High-speed electrolyte jet 3D printing of ultrasmooth and robust Cu microelectrodes
Source abstract
Abstract
Abstract Electrochemical 3D printing technology built on computer numerical control platforms has enabled multi-dimensional and multi-scale manufacturing of various metal materials through layered electrochemical deposition. Compared to thermal 3D printing technology, electrolyte meniscus-confined 3D printing can manufacture Cu microstructures with fewer defects and smoother surfaces. In the meantime, it is still susceptible to unstable liquid–solid-air interfaces, low deposition rates, and limited printing geometry. This work combined jet electrochemical deposition with a portable 3-axis platform to develop a cyclic high-speed electrolyte jet (HSEJ) 3D printer. It offers a faster deposition rate of 53.4 µm/h when printing ultrasmooth Cu microelectrodes with surface average roughness down to 1.1 nm and microhardness of 3.3 GPa which is much higher than the best result of 2.4 GPa obtained by the other ECD methods. It is identified that the fluctuation of cathode current density plays a crucial role in defining the nucleation morphology on the Cu surface, while the cathode current efficiency is a reliable indicator to assess the deposition localization by reflecting the variation of diffusion percentage. HSEJ 3D printing provides a sustainable pathway for the facile recycling of waste cables into high-grade metal microelectronics with controllable surface morphology and 3D dimensions. Graphical Abstract
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Nanomaterials and Printing Technologies · Additive Manufacturing and 3D Printing Technologies · Electrodeposition and Electroless Coatings
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (63)
Show source-provided references
1. Flowers PF, Reyes C, Ye S, Kim MJ, Wiley BJ (2017) 3D printing electronic components and circuits with conductive thermoplastic filament. Addit Manuf 18:156–163
2. Ikeshoji T-T, Nakamura K, Yonehara M, Imai K, Kyogoku H (2018) Selective laser melting of pure copper. JOM 70:396–40010.1007/s11837-017-2695-x ↗
3. Kang JS, Kim HS, Ryu J, Thomas Hahn H, Jang S, Joung JW (2010) Inkjet printed electronics using copper nanoparticle ink. J Mater Sci Mater Electron 21:1213–122010.1007/s10854-009-0049-3 ↗
4. Wu S-Y, Yang C, Hsu W, Lin L (2015) 3D-printed microelectronics for integrated circuitry and passive wireless sensors. Microsyst Nanoeng 1:1501310.1038/micronano.2015.13 ↗
5. Lee KG, Park KJ, Seok S, Shin S, Kim DH, Park JY, Heo YS, Lee SJ, Lee TJ (2014) 3D printed modules for integrated microfluidic devices. RSC Adv 4:32876–3288010.1039/C4RA05072J ↗
6. Zhou X, Guo W, Fu J, Zhu Y, Huang Y, Peng P (2019) Laser writing of Cu/CuxO integrated structure on flexible substrate for humidity sensing. Appl Surf Sci 494:684–69010.1016/j.apsusc.2019.07.159 ↗
7. DebRoy T, Wei HL, Zuback JS, Mukherjee T, Elmer JW, Milewski JO, Beese AM, Wilson-Heid A, De A, Zhang W (2018) Additive manufacturing of metallic components—process, structure and properties. Prog Mater Sci 92:112–22410.1016/j.pmatsci.2017.10.001 ↗
8. Tsai C-Y, Chang W-C, Chen G-L, Chung C-H, Liang J-X, Ma W-Y, Yang T-N (2015) A study of the preparation and properties of antioxidative copper inks with high electrical conductivity. Nanoscale Res Lett 10:35710.1186/s11671-015-1069-y ↗
9. Goto I, Kurosawa K, Matsuki T (2022) Effect of 3D-printed sand molds on the soundness of pure copper castings in the vicinity of as-cast surfaces. J Manuf Process 77:329–33810.1016/j.jmapro.2022.03.020 ↗
10. German RM (2016) Sintering trajectories: description on how density, surface area, and grain size change. JOM 68:878–88410.1007/s11837-015-1795-8 ↗
