DataVXJournal of Materials SciencePaper
journal article·1992

Adhesion improvement of copper/epoxy joints

H. K. Yun, K. Cho, J. H. An, C. E. Park

Journal of Materials Science· Volume 27· Issue 21
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Abstract

No abstract is available for this record. The assistant can identify its topic from the title, but cannot infer the study’s results.

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Research context

OpenAlex topics: Epoxy Resin Curing Processes · Synthesis and properties of polymers · Mechanical Behavior of Composites

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References (17)

Show source-provided references
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12. E. B. Murphy, A. E. Mason andE. S. Wainwright, ?Durable Copper-Polyimide Adhesive Bonds?, MIT Lincoln Lab, Technical Report no. TR-652 (1983). Bonds?, MIT Lincoln Lab., Technical Report no. TR-652 (1983).
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17. J. M. Park andJ. P. Bell, in ?Proceedings of the Symposium of Adhesive Aspects of Polymer Coating?, edited by Mittal and Kashmiri Lal (Plenum, New York, 1983) p. 205.10.1007/978-1-4613-3658-7_10 ↗