DataVXJournal of Materials SciencePaper
journal article·2023-10Open access

Antioxidative copper sinter bonding under thermal aging utilizing reduction of cuprous oxide nanoparticles by polyethylene glycol

Tomoki Matsuda, Seigo Yamada, Shio Okubo, Akio Hirose

Journal of Materials Science· Volume 58· Issue 40
Publisher pageOpen full text
Source abstract

Abstract

Abstract Durability of sintered Cu joints under thermal aging in the air was investigated for the reduction of Cu2O using Cu2O/polyethylene glycol (PEG) mixture. Thermal analysis of the Cu2O/PEG paste showed that the molecular weight of PEG influences the redox reaction and the subsequent bonding related to the combustion of the reducing organic solvent. Sintered Cu joints using PEG 400 exhibited high joint strength (above 30 MPa) in shear tests, even for the bonding temperature of 280 °C. The sintered Cu joints exhibited slightly increased strength during thermal aging at 250 °C in air, which was also confirmed by the microscale tensile test used for evaluating the fracture behavior of the sintered Cu structure. Microstructural analysis, including the evaluation of the crystal orientation, revealed a small change in the microstructure of sintered joints during aging. Transmission electron microscopy revealed the presence of organic membranes on slightly oxidized sintered Cu grains before thermal aging, and additional oxidation was observed after thermal aging. The progress of sintering during thermal aging in vacuum was different than that in air. It was considered that the formation of a thin Cu2O layer, controlled by the presence of organic membranes, contributed to the suppression of Cu sintering. Graphical abstract
Source: crossref · Quality: baseline

Research context

Ceramics & glassesNanomaterials

OpenAlex topics: Electronic Packaging and Soldering Technologies · Advanced materials and composites · Copper Interconnects and Reliability

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (47)

