Performance and reliability of nanoparticle-reinforced lead-free solder composite joints
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OpenAlex topics: Electronic Packaging and Soldering Technologies · Aluminum Alloys Composites Properties · Material Properties and Applications
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References (100+)
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1. Hao X, Xu Z, Gourlay CM et al (2024) Grain refinement of magnesium castings using recycled machining chips. Mater Des 244:11313810.1016/j.matdes.2024.113138 ↗
2. Xian JW, Xu YL, Stoyanov S et al (2024) The role of microstructure in the thermal fatigue of solder joints. Nat Commun 15(1):425810.1038/s41467-024-48532-6 ↗
3. Cui Y, Xian JW, Zois A et al (2023) Nucleation and growth of Ag3Sn in Sn-Ag and Sn-Ag-Cu solder alloys. Acta Mater 249:11883110.1016/j.actamat.2023.118831 ↗
4. Gao H, Liu W, An R et al (2023) In-situ fusion process and Cu–Sn compounds evolution mechanism of nano-intermetallic compound mixed solder joints. J Market Res 26:3506–3523
5. Lehman LP, Xing Y, Bieler TR et al (2010) Cyclic twin nucleation in tin-based solder alloys. Acta Mater 58(10):3546–355610.1016/j.actamat.2010.01.030 ↗
6. Luktuke A, Singaravelu ASS, Mannodi-Kanakkithodi A et al (2023) Influence of Indium addition on microstructural and mechanical behavior of Sn solder alloys: experiments and first principles calculations. Acta Mater 249:11885310.1016/j.actamat.2023.118853 ↗
7. Liashenko OY, Lay S, Hodaj F (2016) On the initial stages of phase formation at the solid Cu/liquid Sn-based solder interface. Acta Mater 117:216–22710.1016/j.actamat.2016.07.021 ↗
8. Huang ML, Zhao JF, Zhang ZJ et al. (2015) Role of diffusion anisotropy in β-Sn in microstructural evolution of Sn-3.0Ag-0.5Cu flip chip bumps undergoing electromigration. Acta Materialia 100: 98–10610.1016/j.actamat.2015.08.037 ↗
9. Zhang ZH, Li MY, Liu ZQ et al. (2016) Growth characteristics and formation mechanisms of Cu6Sn5 phase at the liquid-Sn0.7Cu/(111)Cu and liquid-Sn0.7Cu/(001)Cu joint interfaces. Acta Materialia 104: 1–810.1016/j.actamat.2015.11.034 ↗
10. Keller J, Baither D, Wilke U et al (2011) Mechanical properties of Pb-free SnAg solder joints. Acta Mater 59(7):2731–274110.1016/j.actamat.2011.01.012 ↗
11. Chen C, Hsiao HY, Chang YW et al (2012) Thermomigration in solder joints. Mater Sci Eng R Rep 73(9–10):85–10010.1016/j.mser.2012.11.001 ↗
12. Sun M, Dong M, Wang D et al (2018) Growth behavior of tin whisker on SnAg microbump under compressive stress. Scripta Mater 147:114–11810.1016/j.scriptamat.2018.01.014 ↗
13. Hou Z, Zhao X, Gu Y et al (2022) Enhancement mechanism of Te doping on microstructure, wettability and mechanical properties of Sn-Bi-based solder. Mater Sci Eng A Struct Mater Prop Microstruct Process 848:14344510.1016/j.msea.2022.143445 ↗
14. Huang ML, Zhang ZJ, Zhao N et al (2013) A synchrotron radiation real-time in situ imaging study on the reverse polarity effect in Cu/Sn-9Zn/Cu interconnect during liquid solid electromigration. Scripta Mater 68(11):853–85610.1016/j.scriptamat.2013.02.007 ↗