11. Jun HY, Lee EJ, Ryu SO (2020) Synthesis and characterization of copper ink and direct printing of copper patterns by inkjet printing for electronic devices. Curr Appl Phys 20:853–86110.1016/j.cap.2020.04.003 ↗
12. Salea A, Prathumwan R, Junpha J, Subannajui K (2017) Metal oxide semiconductor 3D printing: preparation of copper(ii) oxide by fused deposition modelling for multi-functional semiconducting applications. J Mater Chem C 5:4614–462010.1039/C7TC00990A ↗
13. Yu J, Sun X, Tong X, Zhang J, Li J, Li S, Liu Y, Tsubaki N, Abe T, Sun J (2021) Ultra-high thermal stability of sputtering reconstructed Cu-based catalysts. Nat Commun 12:720910.1038/s41467-021-27557-1 ↗
14. Amadine O, Essamlali Y, Fihri A, Larzek M, Zahouily M (2017) Effect of calcination temperature on the structure and catalytic performance of copper–ceria mixed oxide catalysts in phenol hydroxylation. RSC Adv 7:12586–1259710.1039/C7RA00734E ↗
15. Hu J, Yu M-F (2010) Meniscus-confined three-dimensional electrodeposition for direct writing of wire bonds. Science 329:313–31610.1126/science.1190496 ↗
16. Wang Y, Chen Y-L, Wang Y, Ju B-F (2020) A method for micropipette-based meniscus-confined electrodeposition of microstructures without nozzle clogging. Nanomanufactur Metrol 3:77–8210.1007/s41871-020-00058-3 ↗
17. Hengsteler J, Mandal B, van Nisselroy C, Lau GPS, Schlotter T, Zambelli T, Momotenko D (2021) Bringing electrochemical three-dimensional printing to the nanoscale. Nano Lett 21:9093–910110.1021/acs.nanolett.1c02847 ↗
18. Chen X, Liu X, Childs P, Brandon N, Wu B (2017) A low cost desktop electrochemical metal 3D printer. Adv Mater Technol 2:170014810.1002/admt.201700148 ↗
19. Zhang X, Yuan L, Lei Y, Zhang Y, Li Y, Nie W, Gao Q, Li Z, Sun A, Liu F, Cheng Y, Xu G, Guo J (2021) Electrochemical gradients driven 3D printing of nano-twinned copper structures by direct current dynamic meniscus confined electrodeposition. Appl Mater Today 24:10113810.1016/j.apmt.2021.101138 ↗
20. Xu J, Xu Z, Ren W, Zou Z, Wang X (2022) Simulation and experimental study on metal microstructure of meniscus-confined electrodeposition. Adv Eng Mater 24(12):220065410.1002/adem.202200654 ↗
21. Seol SK, Kim D, Lee S, Kim JH, Chang WS, Kim JT (2015) Electrodeposition-based 3D printing of metallic microarchitectures with controlled internal structures. Small 11:3896–390210.1002/smll.201500177 ↗
22. Kunieda M, Katoh R, Mori Y (1998) Rapid prototyping by selective electrodeposition using electrolyte jet. CIRP Ann 47:161–16410.1016/S0007-8506(07)62808-X ↗
23. Wang K, Yan Y, Zhou P, Zhang C, Kang R, Guo D (2020) Preparation of flat and smooth copper surface by jet electrochemical machining and electrochemical polishing. J Electrochem Soc 167:16350110.1149/1945-7111/abcbb2 ↗
24. Kim H, Kim JG, Park JW, Chu CN (2018) Selective copper metallization of nonconductive materials using jet-circulating electrodeposition. Precis Eng 51:153–15910.1016/j.precisioneng.2017.08.005 ↗
25. Lian L, Wang H, Dong D, He G (2018) Highly robust and ultrasmooth copper nanowire electrode by one-step coating for organic light-emitting diodes. J Mater Chem C 6:9158–916510.1039/C8TC02937G ↗
26. Kim YJ, Lim A, Kim JM, Lim D, Chae KH, Cho EN, Han HJ, Jeon KU, Kim M, Lee GH, Lee GR, Ahn HS, Park HS, Kim H, Kim JY, Jung YS (2020) Highly efficient oxygen evolution reaction via facile bubble transport realized by three-dimensionally stack-printed catalysts. Nat Commun 11:492110.1038/s41467-020-18686-0 ↗
27. Dong Y, Min X, Kim WS (2018) A 3-D-printed integrated PCB-based electrochemical sensor system. IEEE Sens J 18:2959–296610.1109/JSEN.2018.2801459 ↗