Show source-provided references
1. Chalker PR (1999) Wide bandgap semiconductor materials for high temperature electronics. Thin Solid Films 343–344:616–622. https://doi.org/10.1016/S0040-6090(98)01672-110.1016/S0040-6090(98)01672-1 ↗
2. Ide E, Angata S, Hirose A, Kobayashi KF (2005) Metal–metal bonding process using Ag metallo-organic nanoparticles. Acta Mater 53:2385–2393. https://doi.org/10.1016/j.actamat.2005.01.04710.1016/j.actamat.2005.01.047 ↗
3. Bai JG, Lu G-Q (2006) Thermomechanical reliability of low-temperature sintered silver die attached SiC power device assembly. IEEE Trans Device Mater Reliab 6:436–441. https://doi.org/10.1109/TDMR.2006.88219610.1109/TDMR.2006.882196 ↗
4. Li J, Li X, Wang L et al (2018) A novel multiscale silver paste for die bonding on bare copper by low-temperature pressure-free sintering in air. Mater Des 140:64–72. https://doi.org/10.1016/j.matdes.2017.11.05410.1016/j.matdes.2017.11.054 ↗
5. Chen C, Suganuma K, Iwashige T et al (2018) High-temperature reliability of sintered microporous Ag on electroplated Ag, Au, and sputtered Ag metallization substrates. J Mater Sci Mater Electron 29:1785–1797. https://doi.org/10.1007/s10854-017-8087-810.1007/s10854-017-8087-8 ↗
6. Roh MH, Nishikawa H, Tsutsumi S et al (2017) Effect of temperature and substrate on shear strength of the joints formed by sintering of micro-sized Ag particle paste without pressure. J Mater Sci Mater Electron 28:7292–7301. https://doi.org/10.1007/s10854-017-6414-810.1007/s10854-017-6414-8 ↗
7. Hsiao CH, Kung WT, Song JM et al (2017) Development of Cu–Ag pastes for high temperature sustainable bonding. Mater Sci Eng A 684:500–509. https://doi.org/10.1016/j.msea.2016.12.08410.1016/j.msea.2016.12.084 ↗
8. Jia Q, Zou G, Wang W et al (2020) Sintering mechanism of a supersaturated Ag–Cu nanoalloy film for power electronic packaging. ACS Appl Mater Interfaces 12:16743–16752. https://doi.org/10.1021/acsami.9b2073110.1021/acsami.9b20731 ↗
9. Chen TF, Siow KS (2021) Comparing the mechanical and thermal-electrical properties of sintered copper (Cu) and sintered silver (Ag) joints. J Alloys Compd 866:158783. https://doi.org/10.1016/j.jallcom.2021.15878310.1016/j.jallcom.2021.158783 ↗
10. Gao Y, Takata S, Chen C et al (2019) Reliability analysis of sintered Cu joints for SiC power devices under thermal shock condition. Microelectron Reliab 100–101:113456. https://doi.org/10.1016/j.microrel.2019.11345610.1016/j.microrel.2019.113456 ↗
11. Lee CJ, Kang DG, Hwang BU et al (2021) Fabrication of an IPL-sintered Cu circuit and its electrochemical migration behavior. J Alloys Compd 863:158726. https://doi.org/10.1016/j.jallcom.2021.15872610.1016/j.jallcom.2021.158726 ↗
12. Xie J, Shen J, Deng J, Chen X (2020) Influence of aging atmosphere on the thermal stability of low-temperature rapidly sintered Cu nanoparticle paste joint. J Electron Mater 49:2669–2676. https://doi.org/10.1007/s11664-020-07951-z10.1007/s11664-020-07951-z ↗
13. Koga S, Nishikawa H, Saito M, Mizuno J (2020) Fabrication of nanoporous Cu sheet and application to bonding for high-temperature applications. J Electron Mater 49:2151–2158. https://doi.org/10.1007/s11664-019-07916-x10.1007/s11664-019-07916-x ↗
14. Gao Y, Jiu J, Chen C et al (2022) Oxidation-enhanced bonding strength of Cu sinter joints during thermal storage test. J Mater Sci Technol 115:251–255. https://doi.org/10.1016/j.jmst.2021.10.04710.1016/j.jmst.2021.10.047 ↗
15. Lin SK, Nagao S, Yokoi E et al (2016) Nano-volcanic eruption of silver. Sci Rep 6:34769. https://doi.org/10.1038/srep3476910.1038/srep34769 ↗
16. Gao R, He S, Li J et al (2020) Interfacial transformation of preoxidized Cu microparticles in a formic-acid atmosphere for pressureless Cu–Cu bonding. J Mater Sci Mater Electron 31:14635–14644. https://doi.org/10.1007/s10854-020-04026-x10.1007/s10854-020-04026-x ↗