15. Chen HY, Lin HW, Liu CM et al (2012) Thermomigration of Ti in flip-chip solder joints. Scripta Mater 66(9):694–69710.1016/j.scriptamat.2012.01.020 ↗
16. Zhang L, Tu KN (2014) Structure and properties of lead-free solders bearing micro and nano particles. Mater Sci Eng R Rep 82:1–3210.1016/j.mser.2014.06.001 ↗
17. Li ML, Zhang L, Jiang N et al. (2021) Materials modification of the lead-free solders incorporated with micro/nano-sized particles: a review. Mater Des 197: 10922410.1016/j.matdes.2020.109224 ↗
18. Muhamad ZY, Ezzatul FA, Nor AS et al (2024) Nanoparticle-reinforced solder alloys: a comprehensive review of recent formulation properties, and mechanical performance. J Market Res 32:3682–3707
19. Zhang L, Han JG, Guo YH et al (2015) Creep behavior of SnAgCu solders containing nano-Al particles. J Mater Sci: Mater Electron 26(6):3615–3620
20. Zhang L, Fan XY, Guo YH et al (2014) Microstructures and fatigue life of SnAgCu solder joints bearing Nano-Al particles in QFP devices. Electron Mater Lett 10(3):645–64710.1007/s13391-014-3190-y ↗
21. Sun L, Chen MH, Wei CC, et al. (2018) Effect of thermal cycles on interface and mechanical property of low-Ag Sn1.0Ag0.5Cu(nano-Al)/Cu solder joints. J Mater Sci Mater Electronics 29(12): 9757–976310.1007/s10854-018-9014-3 ↗
22. Yang L, Ma S, Mu G et al (2023) Effect of Ag nanoparticles on microstructure evolution, hardness, and bismuth segregation of SnBi/Cu joint. J Mater Sci: Mater Electron 34(30):2051
23. Li Y, Chan YC (2015) Effect of silver (Ag) nanoparticle size on the microstructure and mechanical properties of Sn58Bi–Ag composite solders. J Alloy Compd 645:566–57610.1016/j.jallcom.2015.05.023 ↗
24. Gain AK, Zhang L (2020) Nanoindentation creep, elastic properties, and shear strength correlated with the structure of Sn-9Zn-0.5nano-Ag alloy for advanced green electronics. Metals 10(9): 113710.3390/met10091137 ↗
25. Shen J, Peng C, Zhao M et al (2012) Microstructural evolutions of the Ag nano-particle reinforced SnBiCu-xAg/Cu solder joints during liquid aging. J Mater Sci Mater Electron 23(7):1409–141410.1007/s10854-011-0606-4 ↗
26. Li W, Mo L, Li X et al (2023) Minor Ag induced shear performance alternation in BGA structure Cu/SnBi/Cu solder joints under electric current stressing. J Market Res 25:6111–6122
27. Yakymovych A, Kaptay G, Roshanghias A, et al. (2016) Enthalpy effect of adding cobalt to liquid Sn-3.8Ag-0.7Cu Lead-free solder alloy: difference between bulk and nanosized cobalt. J Phys Chem C 120(3): 1881–189010.1021/acs.jpcc.5b09445 ↗
28. Sujan GK, Haseeb ASMA, Nishikawa H et al (2017) Interfacial reaction, ball shear strength and fracture surface analysis of lead-free solder joints prepared using cobalt nanoparticle doped flux. J Alloy Compd 695:981–99010.1016/j.jallcom.2016.10.219 ↗
29. Yakymovych A, Plevachuk Y, Svec P, et al. (2017) Nanocomposite SAC solders: morphology, electrical and mechanical properties of Sn-3.8Ag-0.7Cu solders by adding Co nanoparticles. J Mater Sci Mater Electronics 28(15): 10965–1097310.1007/s10854-017-6877-7 ↗
