Effects of ultrasonic vibration-assisted machining methods on the surface polishing of silicon carbide
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OpenAlex topics: Advanced Surface Polishing Techniques · Advanced machining processes and optimization · Advanced Machining and Optimization Techniques
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References (45)
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1. Zhang K, Yin Z, Dai C, Miao Q (2022) Material removal mechanism of SiC ceramics by elliptic ultrasonic vibration-assisted grinding (EUVAG) using single grain. Ceram Int 49:10041–10055. https://doi.org/10.1016/j.ceramint.2022.11.18410.1016/j.ceramint.2022.11.184 ↗
2. Henry H, Zorman C, Mehregany M, Roukes M (2003) Nanodevice motion at microwave frequencies. Nature 421:496. https://doi.org/10.1038/421496a10.1038/421496a ↗
3. Hyung-Soo M, Dongwon C, Mark S et al (2004) Development of Si–SiC hybrid structures for elevated temperature micro-turbomachinery. J Microelectromech Syst: A Jt IEEE ASME Publ Microstruct Microact Microsens Microsyst 13:676–687. https://doi.org/10.1109/JMEMS.2004.83218210.1109/JMEMS.2004.832182 ↗
4. Odesanya K, Onik T, Ahmad R, Andriyana A et al (2022) Physical and electrical characteristics of Ho2O3 thin film based on 4H–SiC wide bandgap semiconductor. Thin Solid Film 741:138997. https://doi.org/10.1016/J.TSF.2021.13899710.1016/J.TSF.2021.138997 ↗
5. Zhan S, Lu J, Zhao Y et al (2022) Observation and modulation of gas film and plasma behavior in electrolytic plasma hybrid etching of semiconductor material 4H–SiC. Precis Eng 3:403–413. https://doi.org/10.1016/J.PRECISIONENG.2021.12.00510.1016/J.PRECISIONENG.2021.12.005 ↗
6. Mehran M, Christian A (1999) SiC MEMS: opportunities and challenges for applications in harsh environments. Thin Solid Film 355(1999):518–524. https://doi.org/10.1016/S0257-8972(99)00374-610.1016/S0257-8972(99)00374-6 ↗
7. Enya K, Yamada N, Imai T, Tange Y et al (2011) High-precision CTE measurement of hybrid C/SiC composite for cryogenic space telescopes. Cryogenics 52:86–89. https://doi.org/10.1016/j.cryogenics.2011.10.00410.1016/j.cryogenics.2011.10.004 ↗
8. Ciampi C, Pasquali G, Altana C et al (2019) Nuclear fragment identification with ΔE-E telescopes exploiting silicon carbide detectors. Nucl Inst Methods Phys Res A 925:60–69. https://doi.org/10.1016/j.nima.2019.01.08510.1016/j.nima.2019.01.085 ↗
9. Carrapichano J, Gomes J, Oliveira F et al (2003) Si3N4 and Si3N4/SiC composite rings for dynamic sealing of circulating fluids. Wear 255:695–698. https://doi.org/10.1016/S0043-1648(03)00118-210.1016/S0043-1648(03)00118-2 ↗
10. Chen X, Xu X, Hu X, Li J et al (2007) Anisotropy of chemical mechanical polishing in silicon carbide substrates. Mater Sci Eng, B 142:28–30. https://doi.org/10.1016/j.mseb.2007.06.01510.1016/j.mseb.2007.06.015 ↗
11. Yang Z, Zhu L, Zhang G, Ni C et al (2020) Review of ultrasonic vibration-assisted machining in advanced materials. Int J Mach Tools Manuf 156:103594. https://doi.org/10.1016/j.ijmachtools.2020.10359410.1016/j.ijmachtools.2020.103594 ↗
12. Ma Z, Wang Q, Chen H et al (2022) A grinding force predictive model and experimental validation for the laser-assisted grinding (LAG) process of zirconia ceramic. J Mater Process Technol 302:117492. https://doi.org/10.1016/j.jmatprotec.2022.11749210.1016/j.jmatprotec.2022.117492 ↗
13. Chen X, Xu S, Ahuir-Torres J et al (2023) Acceleration mechanism of abrasive particle in ultrasonic polishing under synergistic physical vibration and cavitation: numerical study. Ultrason Sonochem 101:106713. https://doi.org/10.1016/j.ultsonch.2023.10671310.1016/j.ultsonch.2023.106713 ↗
