journal article·1989-12

Study of copper-alumina bonding

C. Beraud, M. Courbiere, C. Esnouf, D. Juve, D. Treheux

Journal of Materials Science· Volume 24· Issue 12
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Abstract

No abstract is available for this record. The assistant can identify its topic from the title, but cannot infer the study’s results.

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Research context

OpenAlex topics: Copper-based nanomaterials and applications · MXene and MAX Phase Materials · Copper Interconnects and Reliability

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References (29)

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