28. Rajput MS, Pandey PM, Jha S (2015) Modelling of high speed selective jet electrodeposition process. J Manuf Process 17:98–10710.1016/j.jmapro.2014.07.012 ↗
29. Fan H, Zhao YP, Wang SK (2016) Technical study of jet electrodeposition in manufacture of metal parts. Key Eng Mater 667:259–26410.4028/www.scientific.net/KEM.667.259 ↗
30. Xinchao L, Pingmei M, Xinmin Z, Wei W, Yanhua Z, Ge Q, Xingshuai Z, Shen N (2020) Compressed air-film encircling jet electrodeposition with high deposition accuracy. J Electrochem Soc 167:10250210.1149/1945-7111/ab971d ↗
31. Chen X, Chen J, Saxena KK, Zhu J, Gu X, Guo Z (2022) Localization of jet electrochemical additive manufacturing with a liquid confinement technique. J Manuf Process 81:48–6410.1016/j.jmapro.2022.06.053 ↗
32. Ibañez A, Fatás E (2005) Mechanical and structural properties of electrodeposited copper and their relation with the electrodeposition parameters. Surf Coat Technol 191:7–1610.1016/j.surfcoat.2004.05.001 ↗
33. Lee P-T, Chang C-H, Lee C-Y, Wu Y-S, Yang C-H, Ho C-E (2021) High-speed electrodeposition for Cu pillar fabrication and Cu pillar adhesion to an Ajinomoto build-up film (ABF). Mater Des 206:10983010.1016/j.matdes.2021.109830 ↗
34. Ning D, Yang C, Wu H (2019) Ultrafast Cu2+ recovery from waste water by jet electrodeposition. Sep Purif Technol 220:217–22110.1016/j.seppur.2019.03.059 ↗
35. Xiao Y, Ming P, Zhang X, Hou Y, Du L, Li S, Zhang Y, Song J (2022) Ultrahigh strength ultrapure nanostructured nickel metal prepared via ultrafine anode scanning electrodeposition. Mater Des 213:11033910.1016/j.matdes.2021.110339 ↗
36. Zhang Y, Ming P, Xue B, Liu H, Yang X, Li L, Niu S, Yan L, Zheng X, Qin G (2023) Facilely fabricating large-area robust heterogeneous wettability surface by mask-patterned ultrafine anode scanning electrodeposition for efficient water collection. Surf Interfaces 41:10324710.1016/j.surfin.2023.103247 ↗
37. Lei Y, Zhang X, Xu D, Yu M, Yi Z, Li Z, Sun A, Xu G, Cui P, Guo J (2018) Dynamic “Scanning-Mode” meniscus confined electrodepositing and micropatterning of individually addressable ultraconductive copper line arrays. J Phys Chem Lett 9:2380–238710.1021/acs.jpclett.8b00636 ↗
38. Majidi MR, Asadpour-Zeynali K, Hafezi B (2009) Reaction and nucleation mechanisms of copper electrodeposition on disposable pencil graphite electrode. Electrochim Acta 54:1119–112610.1016/j.electacta.2008.08.035 ↗
39. Rosa-Ortiz SM, Khorramshahi F, Takshi A (2019) Study the impact of CuSO4 and H2SO4 concentrations on lateral growth of hydrogen evolution assisted copper electroplating. J Appl Electrochem 49:1203–121010.1007/s10800-019-01359-2 ↗
40. Looijmans SFSP, Cavallo D, Yu L, Peters GWM (2018) Cross-nucleation between polymorphs: quantitative modeling of kinetics and morphology. Cryst Growth Des 18:3921–392610.1021/acs.cgd.8b00254 ↗
41. Ibl NI, Schadegg K (1967) Surface roughness effects in the electrodeposition of copper in the limiting current range. J Electrochem Soc 114:5410.1149/1.2426474 ↗
42. Grujicic D, Pesic B (2002) Electrodeposition of copper: the nucleation mechanisms. Electrochim Acta 47:2901–291210.1016/S0013-4686(02)00161-5 ↗
43. Augustin A, Huilgol P, Udupa KR, Bhat U (2016) Effect of current density during electrodeposition on microstructure and hardness of textured Cu coating in the application of antimicrobial Al touch surface. J Mech Behav Biomed Mater 63:352–36010.1016/j.jmbbm.2016.07.013 ↗
44. Natter H, Hempelmann R (1996) Nanocrystalline copper by pulsed electrodeposition: the effects of organic additives, bath temperature, and pH. J Phys Chem 100:19525–1953210.1021/jp9617837 ↗
45. Todaro CJ, Easton MA, Qiu D, Zhang D, Bermingham MJ, Lui EW, Brandt M, StJohn DH, Qian M (2020) Grain structure control during metal 3D printing by high-intensity ultrasound. Nat Commun 11:14210.1038/s41467-019-13874-z ↗
