Kinetics of intermetallic compound growth between nickel, electroless, Ni-P, electroless Ni-B and tin at 453 to 493 K
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OpenAlex topics: Electronic Packaging and Soldering Technologies · Electrodeposition and Electroless Coatings · Semiconductor materials and interfaces
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References (20)
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20. ?Niposit 65 and Niposit 468 Electroless Nickel? (Shipley Chemicals, Humber Avenue, Coventry, UK) February 1980.