Grain boundary character distribution in electroplated nanotwinned copper
Source abstract
Abstract
The grain boundary character distribution (GBCD) of nanotwinned copper, fabricated by electroplating inside small-scale through-wafer vias, was characterized using a stereological interpretation of electron backscatter diffraction maps. The GBCD of electroplated nanotwinned copper, specified by five macroscopic parameters (three for the lattice misorientation and two for the grain boundary plane inclination), is similar to the GBCD of coarse-grained polycrystalline copper used here as a reference material. The GBCD was compared to calculated grain boundary energies determined from atomistic simulations. We find that the grain boundary population in the electroplated nanotwinned and coarse-grained reference copper is both on average inversely correlated to the grain boundary energies. The slopes of the relationships between grain boundary population and energy for the most highly populated misorientations (Σ3, Σ9, and Σ11) are different. The relationships are strongly influenced by the geometric constraints at the triple junctions and multiple twinning, which enhanced the observed frequencies of Σ9 boundaries. The results suggest that the grain boundary network and the GBCD in the polycrystalline specimens are strongly influenced by the microstructure, grain boundary energy, and multiple twining.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Microstructure and mechanical properties · Electrodeposition and Electroless Coatings · Copper Interconnects and Reliability
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (100+)
Show source-provided references
1. Rohrer GS, Saylor DM, Dasher BE et al (2004) The distribution of internal interfaces in polycrystals. Z Für Met 95:197–214. doi: 10.3139/146.01793410.3139/146.017934 ↗
2. Saylor DM, El-Dasher BS, Adams BL, Rohrer GS (2004) Measuring the five-parameter grain-boundary distribution from observations of planar sections. Metall Mater Trans A 35:1981–1989. doi: 10.1007/s11661-004-0147-z10.1007/s11661-004-0147-z ↗
3. Kim C-S, Rollett AD, Rohrer GS (2006) Grain boundary planes: new dimensions in the grain boundary character distribution. Scr Mater 54:1005–1009. doi: 10.1016/j.scriptamat.2005.11.07110.1016/j.scriptamat.2005.11.071 ↗
4. Sutton AP, Balluffi RW (1995) Interfaces in crystalline materials. Clarendon, Oxford
5. Watanabe T (2011) Grain boundary engineering: historical perspective and future prospects. J Mater Sci 46:4095–4115. doi: 10.1007/s10853-011-5393-z10.1007/s10853-011-5393-z ↗
6. Rohrer GS, Randle V (2009) Measurement of the five-parameter grain boundary distribution from planar sections. In: Schwartz AJ, Kumar M, Adams BL, Field DP (eds) Electron backscatter diffraction in materials science. Springer, Berlin, pp 215–22910.1007/978-0-387-88136-2_16 ↗
7. Zhao Y, Cheng IC, Kassner ME, Hodge AM (2014) The effect of nanotwins on the corrosion behavior of copper. Acta Mater 67:181–188. doi: 10.1016/j.actamat.2013.12.03010.1016/j.actamat.2013.12.030 ↗