46. Wang Y, Wang Y-T, Li R-D, Niu P-D, Wang M-B, Yuan T-C, Li K (2021) Hall-Petch relationship in selective laser melting additively manufactured metals: using grain or cell size? J Cent South Univ 28:1043–105710.1007/s11771-021-4678-x ↗
47. Naik SN, Walley SM (2020) The Hall-Petch and inverse Hall-Petch relations and the hardness of nanocrystalline metals. J Mater Sci 55:2661–268110.1007/s10853-019-04160-w ↗
48. Ghassemali E, Tan M-J, Wah CB, Lim SCV, Jarfors AEW (2015) Effect of cold-work on the Hall-Petch breakdown in copper based micro-components. Mech Mater 80:124–13510.1016/j.mechmat.2014.10.003 ↗
49. Hakamada M, Nakamoto Y, Matsumoto H, Iwasaki H, Chen Y, Kusuda H, Mabuchi M (2007) Relationship between hardness and grain size in electrodeposited copper films. Mater Sci Eng A 457:120–12610.1016/j.msea.2006.12.101 ↗
50. Conrad H, Narayan J (2000) On the grain size softening in nanocrystalline materials. Scripta Mater 42:1025–103010.1016/S1359-6462(00)00320-1 ↗
51. Carlton CE, Ferreira PJ (2007) What is behind the inverse Hall-Petch effect in nanocrystalline materials? Acta Mater 55:3749–375610.1016/j.actamat.2007.02.021 ↗
52. Schuh CA, Nieh TG (2003) Hardness and abrasion resistance of nanocrystalline nickel alloys near the hall-petch breakdown regime. MRS Online Proc Libr 740:1810.1557/PROC-740-I1.8 ↗
53. Ko W-Y, Chen W-H, Tzeng S-D, Gwo S, Lin K-J (2006) Synthesis of pyramidal copper nanoparticles on gold substrate. Chem Mater 18:6097–609910.1021/cm062360c ↗
54. Chen L, Tang C, Jiao Y, Qiao S-Z (2021) Anomalous C−C coupling on under-coordinated Cu (111): a case study of Cu nanopyramids for CO2 reduction reaction by molecular modelling. Chemsuschem 14:671–67810.1002/cssc.202002036 ↗
55. Chen L, Tang C, Davey K, Zheng Y, Jiao Y, Qiao S-Z (2021) Spatial-confinement induced electroreduction of CO and CO2 to diols on densely-arrayed Cu nanopyramids. Chem Sci 12:8079–808710.1039/D1SC01694F ↗
56. Chen L, Tang C, Zheng Y, Skúlason E, Jiao Y (2022) C3 production from CO2 reduction by concerted *CO trimerization on a single-atom alloy catalyst. J Mater Chem A 10:5998–600610.1039/D1TA09608G ↗
57. Zhang F, Liu S, Wang F (2022) Nucleation and growth mechanism in the early stages of nickel coating in jet electrodeposition: a coarse-grained molecular simulation and experimental study. RSC Adv 12:11052–1105910.1039/D1RA08926A ↗
58. Filzwieser A, Hein K, Mori G (2002) Current density limitation and diffusion boundary layer calculation using CFD method. JOM 54:28–3110.1007/BF02701653 ↗
59. Chen X, Gu X, Saxena KK, Arshad MH, Huang J, Reynaerts D (2023) Enhancing shape precision in jet electrochemical additive micro-manufacturing process through confined electrolyte. Precis Eng 84:69–8010.1016/j.precisioneng.2023.07.007 ↗
60. Ye P, Niu Q, Wang F (2023) Effect of electrolyte composition and deposition voltage on the deposition rate of copper microcolumns jet electrodeposition. Mater Sci Eng B 298:11685710.1016/j.mseb.2023.116857 ↗
61. Bocking C, Cameron DB (1994) The use of high speed selective jet electrodeposition of gold for the plating of connectors. Trans IMF 72:33–4010.1080/00202967.1994.11871019 ↗
62. Chen Y, Wen X, Li H, Zhu F, Fang C, Li Z, Zhou Z, Jiang W (2023) Effects of deposition current density, time and scanning velocity on scanning jet electrodeposition of Ni-Co alloy coating. J Manuf Process 101:458–46810.1016/j.jmapro.2023.06.020 ↗
63. Song Z, Zhang H, Fu X, Lin J, Shen M, Wang Q, Duan S (2020) Effect of current density on the performance of Ni–P–ZrO2–CeO2 composite coatings prepared by jet-electrodeposition. Coatings 10:61610.3390/coatings10070616 ↗