30. Bashir MN, Haseeb ASMA (2022) Grain size stability of interfacial intermetallic compound in Ni and Co nanoparticle-doped SAC305 solder joints under electromigration. J Mater Sci Mater Electron 33(17):14240–1424810.1007/s10854-022-08352-0 ↗
31. Saad HM, Bashir MN (2023) Fractography analysis of Sn-58Bi solder joint after addition of cobalt nanoparticles. J Mater Sci Mater Electron 34(34):223510.1007/s10854-023-11647-5 ↗
32. Bashir MN, Haseeb ASMA, Rahman AZMS et al (2016) Effect of cobalt doping on the microstructure and tensile properties of lead free solder joint subjected to electromigration. J Mater Sci Technol 32(11):1129–113610.1016/j.jmst.2016.09.007 ↗
33. Tay SL, Haseeb ASMA, Rafie Johan M (2011) Addition of cobalt nanoparticles into Sn‐3.8Ag‐0.7Cu lead‐free solder by paste mixing. Solder Surface Mount Technol 23(1): 10–1410.1108/09540911111099659 ↗
34. Bashir MN, Haseeb ASMA, Wakeel S et al (2022) Effect of Ni and Co nanoparticle-doped flux on microstructure of SAC305 solder matrix. J Mater Sci: Mater Electron 33(25):20106–20120
35. Haseeb ASMA, Leng TS (2011) Effects of Co nanoparticle addition to Sn–3.8Ag–0.7Cu solder on interfacial structure after reflow and ageing. Intermetallics 19(5): 707–71210.1016/j.intermet.2011.01.009 ↗
36. Zhang H, Liu Y, Sun F et al (2017) Effects of nano-copper particles on the properties of Sn58Bi composite solder pastes. Microelectron Int 34(1):40–4410.1108/MI-02-2016-0013 ↗
37. Ban GF, Sun FL, Fan JJ et al. (2017) Influence of Cu nanoparticles on microstructure and mechanical properties of Sn0.7Ag0.5Cu-BiNi/Cu Solder joint. J Mater Eng Perform 26(3): 1069–107510.1007/s11665-017-2528-7 ↗
38. Shen L, Tan ZY, Chen Z (2013) Nanoindentation study on the creep resistance of SnBi solder alloy with reactive nano-metallic fillers. Mater Sci Eng, A 561:232–23810.1016/j.msea.2012.10.076 ↗
39. Jung KH, Min KD, Lee CJ et al (2019) Pressureless die attach by transient liquid phase sintering of Cu nanoparticles and Sn-58Bi particles assisted by polyvinylpyrrolidone dispersant. J Alloy Compd 781:657–66310.1016/j.jallcom.2018.12.032 ↗
40. Liu Y, Zhang H, Sun F (2016) Solderability of SnBi-nano Cu solder pastes and microstructure of the solder joints. J Mater Sci Mater Electron 27(3):2235–224110.1007/s10854-015-4016-x ↗
41. Tang Y, Luo SM, Li GY, et al. (2018) Effect of Mn nanoparticles on interfacial intermetallic compound growth in low-Ag Sn-0.3Ag-0.7Cu-xMn solder joints. J Electronic Mater 47(2): 1673–168510.1007/s11664-017-5886-x ↗
42. Rao BSSC, Kumar KM, Kripesh V et al (2011) Tensile deformation behavior of nano-sized Mo particles reinforced SnAgCu solders. Mater Sci Eng, A 528(12):4166–417210.1016/j.msea.2011.01.115 ↗
43. Haseeb ASMA, Arafat MM, Johan MR (2012) Stability of molybdenum nanoparticles in Sn–3.8Ag–0.7Cu solder during multiple reflow and their influence on interfacial intermetallic compounds. Mater Char 64: 27–3510.1016/j.matchar.2011.11.006 ↗
