The effect of solvents on thermal stability of solder pastes in reflow process
Source abstract
Abstract
In the reflow process, the thermal decomposition of flux with different thermal stability will lead to different residues on printed circuit board assemblies, which will affect the reliability of solder joints. As an essential part of the flux, the solvent is one of the main factors affecting the thermal stability of flux. This paper systematically investigated the effect of solvents on the thermal stability of flux and the corresponding paste. Thermogravimetric analysis and differential scanning calorimetry (TGA–DSC) curves of various solvents showed that the end temperature of weight loss of each solvent is significantly 80–90 °C lower than their boiling points. By mixing solvents and adding other additives, the thermal stability of mixed solvents and flux enhanced due to Raoult’s law. Thus, TGA–DSC curves provided a clear indicator than the boiling point to guide the selection of solvents in the development of solder paste formulation. Also, TGA–DSC curves of flux showed two distinct thermal decomposition stages: solvent volatilization dominated weight loss and then thermal decomposition of rosin and other additives dominated weight loss. In addition, the real-time in situ hot plate soldering experiment and slump test of solder pastes showed that different thermal stability solvents in flux affect the reflow behaviors of solder paste, which is mainly reflected in collapse performance.
Source: expertdata · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Injection Molding Process and Properties · Metallurgical Processes and Thermodynamics
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
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