journal article·2024-06

Preparation of polyimide bond-linked covalent organic frameworks as resin-compatible nanofillers for copper clad laminates with improved thermal and electrical performances

He Sun, Cheng Wang, Xiao Zhang, Fengwei Wang

Journal of Materials Science· Volume 59· Issue 21
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Abstract

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OpenAlex topics: Covalent Organic Framework Applications · Conducting polymers and applications · Advanced Photocatalysis Techniques

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