14. Ding W, Cao Y, Zhao B, Xu J (2022) Status and prospects of research on ultrasonic vibration-assisted grinding technology and equipment. J Mech Eng 58(2022):244–269. https://doi.org/10.3901/JME.2022.09.24410.3901/JME.2022.09.244 ↗
15. Li L, He Q, Zheng M, Liu Z (2015) Contribution of ultrasonic traveling wave to chemical–mechanical polishing. Ultrasonics 56:530–538. https://doi.org/10.1016/j.ultras.2014.10.00610.1016/j.ultras.2014.10.006 ↗
16. Han L, Zhang J, Chen J et al (2020) Influence of vibration parameters on ultrasonic elliptical vibration cutting of reaction-bonded silicon carbide. Int J Adv Manuf Technol 108(2020):27–437. https://doi.org/10.1007/s00170-020-05420-910.1007/s00170-020-05420-9 ↗
17. Xu W, Cheng Y et al (2019) Effects of process parameters on chemical-mechanical interactions during sapphire polishing. Microelectron Eng 216:11029. https://doi.org/10.1016/j.mee.2019.11102910.1016/j.mee.2019.111029 ↗
18. Pillai R, Borg MK, Reese JM (2018) Dynamics of nanodroplets on vibrating surfaces. Langmuir 34(39):11898–11904. https://doi.org/10.1021/acs.langmuir.8b0206610.1021/acs.langmuir.8b02066 ↗
19. Choi J, Feurer T, Yamaguchi M, Paxton B, Nelson K (2005) Generation of ultrahigh-frequency tunable acoustic waves. Appl Phys Lett 87:081907. https://doi.org/10.1063/1.203258910.1063/1.2032589 ↗
20. Ivry Y, Wang N, Durkan C (2014) High-frequency programmable acoustic wave device realized through ferroelectric domain engineering. Appl Phys Lett 104:133505. https://doi.org/10.1063/1.486982310.1063/1.4869823 ↗
21. Shilton R, Travagliati M, Beltram F et al (2014) Nanoliter-droplet acoustic streaming via ultra high frequency surface acoustic waves. Adv Mater 26:4941–4946. https://doi.org/10.1002/adma.20140009110.1002/adma.201400091 ↗
22. Matsuda O, Wright O (2014) Frontiers in Optical Methods. Springer 180:129–151
23. Chen X, Zhang C, Meng F et al (2023) Polishing mechanism analysis of silicon carbide ceramics combined ultrasonic vibration and hydroxyl. Tribol Int 179:108187. https://doi.org/10.1016/j.triboint.2022.10818710.1016/j.triboint.2022.108187 ↗
24. Peng Y, Liang Z, Wu Y, Guo Y (2012) Effect of vibration on surface and tool wear in ultrasonic vibration-assisted scratching of brittle materials. The Int J Adv Manuf Technol 59(2012):67–72. https://doi.org/10.1007/s00170-011-3473-510.1007/s00170-011-3473-5 ↗
25. Chen X, Liang Y, Cui Z et al (2022) Study on material removal mechanism in ultrasonic chemical assis-ted polishing of silicon carbide. J Manuf Process 84:1463–1477. https://doi.org/10.1016/j.jmapro.2022.11.01410.1016/j.jmapro.2022.11.014 ↗
26. Lokanath P, Ravindra P (2022) Mechanical properties of 2D materials: a review on molecular dynamics based nanoindentation simulations. Mater Today Commun 31:103623. https://doi.org/10.1016/j.mtcomm.2022.10362310.1016/j.mtcomm.2022.103623 ↗
27. Huang Y, Zhou Y, Li J, Zhu F (2023) Understanding the role of surface mechanical properties in SiC s-urface machining. Mater Sci Semicond Process 163:107594. https://doi.org/10.1016/j.mssp.2023.10759410.1016/j.mssp.2023.107594 ↗
28. Dai H, Hu Y, Wu W, Yue H, Meng X, Li P, Duan H (2021) Molecular dynamics simulation of ultra-precision machining 3C-SiC assisted by ion implantation. J Manuf Process 69:398–411. https://doi.org/10.1016/j.jmapro.2021.07.05510.1016/j.jmapro.2021.07.055 ↗