17. Huang HJ, Wu X, Zhou MB, Zhang XP (2021) Superior strength and strengthening mechanism of die attachment joints by using bimodal-sized Cu nanoparticle paste capable of low-temperature pressureless sintering. J Mater Sci Mater Electron 32:3391–3401. https://doi.org/10.1007/s10854-020-05086-910.1007/s10854-020-05086-9 ↗
18. Datta KKR, Kulkarni C, Eswaramoorthy M (2010) Aminoclay: a permselective matrix to stabilize copper nanoparticles. Chem Commun 46:616–618. https://doi.org/10.1039/b919421e10.1039/b919421e ↗
19. Jin M, Zhang H, Wang J et al (2012) Copper can still be epitaxially deposited on palladium nanocrystals to generate core–shell nanocubes despite their large lattice mismatch. ACS Nano 6:2566–2573. https://doi.org/10.1021/nn205027810.1021/nn2050278 ↗
20. Shi L, Wang R, Zhai H et al (2015) A long-term oxidation barrier for copper nanowires: graphene says yes. Phys Chem Chem Phys 17:4231–4236. https://doi.org/10.1039/c4cp05187d10.1039/c4cp05187d ↗
21. Chu CR, Lee C, Koo J, Lee HM (2016) Fabrication of sintering-free flexible copper nanowire/polymer composite transparent electrodes with enhanced chemical and mechanical stability. Nano Res 9:2162–2173. https://doi.org/10.1007/s12274-016-1105-y10.1007/s12274-016-1105-y ↗
22. Lian L, Dong D, Wang H, He G (2019) Highly reliable copper nanowire electrode with enhanced transmittance and robustness for organic light emitting diodes. Org Electron 65:70–76. https://doi.org/10.1016/j.orgel.2018.11.00210.1016/j.orgel.2018.11.002 ↗
23. Zhang T, Daneshvar F, Wang S, Sue HJ (2019) Synthesis of oxidation-resistant electrochemical-active copper nanowires using phenylenediamine isomers. Mater Des 162:154–161. https://doi.org/10.1016/j.matdes.2018.11.04310.1016/j.matdes.2018.11.043 ↗
24. Taher A, Kim DW, Lee IM (2017) Highly efficient metal organic framework (MOF)-based copper catalysts for the base-free aerobic oxidation of various alcohols. RSC Adv 7:17806–17812. https://doi.org/10.1039/c6ra28743c10.1039/c6ra28743c ↗
25. Liu J, Chen H, Ji H, Li M (2016) Highly conductive Cu–Cu joint formation by low-temperature sintering of formic acid-treated Cu nanoparticles. ACS Appl Mater Interfaces 8:33289–33298. https://doi.org/10.1021/acsami.6b1028010.1021/acsami.6b10280 ↗
26. Gao Y, Li W, Chen C et al (2018) Novel copper particle paste with self-reduction and self-protection characteristics for die attachment of power semiconductor under a nitrogen atmosphere. Mater Des 160:1265–1272. https://doi.org/10.1016/j.matdes.2018.11.00310.1016/j.matdes.2018.11.003 ↗
27. Hirose A, Tatsumi H, Takeda N et al (2009) A novel metal-to-metal bonding process through in-situ formation of Ag nanoparticles using Ag2O microparticles. J Phys Conf Ser 165:012074. https://doi.org/10.1088/1742-6596/165/1/01207410.1088/1742-6596/165/1/012074 ↗
28. Asama K, Matsuda T, Ogura T et al (2017) Materials science and engineering a low-temperature metal-to-alumina direct bonding process utilizing redox reaction between silver oxide and organic agent. Mater Sci Eng A 702:398–405. https://doi.org/10.1016/j.msea.2017.07.03410.1016/j.msea.2017.07.034 ↗
29. Motoyama K, Matsuda T, Sano T, Hirose A (2018) AlN-to-metal direct bonding process utilizing sintering of Ag nanoparticles derived from the reduction of Ag2O. J Electron Mater 47:5780–5787. https://doi.org/10.1007/s11664-018-6504-210.1007/s11664-018-6504-2 ↗
30. Matsuda T, Inami K, Motoyama K et al (2018) Silver oxide decomposition mediated direct bonding of silicon-based materials. Sci Rep 8:10472. https://doi.org/10.1038/s41598-018-28788-x10.1038/s41598-018-28788-x ↗
31. Yao T, Matsuda T, Sano T et al (2018) In situ study of reduction process of CuO paste and its effect on bondability of Cu-to-Cu joints. J Electron Mater 47:2193–2197. https://doi.org/10.1007/s11664-017-6049-910.1007/s11664-017-6049-9 ↗
32. Yonezawa T, Tsukamoto H, Matsubara M (2015) Low-temperature nanoredox two-step sintering of gelatin nanoskin-stabilized submicrometer-sized copper fine particles for preparing highly conductive layers. RSC Adv 5:61290–61297. https://doi.org/10.1039/c5ra06599b10.1039/c5ra06599b ↗