8. Lu L, Shen Y, Chen X et al (2004) Ultrahigh strength and high electrical conductivity in copper. Science 304:422–426. doi: 10.1126/science.109290510.1126/science.1092905 ↗
9. Xu L, Dixit P, Miao J et al (2007) Through-wafer electroplated copper interconnect with ultrafine grains and high density of nanotwins. Appl Phys Lett 90:033111. doi: 10.1063/1.243228410.1063/1.2432284 ↗
10. Zhang X, Wang H, Chen XH et al (2006) High-strength sputter-deposited Cu foils with preferred orientation of nanoscale growth twins. Appl Phys Lett 88:173116. doi: 10.1063/1.219848210.1063/1.2198482 ↗
11. Gertsman VY, Bruemmer SM (2001) Study of grain boundary character along intergranular stress corrosion crack paths in austenitic alloys. Acta Mater 49:1589–1598. doi: 10.1016/S1359-6454(01)00064-710.1016/S1359-6454(01)00064-7 ↗
12. Wen YH, Peng HB, Raabe D et al (2014) Large recovery strain in Fe–Mn–Si-based shape memory steels obtained by engineering annealing twin boundaries. Nat Commun 5:4964. doi: 10.1038/ncomms596410.1038/ncomms5964 ↗
13. Palumbo G, Lehockey EM, Lin P (1998) Applications for grain boundary engineered materials. JOM 50:40–43. doi: 10.1007/s11837-998-0248-z10.1007/s11837-998-0248-z ↗
14. Bieler TR, Eisenlohr P, Roters F et al (2009) The role of heterogeneous deformation on damage nucleation at grain boundaries in single phase metals. Int J Plast 25:1655–1683. doi: 10.1016/j.ijplas.2008.09.00210.1016/j.ijplas.2008.09.002 ↗
15. Herbig M, Raabe D, Li YJ et al (2014) Atomic-Scale Quantification of grain boundary segregation in nanocrystalline material. Phys Rev Lett 112:126103. doi: 10.1103/PhysRevLett.112.12610310.1103/PhysRevLett.112.126103 ↗
16. Randle V (2006) “Special” boundaries and grain boundary plane engineering. Scr Mater 54:1011–1015. doi: 10.1016/j.scriptamat.2005.11.05010.1016/j.scriptamat.2005.11.050 ↗
17. Saylor DM, Morawiec A, Rohrer GS (2003) Distribution of grain boundaries in magnesia as a function of five macroscopic parameters. Acta Mater 51:3663–3674. doi: 10.1016/S1359-6454(03)00181-210.1016/S1359-6454(03)00181-2 ↗
18. Ratanaphan S, Olmsted DL, Bulatov VV et al (2015) Grain boundary energies in body-centered cubic metals. Acta Mater 88:346–354. doi: 10.1016/j.actamat.2015.01.06910.1016/j.actamat.2015.01.069 ↗
19. Randle V (2010) Role of grain boundary plane in grain boundary engineering. Mater Sci Technol 26:774–780. doi: 10.1179/026708309X1256726892664110.1179/026708309X12567268926641 ↗
20. Saylor DM, El Dasher BS, Rollett AD, Rohrer GS (2004) Distribution of grain boundaries in aluminum as a function of five macroscopic parameters. Acta Mater 52:3649–3655. doi: 10.1016/j.actamat.2004.04.01810.1016/j.actamat.2004.04.018 ↗
21. Randle V (2004) Twinning-related grain boundary engineering. Acta Mater 52:4067–4081. doi: 10.1016/j.actamat.2004.05.03110.1016/j.actamat.2004.05.031 ↗
22. Watanabe T (1984) An approach to grain boundary design of strong and ductile polycrystals. Res Mech 11:47–84
23. Raabe D, Sandlöbes S, Millán J et al (2013) Segregation engineering enables nanoscale martensite to austenite phase transformation at grain boundaries: a pathway to ductile martensite. Acta Mater 61:6132–6152. doi: 10.1016/j.actamat.2013.06.05510.1016/j.actamat.2013.06.055 ↗
