.; Li, S. In High speed (1ns) and low voltage (1.5 V) demonstration of 8Kb SOT-MRAM array, 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits); IEEE, 2022; pp 377–378.10.1109/VLSITechnologyandCir46769.2022.9830149 ↗
2. Cai, K.; Van Beek, S.; Rao, S.; Fan, K.; Gupta, M.; Nguyen, V.; Jayakumar, G.; Talmelli, G.; Couet, S.; Kar, G. S. In Selective operations of multi-pillar SOT-MRAM for high density and low power embedded memories, 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits); IEEE, 2022; pp 375–376.10.1109/VLSITechnologyandCir46769.2022.9830307 ↗
3. 10.1109/JSSC.2020.303980010.1109/JSSC.2020.3039800 ↗
4. 10.1038/nnano.2016.1810.1038/nnano.2016.18 ↗
5. 10.1103/RevModPhys.90.01500510.1103/RevModPhys.90.015005 ↗
6. 10.1016/j.physleta.2018.01.00810.1016/j.physleta.2018.01.008 ↗
7. 10.1038/nmat386110.1038/nmat3861 ↗
8. 10.1038/ncomms1398510.1038/ncomms13985 ↗
9. 10.1038/s41467-019-10299-610.1038/s41467-019-10299-6 ↗
10. 10.1063/1.37376410.1063/1.373764 ↗
11. 10.1063/1.35848810.1063/1.358488 ↗
12. 10.1038/s41928-023-00975-310.1038/s41928-023-00975-3 ↗
13. Xiong, D.; Fan, X.; Jiang, C.; Wang, G.; Liu, H.X.; Zhang, H.; Lu, S.; Li, J.; Zhang, H.; Cao, K. In First CMOS-Integrated 128 Kb Antiferromagnet-Based MRAM with Immunity to 3 T Magnetic Fields, 2024 IEEE International Electron Devices Meeting (IEDM); IEEE, 2024; pp 1–4.10.1109/IEDM50854.2024.10873465 ↗
14. 10.1103/PhysRevB.104.13440810.1103/PhysRevB.104.134408 ↗
15. 10.1103/PhysRevMaterials.8.06440710.1103/PhysRevMaterials.8.064407 ↗
16. 10.1103/PhysRevB.107.21440310.1103/PhysRevB.107.214403 ↗
17. 10.1002/adfm.20211240610.1002/adfm.202112406 ↗
18. 10.1016/j.xcrp.2023.10175710.1016/j.xcrp.2023.101757 ↗
19. 10.1038/s41467-024-49214-z10.1038/s41467-024-49214-z ↗
20. 10.1002/adfm.20211165310.1002/adfm.202111653 ↗
21. 10.1038/s41563-019-0289-410.1038/s41563-019-0289-4 ↗
22. 10.1088/1361-6463/ac5b4510.1088/1361-6463/ac5b45 ↗
23. Seshan K. · 2012
24. 10.1016/j.jallcom.2015.06.07710.1016/j.jallcom.2015.06.077 ↗
25. 10.1016/j.apsusc.2012.01.15210.1016/j.apsusc.2012.01.152 ↗
26. 10.1103/PhysRevB.78.04543610.1103/PhysRevB.78.045436 ↗
27. 10.1016/0039-6028(94)90551-710.1016/0039-6028(94)90551-7 ↗
28. 10.1002/aelm.20230047210.1002/aelm.202300472 ↗
29. 10.1103/PhysRevB.98.06441310.1103/PhysRevB.98.064413 ↗
30. 10.1016/j.tsf.2022.13954610.1016/j.tsf.2022.139546 ↗
31. 10.1016/j.jallcom.2011.01.21810.1016/j.jallcom.2011.01.218 ↗
32. 10.1103/PhysRevLett.109.13720110.1103/PhysRevLett.109.137201 ↗
33. 10.1002/adfm.20140165910.1002/adfm.201401659 ↗
34. 10.1002/adma.20140581110.1002/adma.201405811 ↗
35. 10.1126/sciadv.aau669610.1126/sciadv.aau6696 ↗
36. 10.1103/PhysRevB.101.18440310.1103/PhysRevB.101.184403 ↗
37. 10.1088/1361-6528/aaa81210.1088/1361-6528/aaa812 ↗
38. 10.1103/PhysRevB.93.14440910.1103/PhysRevB.93.144409 ↗
39. Chen T.-Y. · Appl. Phys. Lett. · 2020 · 116 · 07240510.1063/1.5133792 ↗
40. 10.1103/PhysRevMaterials.7.10440910.1103/PhysRevMaterials.7.104409 ↗
41. 10.1021/acsmaterialslett.3c0137610.1021/acsmaterialslett.3c01376 ↗
42. 10.1021/acsaelm.1c0123310.1021/acsaelm.1c01233 ↗
43. 10.1038/s41467-020-19511-410.1038/s41467-020-19511-4 ↗
44. Tang D. D. · 202010.1002/9781119562269 ↗
45. 10.1103/PhysRevApplied.15.02405910.1103/PhysRevApplied.15.024059 ↗
46. 10.1103/PhysRevB.89.02441810.1103/PhysRevB.89.024418 ↗
47. 10.1063/5.013999710.1063/5.0139997 ↗
48. 10.1038/s41598-018-23951-w10.1038/s41598-018-23951-w ↗
49. 10.1038/s41928-020-00504-610.1038/s41928-020-00504-6 ↗
50. 10.1038/s41427-023-00521-910.1038/s41427-023-00521-9 ↗
51. 10.1103/physrevb.96.10441210.1103/physrevb.96.104412 ↗
52. 10.1103/PhysRevB.90.18442710.1103/PhysRevB.90.184427 ↗
53. 10.1103/PhysRevApplied.18.03401910.1103/PhysRevApplied.18.034019 ↗
54. 10.1063/1.487028510.1063/1.4870285 ↗
55. 10.1103/PhysRevB.89.18440510.1103/PhysRevB.89.184405 ↗