Superstable, High-Conductivity Cu Conductive Adhesive
Source abstract
Abstract
Materials with high conductivity and low cost are urgently required for electronic products, particularly copper conductive adhesives. Developing reliable copper conductive adhesives (ECAs) remains a great challenge due to their low conductivity and easy oxidation. In this article, copper microflakes with surface passivation by formate ions and thiols were used to create an antioxidant copper adhesive. We demonstrate that the surface modification has no impact on the electrical conductivities, even in salt spray, acid, alkaline, high temperature, and humidity conditions. After being cured at 250 °C for 30 min, the produced Cu ECAs displayed an ultralow resistivity of 65.12 μΩ·cm –1 . Excellent stability enables its resistance to maintain a low level after 1000 h of aging at 200 °C and 85%RH 85 °C. This study establishes the enormous potential of Cu ECAs with antioxidants for low-cost microelectronics packaging.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Nanomaterials and Printing Technologies · Electronic Packaging and Soldering Technologies · Advanced Sensor and Energy Harvesting Materials
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
College of Optoelectronic Engineering and Key Laboratory of Optoelectronic Technology & Systems Education Ministry of China, Chongqing University, 400044 Chongqing, China
School of Electrical Engineering and State Key Laboratory of Power Transmission Equipment & System Security and New Technology, Chongqing University, 400044 Chongqing, China
Funding
National Natural Science Foundation of China · Guangxi Key Laboratory of Optoelectronic Information Processing, Guilin University of Electronic Technology
References (40)
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