24. Gertsman VY, Janecek M, Tangri K (1996) Grain boundary ensembles in polycrystals. Acta Mater 44:2869–2882. doi: 10.1016/1359-6454(95)00396-710.1016/1359-6454(95)00396-7 ↗
25. Randle V (1999) Mechanism of twinning-induced grain boundary engineering in low stacking-fault energy materials. Acta Mater 47:4187–4196. doi: 10.1016/S1359-6454(99)00277-310.1016/S1359-6454(99)00277-3 ↗
26. Kumar M, Schwartz AJ, King WE (2002) Microstructural evolution during grain boundary engineering of low to medium stacking fault energy fcc materials. Acta Mater 50:2599–2612. doi: 10.1016/S1359-6454(02)00090-310.1016/S1359-6454(02)00090-3 ↗
27. Winning M (2007) Grain boundary mechanics. Cuvillier Verlag, Göttingen
28. Randle V, Rohrer GS, Miller HM et al (2008) Five-parameter grain boundary distribution of commercially grain boundary engineered nickel and copper. Acta Mater 56:2363–2373. doi: 10.1016/j.actamat.2008.01.03910.1016/j.actamat.2008.01.039 ↗
29. Saylor DM, El Dasher B, Pang Y et al (2004) Habits of grains in dense polycrystalline solids. J Am Ceram Soc 87:724–726. doi: 10.1111/j.1551-2916.2004.00724.x10.1111/j.1551-2916.2004.00724.x ↗
30. Kim C-S, Hu Y, Rohrer GS, Randle V (2005) Five-parameter grain boundary distribution in grain boundary engineered brass. Scr Mater 52:633–637. doi: 10.1016/j.scriptamat.2004.11.02510.1016/j.scriptamat.2004.11.025 ↗
31. Randle V, Hu Y, Rohrer GS, Kim C-S (2005) Distribution of misorientations and grain boundary planes in grain boundary engineered brass. Mater Sci Technol 21:1287–1292. doi: 10.1179/174328405X6699610.1179/174328405X66996 ↗
32. Rohrer GS, Randle V, Kim C-S, Hu Y (2006) Changes in the five-parameter grain boundary character distribution in α-brass brought about by iterative thermomechanical processing. Acta Mater 54:4489–4502. doi: 10.1016/j.actamat.2006.05.03510.1016/j.actamat.2006.05.035 ↗
33. Randle V, Jones R (2009) Grain boundary plane distributions and single-step versus multiple-step grain boundary engineering. Mater Sci Eng A 524:134–142. doi: 10.1016/j.msea.2009.06.01810.1016/j.msea.2009.06.018 ↗
34. Jones R, Randle V, Engelberg D, Marrow TJ (2009) Five-parameter grain boundary analysis of a grain boundary–engineered austenitic stainless steel. J Microsc 233:417–422. doi: 10.1111/j.1365-2818.2009.03129.x10.1111/j.1365-2818.2009.03129.x ↗
35. Chen K-C, Wu W-W, Liao C-N et al (2008) Observation of atomic diffusion at twin-modified grain boundaries in copper. Science 321:1066–1069. doi: 10.1126/science.116077710.1126/science.1160777 ↗
36. Dixit P, Xu L, Miao J et al (2007) Mechanical and microstructural characterization of high aspect ratio through-wafer electroplated copper interconnects. J Micromech Microeng 17:1749–1757. doi: 10.1088/0960-1317/17/9/00110.1088/0960-1317/17/9/001 ↗
37. Zhong S, Koch T, Wang M et al (2009) Nanoscale twinned copper nanowire formation by direct electrodeposition. Small 5:2265–2270. doi: 10.1002/smll.20090074610.1002/smll.200900746 ↗
38. Hodge AM, Wang YM, Barbee TW Jr (2008) Mechanical deformation of high-purity sputter-deposited nano-twinned copper. Scr Mater 59:163–166. doi: 10.1016/j.scriptamat.2008.02.04810.1016/j.scriptamat.2008.02.048 ↗
