journal article·2007-11

Nanostructured fumed metal oxides for thermal interface pastes

Chuangang Lin, D. D. L. Chung

Journal of Materials Science· Volume 42· Issue 22
Publisher page

Abstract

Fumed metal oxides (13 nm aluminum oxide particles and 20–25 nm zinc oxide particles), which are in the form of porous agglomerates of nanoparticles, are effective as thermally conductive solid components in thermal pastes. They are as effective as carbon black, but are advantageous in their electrical non-conductivity. Without fuming, the oxides are less effective. By coating with silane, which decreases the viscosity of the paste, they are even more effective. The organic vehicle (polyol esters) and solid component content (2.4–4.0 vol.%) are chosen to attain conformability and spreadability. The use of either 4.0 vol.% silane coated fumed zinc oxide or 2.4 vol.% silane coated alumina gives thermal pastes that are more effective than commercial thermal pastes (Ceramique and Shin-Etsu). Fumed zinc oxide is superior to non-fumed zinc oxide in improving the thermal stability. Silane coating of the fumed zinc oxide further improves the thermal stability. Fumed alumina does not affect the thermal stability, but silane coated fumed alumina improves the thermal stability. Though silane coated fumed zinc oxide is superior to silane coated alumina in enhancing the thermal stability, it is slightly inferior in the phase separation tendency.
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Research context

OpenAlex topics: Concrete and Cement Materials Research · Advanced ceramic materials synthesis · Heat and Mass Transfer in Porous Media

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References (21)

Show source-provided references
1. Wolff EG, Schneider DA (1998) Int J Heat Mass Transfer 41:346910.1016/S0017-9310(98)00067-2 ↗
2. Ouellette T, de Sorgo M (1985) Proc. Power Electron. Des. Conf. Power Sources Users Conference, Cerritos, CA, 134
3. Vogel MR (1995) Advances in electronic packaging, Proc. Int. Intersociety Electron. Packag. Conf., American Society of Mechanical Engineers, New York, NY, vol 10-2, p 989
4. Sartre V, Lallemand M (2001) Appl Therm Eng 21:22110.1016/S1359-4311(00)00034-X ↗
5. Grujicic M, Zhao CL, Dusel EC (2005) Appl Surf Sci 246:29010.1016/j.apsusc.2004.11.030 ↗
6. Chung DDL (2001) J Mater Eng Performance 10:5610.1361/105994901770345358 ↗
7. Xu Y, Luo X, Chung DDL (2002) J Electron Packaging 124:18810.1115/1.1477191 ↗
8. Leong C-K, Chung DDL (2003) Carbon 41:245910.1016/S0008-6223(03)00247-1 ↗
9. Leong C-K, Chung DDL (2004) Carbon 42:232310.1016/j.carbon.2004.05.013 ↗
10. Leong C-K, Aoyagi Y, Chung DDL (2006) Carbon 44(3):43510.1016/j.carbon.2005.09.002 ↗
11. Howe TA, Leong C-K, Chung DDL (2006) J Electron Mater 35(8):162810.1007/s11664-006-0209-7 ↗
12. Leong C-K, Aoyagi Y, Chung DDL (2005) J Electron Mater 34(10):133610.1007/s11664-005-0259-2 ↗
13. Gaydardzhiev S, Ay P (2006) J Mater Sci 41(16):525710.1007/s10853-006-0354-7 ↗
14. Batz-Sohn C (2003) Part Part Syst Char 20(6):370 (Volume Date 2004)10.1002/ppsc.200300851 ↗
15. Gun’ko VM, Zarko VI, Leboda R, Chibowski E (2001) Adv Colloid Interface Sci 91(1):110.1016/S0001-8686(99)00026-3 ↗
16. Mun JH, Sim IC (2002) Republ. Korean Kongkae Taeho Kongbo KR 2002060926
17. Kim BM (2002) Republ. Korean Kongkae Taeho Kongbo KR 2002061469
18. De Kretser RG, Scales PJ, Boger DV (1998) Colloid Surface A 137:30710.1016/S0927-7757(97)00372-5 ↗
19. Prasher R (2001) J Heat Transfer 123:96910.1115/1.1388301 ↗
20. Alexander W, Shackelford J (2001) CRC materials science and engineering handbook. CRC Press LLC, Boca Raton, FL, USA, p 284
21. Shenoy AV (1999) Rheology of filled polymer systems. Kluwer Academic Publishers, Norwell, MA, USA, p 8010.1007/978-94-015-9213-0 ↗