44. Yang L, Zhu L, Zhang Y et al (2019) Microstructure, IMCs layer and reliability of Sn-58Bi solder joint reinforced by Mo nanoparticles during thermal cycling. Mater Charact 148:280–29110.1016/j.matchar.2018.12.012 ↗
45. Sujan GK, Haseeb ASMA, Afifi ABM (2014) Effects of metallic nanoparticle doped flux on the interfacial intermetallic compounds between lead-free solder ball and copper substrate. Mater Charact 97:199–20910.1016/j.matchar.2014.10.002 ↗
46. Yang L, Quan S, Liu C et al (2019) Aging resistance of the Sn-Ag-Cu solder joints doped with Mo nanoparticles. Mater Lett 253:191–19410.1016/j.matlet.2019.06.068 ↗
47. Fouzder T, Li Q, Chan YC et al (2014) Microstructure and kinetic analysis of the properties and behavior of nickel (Ni) nano-particle doped tin–zinc–bismuth (Sn–8Zn–3Bi) solders on immersion silver (Ag)-plated copper (Cu) substrates. J Mater Sci Mater Electron 25(6):2529–253910.1007/s10854-014-1906-2 ↗
48. Gain AK, Zhang L (2019) Effects of Ni nanoparticles addition on the microstructure, electrical and mechanical properties of Sn-Ag-Cu alloy. Materialia 5:10023410.1016/j.mtla.2019.100234 ↗
49. Gan GS, Gan LQ, Guo JZ et al (2018) Ultrasonic-assisted soldering of low-Ag SAC lead-free solder paste at low-temperature. Mater Trans 59(3):359–36610.2320/matertrans.M2017255 ↗
50. Yin Z, Lin M, Huang Y et al. (2020) Effect of doped nano-Ni on microstructure evolution and mechanical behavior of Sn-3.0Ag-0.5Cu (SAC305)/Cu-2.0Be solder joint during isothermal aging. J Mater Eng Performan 29(5): 3315–332310.1007/s11665-020-04838-2 ↗
51. Jiang N, Zhang L, Liu ZQ et al (2019) Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder. J Mater Sci Mater Electron 30(19):17583–1759010.1007/s10854-019-02107-0 ↗
52. Zhang L, Long W, He P et al (2020) Effect of Ti nanoparticles on the microstructure and properties of sn interconnect materials for 3D packaging. Rare Metal Mater Eng 49(12):4336–4340
53. Chen C, Zhang L, Wang X et al (2023) Microstructure and properties of Sn58Bi/Ni solder joint modified by Mg particles. J Market Res 24:514–526
54. Shin JW, Kim I, Choi YW et al (2015) Non-conductive film with Zn-nanoparticles (Zn-NCF) for 40 μm pitch Cu-pillar/Sn-Ag bump interconnection. Microelectron Reliab 55(2):432–44110.1016/j.microrel.2014.10.007 ↗
55. Haseeb ASMA, Leong YM, Arafat MM (2014) In-situ alloying of Sn-3.5Ag solder during reflow through Zn nanoparticle addition and its effects on interfacial intermetallic layers. Intermetallics 54: 86–9410.1016/j.intermet.2014.05.011 ↗
56. Chan YH, Arafat MM, Haseeb ASMA (2013) Effects of reflow on the interfacial characteristics between Zn nanoparticles containing Sn-3.8Ag-0.7Cu solder and copper substrate. Solder Surface Mount Technol 25(2): 91–9810.1108/09540911311309040 ↗
57. Bashir MN, Khan AF, Bashir S et al (2023) Effect of Zn nanoparticle doped flux on electromigration damages in SAC305 solder joint. J Mater Sci Mater Electron 34(5):35110.1007/s10854-022-09646-z ↗
58. Liu GZ, Yue D, Kang Y et al (2021) Effect of nano-Cr particles on solder joint properties of Sn-Zn-Bi-In/Cu brazing. Cailiao Gongcheng J Mater Eng 49(11):163–170
