The mechanical properties and microstructures of copper and brass joints soldered with eutectic tin-bismuth solder
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Abstract
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Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Metallurgy and Material Science · Intermetallics and Advanced Alloy Properties
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References (10)
Show source-provided references
1. V. R. Allies, Proceedings National Electronic Packaging Conference, Anaheim, California, 1981 (Kiver Communications, Surbiton, Surrey, 1981) p. 575.
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3. R. J. Klein Wassink, ?Soldering in Electronics? (Electrochemical Publications, Ayr, 1984) p.83.
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6. W. J. Tomlinson andG. A. Cooper,ibid. 21 (1986) 1730.10.1007/BF01114732 ↗
7. F. A. Mohamed andT. G. Langdon,Phil. Mag. 32 (1975) 697.10.1080/14786437508221614 ↗
8. E. Baker,Mater. Sci. Engng. 38 (1979) 241.10.1016/0025-5416(79)90128-9 ↗
9. U. P. Singh andH. D. Merchant,Met. Trans. 4A (1973) 2621.10.1007/BF02644266 ↗
10. A. G. Atkins, A. Silverio andD. Tabor,J. Inst. Metals 44 (1966) 369.