A novel approach to obtain low-dielectric materials: changing curing mechanism of bismaleimide–triazine resin with ZIF-8

A zinc-based metal organic framework containing imidazole (ZIF-8) was prepared by the reflux method and blended with bismaleimide–triazine resin (BT resin) to prepare ZIF-8/BT nanocomposites. The research results showed that ZIF-8 had a significant catalytic effect on the curing process of BT resin. With the increase in the content of ZIF-8, the curing temperature of BT resin continuously reduced. It was attributed to synergetic catalysis from Zn2+ and imidazole in ZIF-8 to the self-polymerization of cyanate esters at low temperature, which changed the curing process of BT resin. Meanwhile, ZIF-8 was also well dispersed in BT resin, which increased the initial modulus and toughness of BT resin. Besides, due to the introduction of nanopores, the formation of triazine rings and the increase in the free volume, ZIF-8 could effectively reduce the dielectric constant of BT resin while maintain good heat resistance and moisture resistance. Therefore, ZIF-8 not only introduced nanopores, but also changed the cross-linking structure of BT resin to obtain ultra-low content of low-dielectric materials, which provides a new way to obtain a new generation of low-dielectric materials.