Microstructure and microtexture in pure copper processed by high-pressure torsion

The evolution of microstructure and microtexture in high purity copper was examined after processing by high-pressure torsion (HPT). Copper disks were annealed for 1 h at 800 °C and later processed monotonously in HPT at ambient temperature for 1/4, 1/2, 1, and 5 turns under a pressure of 6.0 GPa. Electron backscattered diffraction (EBSD) measurements were taken for each disk at three positions: center, mid-radius, and near-edge. Results from EBSD for samples processed between 1/4 and 1 turn indicate the formation of Σ3 twin boundaries by recrystallization before complete microstructural refinement. The results show a gradual increase in the homogeneity of the microstructure with increasing numbers of turns, reaching a stabilized ultrafine-grained structure at 5 turns with a bimodal distribution of fine and coarse grains of 0.15 and 0.5 μm in diameter, respectively. The occurrence of recrystallization in the early straining stages was further supported by examining microtexture development with increasing numbers of turns, where this shows a gradual transition from a shear texture to a mixture of shear and recrystallization and later to a shear texture at high HPT strains. The promotion of recrystallization during HPT is probably related to the high purity of the copper.