A comparison of impression and compression creep behavior of polycrystalline Sn
Source abstract
Abstract
This paper reports on the application of a miniaturized impression creep test to measure the creep behavior of pure polycrystalline Sn, and compares the results to compression creep data on the same sample, in order to experimentally determine a scaling constant to formulate the equivalent uniaxial creep constitutive law from the impression creep data. The creep parameters determined via impression and compression creep are found to be identical, with n ∼ 5 and Q ∼ 42 kJ/mol, indicating that over the tested stress–temperature range, the mechanism is core diffusion controlled dislocation creep. In conjunction with results from previous modeling work, a single conversion factor, κn/C, which depends on material properties, is shown to be usable for converting the impression creep relation to the equivalent uniaxial creep relation, and the experimentally determined value of κn/C for polycrystalline Sn is very close to that obtained via modeling.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Microstructure and mechanical properties · Aluminum Alloys Composites Properties
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