Bismaleimide/epoxy/aromatic diamine ternary resin molding compounds for high-temperature electronic packaging applications
Bibliographic record
Abstract
No abstract is available for this record. The assistant can identify its topic from the title, but cannot infer the study’s results.
Source: Not provided · Quality: missing
Research context
OpenAlex topics: Epoxy Resin Curing Processes · Synthesis and properties of polymers · Fiber-reinforced polymer composites
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (37)
Show source-provided references
1. Casady JB, Johnson RW (1996) Status of silicon carbide (SiC) as a wide-bandgap semiconductor for high-temperature applications: A review. Solid-State Electron 39(10):1409–142210.1016/0038-1101(96)00045-7 ↗
2. Palmer MJ, Johnson RW, Autry T, Aguirre R, Lee V, Scofield JD (2012) Silicon carbide power modules for high-temperature applications. IEEE Trans on Components, Packaging and Manufacturing Technol 2(2):208–21610.1109/TCPMT.2011.2171343 ↗
3. Ouaida R, Berthou M, Brosselard P, Oge S, Bevilacqua P, Joubert C (2015) Investigation of using SiC MOSFET for high temperature applications. EPE Journal 25(2):5–1110.1080/09398368.2015.11835467 ↗
4. Lee H, Smet V, Tummala R (2020) A Review of SiC Power Module Packaging Technologies: Challenges, Advances, and Emerging Issues. IEEE J Emerging and Selected Topics in Power Electronics 8(1):239–25510.1109/JESTPE.2019.2951801 ↗
5. Yao Y, Lu GQ, Boroyevich D, Ngo KDT (2015) Survey of High-Temperature Polymeric Encapsulants for Power Electronics Packaging. IEEE Trans on Components, Packaging and Manufacturing Technol 5(2):168–18110.1109/TCPMT.2014.2337300 ↗
6. Khazaka R, Mendizabal L, Henry D, Hanna R (2015) Survey of High-Temperature Reliability of Power Electronics Packaging Components. IEEE Trans Power Electron 30(5):2456–246410.1109/TPEL.2014.2357836 ↗
7. Gao H, Liu P (2022) High-Temperature Encapsulation Materials for Power Modules: Technology and Future Development Trends. IEEE Trans on Components, Packaging and Manufacturing Technol 12(11):1867–188110.1109/TCPMT.2022.3225960 ↗
8. Zou, Q.; Xie, G.; Lei, G.; Ding, Q.; Zhan, W., Development and Characterization of Epoxy Molding Compound with High Glass Transition Temperature. In 2022 23rd International Conference on Electronic Packaging Technology (ICEPT), 2022: 1–6.10.1109/ICEPT56209.2022.9873223 ↗
9. Tuan, C. C.; Wu, F.; Moon, K. S.; Wong, C. P., Epoxy/Cyanate Ester Copolymer Material for Molding Compounds in High-Temperature Operations. In 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 2017: 1328–1333.10.1109/ECTC.2017.244 ↗
10. Wu, F.; Song, B.; Moon, K. S.; Wong, C. P., Cyanate Ester/Epoxy Co-Curing System with Thermal Stabilizers for High Temperature Stability. In 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018: 2237–2242.10.1109/ECTC.2018.00336 ↗
11. Wu F, Song B, Hah J, Tuan CC, Moon KS, Wong CP (2018) Polyimide incorporated cyanate ester/epoxy copolymers for high-temperature molding compounds. J Polym Sci, Part A: Polym Chem 56(21):2412–242110.1002/pola.29214 ↗
12. Li J, Ren C, An D, Ren Y, Moon KS, Wong CP (2020) Systematic evaluation of cyanate ester/ epoxidized cresol novolac copolymer resin system for high temperature power electronic packaging applications. Polym 195:12245410.1016/j.polymer.2020.122454 ↗
13. Li J, Ren C, Sun Z, Ren Y, Lee H, Moon KS, Wong CP (2021) Melt Processable Novolac Cyanate Ester/Biphenyl Epoxy Copolymer Series with Ultrahigh Glass-Transition Temperature. ACS Appl Mater Interfaces 13(13):15551–1556210.1021/acsami.0c20537 ↗
14. Mou, H.; Lu, Y.; Xie, G., (2017) Study on moisture and thermal resistant epoxy/benzoxazine/phenolic resin molding compound. New Chemical Materials, 45 10 58–59,62
15. Mou H, Xie G, Zhou K, Lu Y (2017) Novel benzoxazine/epoxy/phenolic molding compound and its thermal stability. J Funct Mater 48(3):154–158
16. Huang J, Zhu F, Hu W, Li X, Xie Q, Fei X, Liu J, Li X, Wei W (2024) Phthalonitrile/Epoxy Copolymers Endowing Molding Compounds with High Tg, Low CTE, and Intrinsic Flame Retardancy. Ind Eng Chem Res 63(22):9701–971410.1021/acs.iecr.4c00746 ↗
17. Iredale RJ, Ward C, Hamerton I (2017) Modern advances in bismaleimide resin technology: A 21st century perspective on the chemistry of addition polyimides. Prog Polym Sci 69:1–2110.1016/j.progpolymsci.2016.12.002 ↗
