Microstructure of mullite ceramics used for substrate and packaging applications
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OpenAlex topics: Microwave Dielectric Ceramics Synthesis · Ferroelectric and Piezoelectric Materials · Advanced ceramic materials synthesis
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References (12)
Show source-provided references
1. B. Schwartz, in ?Electronic Ceramics?, edited by L. M. Levinson (Marcel Dekker, New York, 1988) Ch. 1, pp. 1?44.
2. Y. Hamano andM. Terasawa, in ?Electronic Packaging Materials Science II?, edited by K. A. Jackson, R. C. Pohanha, D. R. Uhlmann and D. R. Ulrich, Materials Research Society Symposia Proceedings 72(MRS, Palo Alto, CA, 1986) pp. 3?13.
3. D. P. Seraphim, R. Laski andC. Li, ?Principles of Electronic Packaging? (McGraw-Hill, New York, 1989) pp. 282?332.
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5. E. A. Giess, J. M. Roldan, P. J. Bailey andE. Goo, in ?Ceramic Transactions?, Vol. 15, edited by K. M. Nair, R. Pohanka and R. C. Buchanan (American Ceramic Society, Westerville, OH, 1990).
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11. F. J. Klug andS. Prochazka,ibid. 70 (1988) 750.10.1111/j.1151-2916.1987.tb04875.x ↗
12. A. J. Skoog andR. E. Moore,Bull. Amer. Ceram. Soc. 67 (1988) 1180.