DataVXJournal of Materials SciencePaper
journal article·2025-06

Ni/Zn additions in Sn–Cu solder: enhanced elasticity and reliability via intermetallic strengthening

M. Ragab, A. M. El-Taher, M. Amin, K. B. Mashaly, H. N. Soliman

Journal of Materials Science· Volume 60· Issue 24
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Abstract

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Metals & alloys

OpenAlex topics: Electronic Packaging and Soldering Technologies · Intermetallics and Advanced Alloy Properties · Advanced Welding Techniques Analysis

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References (61)

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