Joining of SiO2 glass and 316L stainless steel using Bi–Ag-based active solders
Source abstract
Abstract
Abstract Active brazing is a commonly used method for joining dissimilar materials with at least one non-metallic component. In the present study, joining of SiO2 glass to 316L stainless steel was performed utilizing Bi–Ag-based solders. Ti up to a concentration of 4 and Mg up to 1 wt.% were added as active elements. Microstructures of the solder alloys in the as-cast state and of cross sections of the joined compounds were analysed using scanning electron microscopy and energy-dispersive X-ray spectroscopy. In the as-cast state of the solder, Ti is found in Bi–Ti intermetallic phases; Mg is partially dissolved in the fcc-(Ag) phase and additionally contained in a ternary Ag-Bi-Mg phase. After soldering, a tight joint was generated using several alloy compositions. Ti leads to the formation of reaction products at the steel/solder and glass/solder interfaces, and Mg is exclusively accumulated at the glass/solder interface.
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Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Intermetallics and Advanced Alloy Properties · 3D IC and TSV technologies
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References (67)
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