DataVXJournal of Materials SciencePaper
journal article·1988-07

Effects of intermetallic formation at the interface between copper and lead-tin solder

J. O. G. Parent, D. D. L. Chung, I. M. Bernstein

Journal of Materials Science· Volume 23· Issue 7
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Abstract

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Research context

Metals & alloys

OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies · Intermetallics and Advanced Alloy Properties

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (20)

Show source-provided references
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