33. Yamagiwa D, Matsuda T, Furusawa H et al (2021) Pressureless sinter joining of bare Cu substrates under forming gas atmosphere by surface-oxidized submicron Cu particles. J Mater Sci Mater Electron 32:19031–19041. https://doi.org/10.1007/s10854-021-06418-z10.1007/s10854-021-06418-z ↗
34. Unutulmazsoy Y, Cancellieri C, Lin L, Jeurgens LPH (2022) Reduction of thermally grown single-phase CuO and Cu2O thin films by in-situ time-resolved XRD. Appl Surf Sci 588:152896. https://doi.org/10.1016/j.apsusc.2022.15289610.1016/j.apsusc.2022.152896 ↗
35. Matsuda T, Yamada S, Takeuchi A et al (2021) Fracture behavior of thermally aged Ag–Cu composite sinter joint through microscale tensile test coupled with nano X-ray computed tomography. Mater Des 206:109818. https://doi.org/10.1016/j.matdes.2021.10981810.1016/j.matdes.2021.109818 ↗
36. Matsuda T, Seo R, Hirose A (2023) Highly strong interface in Ag/Si sintered joints obtained through Ag2O–Ag composite paste. Mater Sci Eng A 865:144647. https://doi.org/10.1016/j.msea.2023.14464710.1016/j.msea.2023.144647 ↗
37. Watanabe T, Takesue M, Matsuda T et al (2020) Thermal stability and characteristic properties of pressureless sintered Ag layers formed with Ag nanoparticles for power device applications. J Mater Sci Mater Electron 31:17173–17182. https://doi.org/10.1007/s10854-020-04265-y10.1007/s10854-020-04265-y ↗
38. Choudhary S, Sarma JVN, Pande S et al (2018) Oxidation mechanism of thin Cu films: a gateway towards the formation of single oxide phase. AIP Adv. https://doi.org/10.1063/1.502840710.1063/1.5028407 ↗
39. Wang X, Zhang Z, Feng Y, Xiao F (2022) Anti-oxidative copper nanoparticle paste for Cu–Cu bonding at low temperature in air. J Mater Sci Mater Electron 33:817–827. https://doi.org/10.1007/s10854-021-07352-w10.1007/s10854-021-07352-w ↗
40. Mou Y, Liu J, Cheng H et al (2019) Facile preparation of self-reducible Cu nanoparticle paste for low temperature Cu–Cu bonding. JOM 71:3076–3083. https://doi.org/10.1007/s11837-019-03517-510.1007/s11837-019-03517-5 ↗
41. Zuo Y, Shen J, Hu Y, Gao R (2018) Improvement of oxidation resistance and bonding strength of Cu nanoparticles solder joints of Cu–Cu bonding by phosphating the nanoparticle. J Mater Process Technol 253:27–33. https://doi.org/10.1016/j.jmatprotec.2017.11.00110.1016/j.jmatprotec.2017.11.001 ↗
42. Kim D, Lee S, Chen C et al (2021) Fracture mechanism of microporous Ag-sintered joint in a GaN power device with Ti/Ag and Ni/Ti/Ag metallization layer at different thermo-mechanical stresses. J Mater Sci 56:9852–9870. https://doi.org/10.1007/s10853-021-05924-z10.1007/s10853-021-05924-z ↗
43. Hong KT, Imadojemu H, Webb RL (1994) Effects of oxidation and surface roughness on contact angle. Exp Therm Fluid Sci 8:279–285. https://doi.org/10.1016/0894-1777(94)90058-210.1016/0894-1777(94)90058-2 ↗
44. Nam Y, Ju YS (2013) A comparative study of the morphology and wetting characteristics of micro/nanostructured Cu surfaces for phase change heat transfer applications. J Adhes Sci Technol 27:2163–2176. https://doi.org/10.1080/01694243.2012.69778310.1080/01694243.2012.697783 ↗
45. Shi JL (1999) Thermodynamics and densification kinetics in solid-state sintering of ceramics. J Mater Res 14:1398–1408. https://doi.org/10.1557/JMR.1999.019010.1557/JMR.1999.0190 ↗
46. Abdeljawad F, Bolintineanu DS, Cook A et al (2019) Sintering processes in direct ink write additive manufacturing: a mesoscopic modeling approach. Acta Mater 169:60–75. https://doi.org/10.1016/j.actamat.2019.01.01110.1016/j.actamat.2019.01.011 ↗
47. Hussein O, Alghalayini M, Dillon SJ, Abdeljawad F (2021) Unraveling the role of grain boundary anisotropy in sintering: implications for nanoscale manufacturing. ACS Appl Nano Mater 4:8039–8049. https://doi.org/10.1021/acsanm.1c0132210.1021/acsanm.1c01322 ↗