59. Li Y, Luo K, Lim ABY et al. (2016) Improving the mechanical performance of Sn57.6Bi0.4Ag solder joints on Au/Ni/Cu pads during aging and electromigration through the addition of tungsten (W) nanoparticle reinforcement. Mater Sci Eng A 669: 291–30310.1016/j.msea.2016.05.092 ↗
60. Choi H, Kim CL, Sohn Y (2022) Diffusion barrier properties of the intermetallic compound layers formed in the Pt nanoparticles alloyed Sn-58bi solder joints reacted with ENIG and ENEPIG surface finishes. Materials 15(23):841910.3390/ma15238419 ↗
61. Liu Z, Yang L, Xiong Y et al. (2022) Microstructure and Properties of Nb nanoparticles reinforced Sn–0.7Cu solder alloy. J Electronic Packaging 144(1): 01100210.1115/1.4051025 ↗
62. Shafiq I, Chan YC, Wong NB et al (2012) Influence of small Sb nanoparticles additions on the microstructure, hardness and tensile properties of Sn–9Zn binary eutectic solder alloy. J Mater Sci Mater Electron 23(7):1427–143410.1007/s10854-011-0608-2 ↗
63. Li X, Ma Y, Zhou W et al (2017) Effects of nanoscale Cu6Sn5 particles addition on microstructure and properties of SnBi solder alloys. Mater Sci Eng A 684:328–33410.1016/j.msea.2016.12.089 ↗
64. Lv Z, Wang J, Wang F, et al. (2024) Effect of the addition of Cu6Sn5 nanoparticles on the growth of intermetallic compounds at the interfaces of Sn3.0Ag0.5Cu solder joints. Mater Lett 355: 13540710.1016/j.matlet.2023.135407 ↗
65. Min Z, Qiu Y, Hu X, et al. (2019) Effect of Cu6Sn5 nanoparticles size on the properties of Sn0.3Ag0.7Cu nano-composite solders and joints. J Mater Sci Mater Electronics 30(15): 14726–1473510.1007/s10854-019-01844-6 ↗
66. Hu X, Qiu Y, Jiang X, et al. (2018) Effect of Cu6Sn5 nanoparticle on thermal behavior, mechanical properties and interfacial reaction of Sn3.0Ag0.5Cu solder alloys. J Mater Sci Mater Electronics 29(18): 15983–1599310.1007/s10854-018-9684-x ↗
67. Tai F, Guo F, Han MT et al (2010) Creep and thermomechanical fatigue properties of in situ Cu6Sn5 reinforced lead-free composite solder. Mater Sci Eng A 527(15):3335–334210.1016/j.msea.2010.02.048 ↗
68. Yuan P, Chen D, Qin J et al (2023) Effects of Ag3Sn nanoparticles and isothermal aging on IMC layer growth, mechanical properties, and life prediction of SAC305/Cu solder joints. Comp Adv Mater 32:2634983323116360010.1080/09243046.2022.2122766 ↗
69. Wei Y, Liu Y, Tan C et al (2020) Effect of nano-Ag3Sn additions on wettability, interfacial intermetallic growth and mechanical properties of Zn-30Sn-1Ge solders on Cu substrates. J Mater Sci Mater Electron 31(8):5796–580610.1007/s10854-020-03101-7 ↗
70. Mohd Salleh MAA, Bakri AMMA, Hazizi MHZ et al. (2012) Mechanical properties of Sn–0.7Cu/Si3N4 lead-free composite solder. Mater Sci Eng A 556: 633–63710.1016/j.msea.2012.07.039 ↗
71. Chuang TH, Wu MW, Chang SY et al. Strengthening (2011) mechanism of nano-Al2O3 particles reinforced Sn3.5Ag0.5Cu lead-free solder. J Mater Sci Mater Electronics 22(8): 1021–102710.1007/s10854-010-0253-1 ↗
