journal article·2007-07

A comparison of impression and compression creep behavior of polycrystalline Sn

C. Park, X. Long, S. Haberman, S. Ma, I. Dutta, R. Mahajan, S. G. Jadhav

Journal of Materials Science· Volume 42· Issue 13
Publisher page

Abstract

This paper reports on the application of a miniaturized impression creep test to measure the creep behavior of pure polycrystalline Sn, and compares the results to compression creep data on the same sample, in order to experimentally determine a scaling constant to formulate the equivalent uniaxial creep constitutive law from the impression creep data. The creep parameters determined via impression and compression creep are found to be identical, with n ∼ 5 and Q ∼ 42 kJ/mol, indicating that over the tested stress–temperature range, the mechanism is core diffusion controlled dislocation creep. In conjunction with results from previous modeling work, a single conversion factor, κn/C, which depends on material properties, is shown to be usable for converting the impression creep relation to the equivalent uniaxial creep relation, and the experimentally determined value of κn/C for polycrystalline Sn is very close to that obtained via modeling.
Source: openaire · Quality: candidate unverified · Source record ↗

Research context

OpenAlex topics: Electronic Packaging and Soldering Technologies · Microstructure and mechanical properties · Aluminum Alloys Composites Properties

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (26)

Show source-provided references
1. Dutta I, Park C, Choi S (2004) Mater Sci Eng A379:40110.1016/j.msea.2004.03.023 ↗
2. Mathew MD, Yang H, Movva S, Murty KL (2005) Metall Mater Trans 36A:9910.1007/s11661-005-0142-z ↗
3. Breen JE, Weertman J (1955) J Metals 123010.1007/BF03379034 ↗
4. Adeva P, Caruanna G, Ruano OA, Torralba M (1995) Mater Sci Eng A194:1710.1016/0921-5093(94)09654-6 ↗
5. Frenkel RE, Sherby OD, Dorn JE (1955) Acta Metall 3:47010.1016/0001-6160(55)90137-1 ↗
6. Suh SH, Cohen JB, Weertman J (1983) Metall Trans 14A:11710.1007/BF02643744 ↗
7. Chu SNG, Li JCM (1979) Mater Sci Eng A39:1
8. Song HG, Morris JW, Hua F (2002) Mater Trans (Japan) 43:184
9. Pan D, Marks RA, Dutta I, Mahajan R, Jadhav SG (2004) Rev Sci Instrum 75:524410.1063/1.1821626 ↗
10. Pan D, Dutta I, Jadhav SG, Raiser GF, Ma S (2005) J Electron Mater 34:104010.1007/s11664-005-0093-6 ↗
11. Marks RA, Pan D, Dutta I, Jadhav SG (2004) Proc. 9th intersociety conf. on thermal and thermomechanical phenomena in electronic systems, IEEE/ASME, pp 95–10210.1109/ITHERM.2004.1318262 ↗
12. Dutta I, Pan D, Jadhav S, Mahajan R (2005) Proc. InterPACK 2005 (Intl. Electronic Packaging Technology Conference), ASME, Paper No. 73408, pp 189–195
13. Yu EC, Li JCM (1977) Philos Mag 34:811
14. Li JCM (2002) Mater Sci Eng A322:2310.1016/S0921-5093(01)01116-9 ↗
15. Yu HY, Li JCM (1977) J Mater Sci 12:221410.1007/BF00552243 ↗
16. Sargent PM, Ashby MF (1992) Mater Sci Technol 8:59410.1179/mst.1992.8.7.594 ↗
17. Yu HY, Imam MA, Rath BB (1995) In: Chu SNG, Liaw PK, Arsenault RJ, Sadananda K, Chan KS, Gerberich WW, Chau CC, Kung TM (eds) Micromechanics of advanced materials. The Materials Metals & Materials Society
18. Yu HY, Imam MA, Rath BB (1985) J Mater Sci 20:63610.1007/BF01026536 ↗
19. Sastry DH, Murthy GS (1986) Trans Ind Inst Met 39:369
20. Gondi P, Sili A (1991) Z Metall 82:377
21. Chinh NQ, Tasnadi P, Juhasz A, Szommer P, Szep-Kiss E, Kovacs I (1994) Key Eng Mater 97–98:15910.4028/www.scientific.net/KEM.97-98.159 ↗
22. Yang FQ, Li JCM, Shih CW (1995) Mater Sci Eng A201:5010.1016/0921-5093(95)09763-5 ↗
23. Hyde TH, Yehia KA, Becker AA (1993) Int J Mech Sci 35:45110.1016/0020-7403(93)90035-S ↗
24. Vianco PT, Rejent JA, Kilgo AC (2003) J Electron Mater 32:14210.1007/s11664-003-0185-0 ↗
25. Bokshtein SZ (Samuil Zeilikovich) (1961) Investigation of the structure of metals by radioactive isotope methods. State Publishing House, Moscow
26. Fensham PJ (1950) Austr J Sci Res 3A:99