39. Hsiao H-Y, Liu C-M, Lin H et al (2012) Unidirectional growth of microbumps on (111)-oriented and nanotwinned copper. Science 336:1007–1010. doi: 10.1126/science.121651110.1126/science.1216511 ↗
40. Khorashadizadeh A, Raabe D, Zaefferer S et al (2011) Five-parameter grain boundary analysis by 3D EBSD of an ultra fine grained CuZr alloy processed by equal channel angular pressing. Adv Eng Mater 13:237–244. doi: 10.1002/adem.20100025910.1002/adem.201000259 ↗
41. Khorashadizadeh A, Winning M, Raabe D (2008) 3D tomographic EBSD measurements of heavily deformed ultra fine grained Cu-0.17 wt%Zr obtained from ECAP. Mater Sci Forum 584–586:434–439. doi: 10.4028/www.scientific.net/MSF.584-586.43410.4028/www.scientific.net/MSF.584-586.434 ↗
42. Mandal S, Pradeep KG, Zaefferer S, Raabe D (2014) A novel approach to measure grain boundary segregation in bulk polycrystalline materials in dependence of the boundaries’ five rotational degrees of freedom. Scr Mater 81:16–19. doi: 10.1016/j.scriptamat.2014.02.01610.1016/j.scriptamat.2014.02.016 ↗
43. Saylor DM, Morawiec A, Rohrer GS (2002) Distribution and energies of grain boundaries in magnesia as a function of five degrees of freedom. J Am Ceram Soc 85:3081–3083. doi: 10.1111/j.1151-2916.2002.tb00583.x10.1111/j.1151-2916.2002.tb00583.x ↗
44. Li J, Dillon SJ, Rohrer GS (2009) Relative grain boundary area and energy distributions in nickel. Acta Mater 57:4304–4311. doi: 10.1016/j.actamat.2009.06.00410.1016/j.actamat.2009.06.004 ↗
45. Rohrer GS (2011) Grain boundary energy anisotropy: a review. J Mater Sci 46:5881–5895. doi: 10.1007/s10853-011-5677-310.1007/s10853-011-5677-3 ↗
46. Rohrer GS (2011) Measuring and interpreting the structure of grain-boundary networks. J Am Ceram Soc 94:633–646. doi: 10.1111/j.1551-2916.2011.04384.x10.1111/j.1551-2916.2011.04384.x ↗
47. Beladi H, Rohrer GS (2013) The relative grain boundary area and energy distributions in a ferritic steel determined from three-dimensional electron backscatter diffraction maps. Acta Mater 61:1404–1412. doi: 10.1016/j.actamat.2012.11.01710.1016/j.actamat.2012.11.017 ↗
48. Beladi H, Nuhfer NT, Rohrer GS (2014) The five-parameter grain boundary character and energy distributions of a fully austenitic high-manganese steel using three dimensional data. Acta Mater 70:281–289. doi: 10.1016/j.actamat.2014.02.03810.1016/j.actamat.2014.02.038 ↗
49. Ratanaphan S, Boonkird T, Sarochawikasit R et al (2017) Atomistic simulations of grain boundary energies in tungsten. Mater Lett 186:116–118. doi: 10.1016/j.matlet.2016.09.10410.1016/j.matlet.2016.09.104 ↗
50. Liu X, Choi D, Beladi H et al (2013) The five-parameter grain boundary character distribution of nanocrystalline tungsten. Scr Mater 69:413–416. doi: 10.1016/j.scriptamat.2013.05.04610.1016/j.scriptamat.2013.05.046 ↗
51. Gruber J, George DC, Kuprat AP et al (2005) Effect of anisotropic grain boundary properties on grain boundary plane distributions during grain growth. Scr Mater 53:351–355. doi: 10.1016/j.scriptamat.2005.04.00410.1016/j.scriptamat.2005.04.004 ↗