72. Xing WQ, Yu XY, Li H et al (2016) Microstructure and mechanical properties of Sn-9Zn-x Al2O3 nanoparticles (x=0-1) lead-free solder alloy: first-principles calculation and experimental research. Mater Sci Eng A 678:252–25910.1016/j.msea.2016.10.006 ↗
73. Eid EA, El-Basaty AB, Deghady AM et al. (2019)Influence of nano-metric Al2O3 particles addition on thermal behavior, microstructural and tensile characteristics of hypoeutectic Sn-5.0Zn-0.3Cu Pb-free solder alloy. J Mater Sci Mater Electronics 30(4): 4326–433510.1007/s10854-019-00726-1 ↗
74. Yang L, Ge J, Zhang Y et al (2017) Electromigration reliability for Al2O3-reinforced Cu/Sn–58Bi/Cu composite solder joints. J Mater Sci: Mater Electron 28(3):3004–3012
75. Wu J, Xue S, Wang J, et al. (2018) Effects of α-Al2O3 nanoparticles-doped on microstructure and properties of Sn–0.3Ag–0.7Cu low-Ag solder. J Mater Sci Mater Electronics 29(9): 7372–738710.1007/s10854-018-8727-7 ↗
76. Tsao LC, Wu RW, Cheng TH et al. (2013) Effects of nano-Al2O3 particles on microstructure and mechanical properties of Sn3.5Ag0.5Cu composite solder ball grid array joints on Sn/Cu pads. Mater Des 50: 774–78110.1016/j.matdes.2013.03.045 ↗
77. Tsao LC, Chang SY, Lee CI et al. (2010) Effects of nano-Al2O3 additions on microstructure development and hardness of Sn3.5Ag0.5Cu solder. Mater Des 31(10): 4831–483510.1016/j.matdes.2010.04.033 ↗
78. Zhu W, Ma Y, Li X et al (2018) Effects of Al2O3 nanoparticles on the microstructure and properties of Sn58Bi solder alloys. J Mater Sci Mater Electron 29(9):7575–758510.1007/s10854-018-8749-1 ↗
79. Shalaby RM, Elzanaty H (2020) Effect of nano-Al2O3 particles on the microstructure and mechanical performance of melt-spun process Sn–3.5Ag composite solder. J Mater Sci Mater Electronics 31(8): 5907–591310.1007/s10854-019-02821-9 ↗
80. Zhao Z, Liu L, Choi HS et al. (2016) Effect of nano-Al2O3 reinforcement on the microstructure and reliability of Sn–3.0Ag–0.5Cu solder joints. Microelectronics Reliab 60: 126–13410.1016/j.microrel.2016.03.005 ↗
81. Hu T, Li Y, Chan YC et al (2015) Effect of nano Al2O3 particles doping on electromigration and mechanical properties of Sn–58Bi solder joints. Microelectron Reliab 55(8):1226–123310.1016/j.microrel.2015.05.008 ↗
82. Mehrabi K, Khodabakhshi F, Zareh E et al (2016) Effect of alumina nanoparticles on the microstructure and mechanical durability of meltspun lead-free solders based on tin alloys. J Alloy Compd 688:143–15510.1016/j.jallcom.2016.06.296 ↗
83. Al-Sorory H, Gumaan MS, Shalaby RM (2023) Effect of Al2O3 nanoparticle addition on the microstructure, mechanical, thermal, and electrical properties of melt-spun SAC355 lead-free solder for electronic packaging. J Mater Eng Perform 32(19):8600–861110.1007/s11665-022-07752-x ↗
84. Tikale S, Prabhu KN (2020) Development of low-silver content SAC0307 solder alloy with Al2O3 nanoparticles. Mater Sci Eng A 787:13943910.1016/j.msea.2020.139439 ↗
85. Chen G, Huang B, Liu H, et al. (2016) An investigation of microstructure and properties of Sn3.0Ag0.5Cu-XAl 2 O 3 composite solder. Solder Surf Mount Technol 28(2): 84–9210.1108/SSMT-08-2015-0027 ↗
