Epoxy/ copper-nickel metal foam composites with high thermal conductivity using an electroplating method
Source abstract
Abstract
Simply filling the metal foam as a thermally conductive filler into the polymer matrix can improve the thermal conductivity of the polymer matrix, but it still cannot greatly improve the thermal conductivity of the composites. In this paper, the epoxy resin/copper foam-nickel (EP/CF-Ni) composite thermal conductive material was prepared by a combination of electroplating and vacuum liquid impregnation. The deposition of nickel increases the heat dissipation area of the copper foam and at the same time widens the heat conduction path of the materials. By comparing EP/CF with different pores and EP/CF-Ni with different deposition times, it was found that the thermal conductivity of EP/CF-Ni composites could reach 5.215 W/(mK) at 7.3 wt% nickel deposition, which enhanced 2507% and 75% compared to pure epoxy and copper foam matrix composites, respectively. The deposition of nickel further improves the wear resistance of the composite. This experiment reveals the synergistic effect of thermal conductivity of metallic Ni and 3D copper foam, and provides some reference opinions for the field of thermal conductivity of metallic foam.
Source: expertdata · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Thermal properties of materials · Tribology and Wear Analysis · Composite Material Mechanics
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (34)
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