52. Dillon SJ, Rohrer GS (2009) Mechanism for the development of anisotropic grain boundary character distributions during normal grain growth. Acta Mater 57:1–7. doi: 10.1016/j.actamat.2008.08.06210.1016/j.actamat.2008.08.062 ↗
53. Holm EA, Olmsted DL, Foiles SM (2010) Comparing grain boundary energies in face-centered cubic metals: Al, Au, Cu and Ni. Scr Mater 63:905–908. doi: 10.1016/j.scriptamat.2010.06.04010.1016/j.scriptamat.2010.06.040 ↗
54. Bulatov VV, Reed BW, Kumar M (2014) Grain boundary energy function for fcc metals. Acta Mater 65:161–175. doi: 10.1016/j.actamat.2013.10.05710.1016/j.actamat.2013.10.057 ↗
55. Dixit P, Miao J (2006) Aspect-ratio-dependent copper electrodeposition technique for very high aspect-ratio through-hole plating. J Electrochem Soc 153:G552–G559. doi: 10.1149/1.218923810.1149/1.2189238 ↗
56. Wright SI, Larsen RJ (2002) Extracting twins from orientation imaging microscopy scan data. J Microsc 205:245–252. doi: 10.1046/j.1365-2818.2002.00992.x10.1046/j.1365-2818.2002.00992.x ↗
57. Ratanaphan S (2013) Grain boundary character distributions in isostructural materials. Carnegie Mellon University, Pittsburgh
58. Olmsted DL (unpublished)
59. Olmsted DL, Foiles SM, Holm EA (2009) Survey of computed grain boundary properties in face-centered cubic metals: I. Grain boundary energy. Acta Mater 57:3694–3703. doi: 10.1016/j.actamat.2009.04.00710.1016/j.actamat.2009.04.007 ↗
60. Duggan BJ, Lücke K, Köhlhoff G, Lee CS (1993) On the origin of cube texture in copper. Acta Metall Mater 41:1921–1927. doi: 10.1016/0956-7151(93)90211-A10.1016/0956-7151(93)90211-A ↗
61. Ridha AA, Hutchinson WB (1982) Recrystallisation mechanisms and the origin of cube texture in copper. Acta Metall 30:1929–1939. doi: 10.1016/0001-6160(82)90033-510.1016/0001-6160(82)90033-5 ↗
62. Mackenzie JK, Moore AJW, Nicholas JF (1962) Bonds broken at atomically flat crystal surfaces—I. J Phys Chem Solids 23:185–196. doi: 10.1016/0022-3697(62)90001-X10.1016/0022-3697(62)90001-X ↗
63. McLean M (1971) Determination of the surface energy of copper as a function of crystallographic orientation and temperature. Acta Metall 19:387–393. doi: 10.1016/0001-6160(71)90106-410.1016/0001-6160(71)90106-4 ↗
64. Zhang J-M, Ma F, Xu K-W (2004) Calculation of the surface energy of FCC metals with modified embedded-atom method. Appl Surf Sci 229:34–42. doi: 10.1016/j.apsusc.2003.09.05010.1016/j.apsusc.2003.09.050 ↗
65. Wolf D, Yip S (1992) Materials interfaces—atomic-level structure and properties. Springer, Berlin
66. Ratanaphan S, Yoon Y, Rohrer GS (2014) The five parameter grain boundary character distribution of polycrystalline silicon. J Mater Sci 49:4938–4945. doi: 10.1007/s10853-014-8195-210.1007/s10853-014-8195-2 ↗
67. Brandon DG (1966) The structure of high-angle grain boundaries. Acta Metall 14:1479–1484. doi: 10.1016/0001-6160(66)90168-410.1016/0001-6160(66)90168-4 ↗
68. Liu T-C, Liu C-M, Huang Y-S et al (2013) Eliminate Kirkendall voids in solder reactions on nanotwinned copper. Scr Mater 68:241–244. doi: 10.1016/j.scriptamat.2012.10.02410.1016/j.scriptamat.2012.10.024 ↗