29. Yu D, Zhan H, Feng X et al (2022) Molecular Dynamics Analysis of 6H-SiC Subsurface Damage by Nanofriction. ACS Omega 7(21):18168–18178. https://doi.org/10.1021/acsomega.2c0211510.1021/acsomega.2c02115 ↗
30. Xu W, Sheng C, Zhong M (2022) Effects of ultrasonic vibration on sapphire polishing investigated by molecular dynamics. Tribol Int 176:107911. https://doi.org/10.1016/j.triboint.2022.10791110.1016/j.triboint.2022.107911 ↗
31. Steve P (1995) Fast Parallel Algorithms for Short-Range Molecular Dynamics. J Comput Phys 117:1–19. https://doi.org/10.1006/jcph.1995.103910.1006/jcph.1995.1039 ↗
32. Lin Z, Huang J, Jeng Y (2007) 3D nano-scale cutting model for nickel material. J Mater Process Technol 192–193:27–36. https://doi.org/10.1016/j.jmatprotec.2007.04.07410.1016/j.jmatprotec.2007.04.074 ↗
33. Tersoff J (1989) Modeling solid-state chemistry: interatomic potentials for multicomponent systems. Phys Rev B 39:5566–5568. https://doi.org/10.1103/PhysRevB.39.556610.1103/PhysRevB.39.5566 ↗
34. Yan H, Hu X, Hannes J (1994) Atomic structure of β-SiC(100) surfaces: a study using the Tersoff potential. Surf Sci 316:181–188. https://doi.org/10.1016/0039-6028(94)91138-X10.1016/0039-6028(94)91138-X ↗
35. Tersoff J (1994) Chemical order in amorphous silicon carbide. Phys Rev B Condens Matter 49:16349–16352. https://doi.org/10.1103/PhysRevB.49.1634910.1103/PhysRevB.49.16349 ↗
36. Lindsay L, Broido D (2010) Optimized Tersoff and Brenner empirical potential parameters for lattice dynamics and phonon thermal transport in carbon nanotubes and graphene. Phys Rev B Condens Matter Mater Phys 81:205441. https://doi.org/10.1103/PhysRevB.81.20544110.1103/PhysRevB.81.205441 ↗
37. Liu Y, Li B, Kong L (2018) A molecular dynamics investigation into nanoscale scratching mechanism of polycrystalline silicon carbide. Comput Mater Sci 148:76–86. https://doi.org/10.1016/j.commatsci.2018.02.03810.1016/j.commatsci.2018.02.038 ↗
38. Morse P (1929) Diatomic molecules according to the wave mechanics. II Vib Lev Phys Rev 34(1929):57. https://doi.org/10.1103/PhysRev.34.5710.1103/PhysRev.34.57 ↗
39. Zarudi I, Cheong W, Zou J et al (2004) Atomistic structure of monocrystalline silicon in surface nano-modification. Nanotechnology 15:104–107. https://doi.org/10.1088/0957-4484/15/1/02010.1088/0957-4484/15/1/020 ↗
40. Kim Y, Choi S, Lee S, Kim J (2004) An atomic simulation of AFM-based nano lithography process for nano patterning. Springer, Netherlands 115:331–341. https://doi.org/10.1007/978-1-4020-2111-4_3210.1007/978-1-4020-2111-4_32 ↗
41. Hemmen JV (1980) A generalized equipartition theorem. Phys Lett A 79:25–28. https://doi.org/10.1016/0375-9601(80)90307-210.1016/0375-9601(80)90307-2 ↗
42. Zhao Q, Sun Z, Guo B (2016) Material removal mechanism in ultrasonic vibration assisted polishing of micro cylindrical surface on SiC. Int J Mach Tools Manuf 103:28–39. https://doi.org/10.1016/j.ijmachtools.2016.01.00310.1016/j.ijmachtools.2016.01.003 ↗
43. Belkhir N, Bouzid D, Herold V (2009) Determination of the friction coefficient during glass polishing. Tribol Lett 33:55–61. https://doi.org/10.1007/s11249-008-9391-510.1007/s11249-008-9391-5 ↗
44. Goel S, Kovalchenko A, Stukowski A et al (2016) Influence of microstructure on the cutting behaviour of silicon. Acta Mater 105:464–478. https://doi.org/10.1016/j.actamat.2015.11.04610.1016/j.actamat.2015.11.046 ↗
45. Pan Y, Bao Y et al (2023) Study on tool wear mechanism of single-crystal diamond in ultrasonic vibration elliptical cutting of tungsten heavy alloy. Wear 516–517:204616. https://doi.org/10.1016/j.wear.2022.20461610.1016/j.wear.2022.204616 ↗