18. Chen B, Yuan L, Guan Q, Liang G, Gu A (2018) Preparation and mechanism of shape memory bismaleimide resins with high transition temperature, high toughness and good processability. J Mater Sci 53:10798–1081110.1007/s10853-018-2367-4 ↗
19. Zhou X, Qiu S, He L, Wang X, Zhu Y, Chu F, Wang B, Song L, Hu Y (2021) Synthesis of star-shaped allyl phosphazene small molecules for enhancing fire safety and toughness of high performance BMI resin. Chem Eng J 425:13065510.1016/j.cej.2021.130655 ↗
20. Li S, Yan H, Feng S, Li X (2016) Phosphorus-containing flame-retardant bismaleimide resin with high mechanical properties. Polym Bull 73(12):3547–355710.1007/s00289-016-1692-5 ↗
21. Zhou X, Qiu S, He L, Cai W, Chu F, Zhu Y, Jiang X, Song L, Hu Y (2022) Bifunctional linear polyphosphazene decorated by allyl groups: Synthesis and application as efficient flame-retardant and toughening agent of bismaleimide. Compos B Eng 233:10965310.1016/j.compositesb.2022.109653 ↗
22. Zhang Z, Li X, Bao Y, Wei W, Li X, Liu X (2021) Bismaleimide resins modified by an allyl ether of bio-based resveratrol with excellent halogen-free and phosphorus-free intrinsic flame retardancy and ultrahigh glass transition temperature. Polym Degrad Stab 193:10971710.1016/j.polymdegradstab.2021.109717 ↗
23. Zhang Z, Zhang K, Xie K, Bao Y, Li X, Huang J, Li X, Wei W (2022) Improvement in toughness and flame retardancy of bismaleimide/diallyl bisphenol A resin with a eugenol allyl ether-grafted polysiloxane. Eur Polymer J 180:11159410.1016/j.eurpolymj.2022.111594 ↗
24. Xie K, Zhang Z, Zhang K, Li X, Bao Y, Huang J, Li X, Liu J, Wei W (2024) Bismaleimide resin co-modified by allyl ether of resveratrol and allyl ether of eugenol-grafted polysiloxane with enhanced toughness, heat resistance, and flame retardancy. bioPolym Adv Technol 35(1):e619110.1002/pat.6191 ↗
25. Vanaja A, Rao RMV (2002) Synthesis and characterisation of epoxy-novolac/bismaleimide networks. Eur Polym J 38(1):187–19310.1016/S0014-3057(01)00094-5 ↗
26. Kim WG, Nam TY (1996) Curing characteristics of o-cresol novolac epoxy resin modified by bismaleimide. J Polym Sci Part a-bioPolym Chem 34(6):957–96210.1002/(SICI)1099-0518(19960430)34:6<957::AID-POLA4>3.0.CO;2-F ↗
27. Jeng RJ, Lo GS, Chen CP, Liu YL, Hsiue GH, Su WC (2003) Enhanced thermal properties and flame retardancy from a thermosetting blend of a phosphorus-containing bismaleimide and epoxy resins. bioPolym Adv Technol 14(2):147–15610.1002/pat.343 ↗
28. Gaina V, Gaina C (2009) New Bismaleimide-Epoxy Resin System. Polym-Plast Technol Eng 48(5):525–52910.1080/03602550902824325 ↗
29. Wang Z, Ran Q, Zhu R, Gu Y (2013) A novel benzoxazine/bismaleimide blend resulting in bi-continuous phase separated morphology. RSC Adv 3(5):1350–135310.1039/C2RA22508E ↗
30. Wang Y, Kou K, Zhuo L, Hong C, Wu G (2015) Thermal, mechanical and dielectric properties of BMI modified by the Bis allyl benzoxazine. J Polym Res 22(4):5110.1007/s10965-015-0695-5 ↗
31. Takeichi T, Saito Y, Agag T, Muto H, Kawauchi T (2008) High-performance polymer alloys of polybenzoxazine and bismaleimide. Poly 49(5):1173–117910.1016/j.polymer.2008.01.041 ↗
32. Fan J, Hu X, Yue CY (2010) Static and dynamic mechanical properties of modified bismaleimide and cyanate ester interpenetrating polymer networks. J Appl Polym Sci 88(8):2000–200610.1002/app.11969 ↗
33. Fan J, Hu X, Yue CY (2003) Dielectric properties of self-catalytic interpenetrating polymer network based on modified bismaleimide and cyanate ester resins. J Poly Sci: Poly Phys 41(11):1123–113410.1002/polb.10445 ↗
34. Fan J, Hu X, Yue CY (2010) Thermal degradation study of interpenetrating polymer network based on modified bismaleimide resin and cyanate ester. Polym Int 52(1):15–2210.1002/pi.962 ↗
35. Li X, Zhou Y, Bao Y, Wei W, Fei X, Li X, Liu X (2022) Bismaleimide/Phenolic/Epoxy Ternary Resin System for Molding Compounds in High-Temperature Electronic Packaging Applications. Ind Eng Chem Res 61(12):4191–420110.1021/acs.iecr.2c00048 ↗
36. Hsieh TH, Su AC (1992) Cure behavior of an epoxy-novolac molding compound. J Appl Polym Sci 44(1):165–17210.1002/app.1992.070440118 ↗
37. Ogata M, Kinjo N, Eguchi S, Hozoji H, Kawata T, Sashima H (1992) Effects of curing accelerators on physical properties of epoxy molding compound (EMC). J Appl Polym Sci 44(10):1795–180510.1002/app.1992.070441012 ↗