69. Natter H, Hempelmann R (1996) Nanocrystalline copper by pulsed electrodeposition: the effects of organic additives, bath temperature, and pH. J Phys Chem 100:19525–19532. doi: 10.1021/jp961783710.1021/jp9617837 ↗
70. Natter H, Hempelmann R (2003) Tailor-made nanomaterials designed by electrochemical methods. Electrochim Acta 49:51–61. doi: 10.1016/j.electacta.2003.04.00410.1016/j.electacta.2003.04.004 ↗
71. Hoffman R (1976) Stresses in thin films: the relevance of grain boundaries and impurities. Thin Solid Films 34:185–190. doi: 10.1016/0040-6090(76)90453-310.1016/0040-6090(76)90453-3 ↗
72. Nix WD, Clemens BM (1999) Crystallite coalescence: a mechanism for intrinsic tensile stresses in thin films. J Mater Res 14:3467–3473. doi: 10.1557/JMR.1999.046810.1557/JMR.1999.0468 ↗
73. Chaudhari P (1972) Grain growth and stress relief in thin films. J Vac Sci Technol 9:520–522. doi: 10.1116/1.131667410.1116/1.1316674 ↗
74. Xu D, Sriram V, Ozolins V et al (2009) In situ measurements of stress evolution for nanotwin formation during pulse electrodeposition of copper. J Appl Phys 105:023521. doi: 10.1063/1.306819110.1063/1.3068191 ↗
75. Xu D, Sriram V, Ozolins V et al (2008) Nanotwin formation and its physical properties and effect on reliability of copper interconnects. Microelectron Eng 85:2155–2158. doi: 10.1016/j.mee.2008.04.03510.1016/j.mee.2008.04.035 ↗
76. Bober DB, Kumar M, Rupert TJ (2015) Nanocrystalline grain boundary engineering: increasing Σ3 boundary fraction in pure Ni with thermomechanical treatments. Acta Mater 86:43–54. doi: 10.1016/j.actamat.2014.11.03410.1016/j.actamat.2014.11.034 ↗
77. Xu D, Kwan WL, Chen K et al (2007) Nanotwin formation in copper thin films by stress/strain relaxation in pulse electrodeposition. Appl Phys Lett 91:254105. doi: 10.1063/1.282541210.1063/1.2825412 ↗
78. Fullman RL, Fisher JC (1951) Formation of annealing twins during grain growth. J Appl Phys 22:1350–1355. doi: 10.1063/1.169986510.1063/1.1699865 ↗
79. Holm EA, Rohrer GS, Foiles SM et al (2011) Validating computed grain boundary energies in fcc metals using the grain boundary character distribution. Acta Mater 59:5250–5256. doi: 10.1016/j.actamat.2011.05.00110.1016/j.actamat.2011.05.001 ↗
80. Rohrer GS, Holm EA, Rollett AD et al (2010) Comparing calculated and measured grain boundary energies in nickel. Acta Mater 58:5063–5069. doi: 10.1016/j.actamat.2010.05.04210.1016/j.actamat.2010.05.042 ↗
81. Miyazawa K, Iwasaki Y, Ito K, Ishida Y (1996) Combination rule of Σ values at triple junctions in cubic polycrystals. Acta Crystallogr A 52:787–796. doi: 10.1107/S010876739600593410.1107/S0108767396005934 ↗
82. Gertsman VY, Tangri K (1995) Computer simulation study of grain boundary and triple junction distributions in microstructures formed by multiple twinning. Acta Metall Mater 43:2317–2324. doi: 10.1016/0956-7151(94)00422-610.1016/0956-7151(94)00422-6 ↗
83. Schuh CA, Kumar M, King WE (2005) Universal features of grain boundary networks in FCC materials. J Mater Sci 40:847–852. doi: 10.1007/s10853-005-6500-910.1007/s10853-005-6500-9 ↗
84. Minich RW, Schuh CA, Kumar M (2002) Role of topological constraints on the statistical properties of grain boundary networks. Phys Rev B 66:052101. doi: 10.1103/PhysRevB.66.05210110.1103/PhysRevB.66.052101 ↗