86. Sun L, Zhang L, Zhang Y, et al. (2022) Interfacial reaction and properties of Sn0.3Ag0.7Cu containing nano-TiN solder joints. J Mater Sci Mater Electronics 33(6): 3320–333010.1007/s10854-021-07532-8 ↗
87. Yang L, Wei D, Zhang Y et al (2019) Effect of aging temperature on microstructure and mechanical properties of Sn–9Zn–xZrC solder joints. J Mater Sci Mater Electron 30(1):753–75910.1007/s10854-018-0344-y ↗
88. Lu X, Zhang L, Guo YH et al (2023) Study on the dual inhibition behavior of interfacial IMCs in Cu/SAC105/Cu joint by adopting SiC nanowires and nanocrystalline Cu substrate. J Market Res 25:3754–3767
89. El-Daly AA, Fawzy A, Mansour SF et al. (2013) Thermal analysis and mechanical properties of Sn–1.0Ag–0.5Cu solder alloy after modification with SiC nano-sized particles. J Mater Sci Mater Electronics 24(8): 2976–298810.1007/s10854-013-1200-8 ↗
90. El-Daly AA, Al-Ganainy GS, Fawzy A et al. (2014) Structural characterization and creep resistance of nano-silicon carbide reinforced Sn–1.0Ag–0.5Cu lead-free solder alloy. Mater Des 55: 837–84510.1016/j.matdes.2013.10.043 ↗
91. Wang X, Liu YC, Wei C et al. (2009) Strengthening mechanism of SiC-particulate reinforced Sn–3.7Ag–0.9Zn lead-free solder. J Alloys Comp, 480(2): 662–66510.1016/j.jallcom.2009.02.002 ↗
92. El-Daly A , Fawzy A, Mansour SF et al. (2013) Novel SiC nanoparticles-containing Sn–1.0Ag–0.5Cu solder with good drop impact performance. Mater Sci Eng A 578: 62–7110.1016/j.msea.2013.04.022 ↗
93. Pal MK, Gergely G, Koncz-Horváth D et al. (2021) Investigation of microstructure and wetting behavior of Sn–3.0Ag–0.5Cu (SAC305) lead-free solder with additions of 1.0 wt % SiC on copper substrate. Intermetallics 128: 10699110.1016/j.intermet.2020.106991 ↗
94. Yin L, Zhang Z, Su Z et al. (2021) Interfacial microstructure evolution and properties of Sn-0.3Ag-0.7Cu–xSiC solder joints. Mater Sci Eng A 809: 14099510.1016/j.msea.2021.140995 ↗
95. Li ML, Gao LL, Zhang L et al (2021) Interfacial evolution of pure Sn solder bearing silicon carbide nanowires under isothermal aging and thermal cycling. J Market Res 15:3974–3982
96. Li ML, Zhang L, Jiang N et al (2021) Influences of silicon carbide nanowires’ addition on IMC growth behavior of pure Sn solder during solid–liquid diffusion. J Mater Sci Mater Electron 32(13):18067–1807510.1007/s10854-021-06348-w ↗
97. Skwarek A, Illés B, Górecki P et al (2023) Influence of SiC reinforcement on microstructural and thermal properties of SAC0307 solder joints. J Market Res 22:403–412
98. Pal MK, Gergely G, Gácsi Z (2023) Growth kinetics and IMCs layer analysis of SAC305 solder with the reinforcement of SiC during the isothermal aging condition. J Market Res 24:8320–8331
99. Illés B, Michałowski PP, Skwarek A et al (2024) Dispersion and incorporation of TiO2 and SiC nano-particles in SAC alloy: SIMS and DFT study. Scripta Mater 243:11598710.1016/j.scriptamat.2024.115987 ↗
100. Pal MK, Gergely G, Koncz-Horvath D et al (2020) Characterization of the interface between ceramics reinforcement and lead-free solder matrix. Surfaces Interfaces 20:10057610.1016/j.surfin.2020.100576 ↗