The debonding and pull-out of ductile wires from a brittle matrix
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Abstract
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Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Mechanical stress and fatigue analysis · 3D IC and TSV technologies
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References (8)
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4. A. Takaku andR. G. C. Arridge,J. Phys. D. 6 (1973) 2038.10.1088/0022-3727/6/17/310 ↗
5. J. Morton and G. W. Groves,J. Mater. Sci. 10 (1975) 170.10.1007/BF00541045 ↗
6. R. N. Swamy andP. S. Mangat,Concrete 8 (1974) 34.
7. V. Laws,J. Phys. D. Appl. Phys. 4 (1971) 1737.10.1088/0022-3727/4/11/318 ↗
8. R. S. Millman andJ. G. Morley,J. Phys. D. 8 (1975) 1065.10.1088/0022-3727/8/9/011 ↗