85. Rohrer GS, Miller HM (2010) Topological characteristics of plane sections of polycrystals. Acta Mater 58:3805–3814. doi: 10.1016/j.actamat.2010.03.02810.1016/j.actamat.2010.03.028 ↗
86. Randle V, Hu Y, Coleman M (2008) Grain boundary reorientation in copper. J Mater Sci 43:3782–3791. doi: 10.1007/s10853-007-2128-210.1007/s10853-007-2128-2 ↗
87. Lejček P, Šedá P, Kinoshita Y et al (2012) Grain boundary plane reorientation: model experiments on bi- and tricrystals. J Mater Sci 47:5106–5113. doi: 10.1007/s10853-012-6384-410.1007/s10853-012-6384-4 ↗
88. Dunn CG, Lionetti F (1949) The effect of orientation difference on grain boundary energies. Trans Am Inst Min Metall Eng 185:125–132
89. Schlesinger M, Paunovic M (2011) Modern electroplating. Wiley, New York
90. Bicelli LP, Bozzini B, Mele C (2008) A review of nanostructural aspects of metal electrodeposition. Int J Electrochem Sci 3:356–40810.1016/S1452-3981(23)15460-5 ↗
91. Chandrasekar MS, Pushpavanam M (2008) Pulse and pulse reverse plating—conceptual, advantages and applications. Electrochim Acta 53:3313–3322. doi: 10.1016/j.electacta.2007.11.05410.1016/j.electacta.2007.11.054 ↗
92. Pavithra CLP, Sarada BV, Rajulapati KV et al (2015) Controllable crystallographic texture in copper foils exhibiting enhanced mechanical and electrical properties by pulse reverse electrodeposition. Cryst Growth Des 15:4448–4458. doi: 10.1021/acs.cgd.5b0074810.1021/acs.cgd.5b00748 ↗
93. Liu T-C, Liu C-M, Hsiao H-Y et al (2012) Fabrication and characterization of (111)-oriented and nanotwinned Cu by Dc electrodeposition. Cryst Growth Des 12:5012–5016. doi: 10.1021/cg300962v10.1021/cg300962v ↗
94. Chan T-C, Chueh Y-L, Liao C-N (2011) Manipulating the crystallographic texture of nanotwinned Cu films by electrodeposition. Cryst Growth Des 11:4970–4974. doi: 10.1021/cg200877f10.1021/cg200877f ↗
95. Liu C-M, Lin H-W, Lu C-L, Chen C (2014) Effect of grain orientations of Cu seed layers on the growth of <111>-oriented nanotwinned Cu. Sci Rep 4:6123. doi: 10.1038/srep0612310.1038/srep06123 ↗
96. Hasegawa M, Mieszala M, Zhang Y et al (2015) Orientation-controlled nanotwinned copper prepared by electrodeposition. Electrochim Acta 178:458–467. doi: 10.1016/j.electacta.2015.08.02210.1016/j.electacta.2015.08.022 ↗
97. Zhou XW, Wadley HNG (1999) Twin formation during the atomic deposition of copper. Acta Mater 47:1063–1078. doi: 10.1016/S1359-6454(98)00403-010.1016/S1359-6454(98)00403-0 ↗
98. Ryu C, Kwon K-W, Loke ALS et al (1999) Microstructure and reliability of copper interconnects. IEEE Trans Electron Devices 46:1113–1120. doi: 10.1109/16.76687210.1109/16.766872 ↗
99. Sarada BV, Pavithra CLP, Ramakrishna M et al (2010) Highly (111) textured copper foils with high hardness and high electrical conductivity by pulse reverse electrodeposition. Electrochem Solid-State Lett 13:D40–D42. doi: 10.1149/1.335814510.1149/1.3358145 ↗
100. Huang Y-S, Liu C-M, Chiu W-L, Chen C (2014) Grain growth in electroplated (1 1 1)-oriented nanotwinned Cu. Scr Mater 89:5–8. doi: 10.1016/j.scriptamat.2014.06.00810.1016/j.scriptamat.2014.06.008 ↗