journal article·1992

Interfacial reaction product and its effect on the strength of copper to alumina eutectic bonding

Sung Tae Kim, Chong Hee Kim

Journal of Materials Science· Volume 27· Issue 8
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Abstract

No abstract is available for this record. The assistant can identify its topic from the title, but cannot infer the study’s results.

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Research context

OpenAlex topics: MXene and MAX Phase Materials · Advanced ceramic materials synthesis · Copper Interconnects and Reliability

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References (14)

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