journal article·2013-09

Effect of titanium carbide coating on the microstructure and thermal conductivity of short graphite fiber/copper composites

Qian Liu, Xin-Bo He, Shu-Bin Ren, Ting-ting Liu, Qi-Ping Kang, Xuan-Hui Qu

Journal of Materials Science· Volume 48· Issue 17
Publisher page

Abstract

Graphite fiber–Cu composites have drawn much attention in electronic packaging due to its excellent machinability and thermal properties. However, the weak interface bonding between graphite fiber and copper resulted in low thermo-mechanical properties of composites. In this work, a titanium carbide coating with thickness of 0.1 μm or 1 μm was synthesized on the surface of graphite fiber through molten salts method to strengthen interfacial bonding. The enhanced composites present 24–43 % increase in thermal conductivity and achieve the thermal conductivity of 330–365 W m−1 K−1 as well as the coefficient of thermal expansion of 6.5 × 10−6–14 × 10−6 K−1. A Maxwell–Garnett effective medium approach on the anisotropic short fiber reinforcement with interfacial thermal resistance was established. The obtained enhancement was in good agreement with the estimates. The results suggest that the major factor that influences the thermal conductivities is not the interfacial thermal resistance but the low thermal conductivity of fiber in transversal direction when a well interfacial bonding is obtained.
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Research context

OpenAlex topics: Thermal properties of materials · Advanced ceramic materials synthesis · Aluminum Alloys Composites Properties

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References (19)

Show source-provided references
1. Prieto R, Molina JM, Narciso J, Louis E (2008) Scripta Mater 59:11. doi: 10.1016/j.scriptamat.2008.02.02610.1016/j.scriptamat.2008.02.026 ↗
2. Lee H, Jeon K, Kim H, Hong S (2000) J Mater Sci Lett 35:6231. doi: 10.1023/a:102674983172610.1023/A:1026749831726 ↗
3. Lloyd JC, Neubauer E, Barcena J, Clegg WJ (2010) Compos Sci Technol 70:2284. doi: 10.1016/j.compscitech.2010.05.00210.1016/j.compscitech.2010.05.002 ↗
4. Zhang Y, Zhang HL, Wu JH, Wang XT (2011) Scripta Mater 65:1097. doi: 10.1016/j.scriptamat.2011.09.02810.1016/j.scriptamat.2011.09.028 ↗
5. Abyzov A, Kidalov S, Shakhov F (2011) J Mater Sci Lett 46:1424. doi: 10.1007/s10853-010-4938-x10.1007/s10853-010-4938-x ↗
6. Neubauer E, Kitzmantel M, Hulman M, Angerer P (2010) Compos Sci Technol 70:2228. doi: 10.1016/j.compscitech.2010.09.00310.1016/j.compscitech.2010.09.003 ↗
7. Chu K, Wu QY, Jia CC et al (2010) Compos Sci Technol 70:298. doi: 10.1016/j.compscitech.2009.10.02110.1016/j.compscitech.2009.10.021 ↗
8. Veillère A, Heintz JM, Chandra N et al (2012) Mater Res Bull 47:375. doi: 10.1016/j.materresbull.2011.11.00410.1016/j.materresbull.2011.11.004 ↗
9. Li X, Dong Z, Westwood A et al (2008) Carbon 46:305. doi: 10.1016/j.carbon.2007.11.02010.1016/j.carbon.2007.11.020 ↗
10. Hatta H, Taya M (1985) J Appl Phys 58:2478. doi: 10.1063/1.33592410.1063/1.335924 ↗
11. Nan CW, Birringer R, Clark DR, Gleiter H (1997) J Appl Phys 81:6692. doi: 10.1063/1.36520910.1063/1.365209 ↗
12. Schmidt AJ, Collins KC, Minnich AJ, Chen G (2010) J Appl Phys 107:104907. doi: 10.1063/1.342846410.1063/1.3428464 ↗
13. Nan CW, Liu G, Lin YH, Li M (2004) Appl Phys Lett 85:3549. doi: 10.1063/1.180887410.1063/1.1808874 ↗
14. Kida M, Weber L, Monachon C, Mortensen A (2011) J Appl Phys 109:064907. doi: 10.1063/1.355387010.1063/1.3553870 ↗
15. Prasher R (2008) Phys Rev B 77:075424. doi: 10.1103/PhysRevB.77.07542410.1103/PhysRevB.77.075424 ↗
16. Marín JM, Zalba B, Cabeza LF, Mehling H (2005) Int J Heat Mass Transf 48:2561. doi: 10.1016/j.ijheatmasstransfer.2004.11.02710.1016/j.ijheatmasstransfer.2004.11.027 ↗
17. Bosak A, Krisch M, Mohr M, Maultzsch J, Thomsen C (2007) Phys Rev B 75:153408. doi: 10.1103/PhysRevB.75.15340810.1103/PhysRevB.75.153408 ↗
18. Balandin AA (2011) Nat Mater 10:569. doi: 10.1038/nmat306410.1038/nmat3064 ↗
19. Moruzzi V, Janak J, Schwarz K (1988) Phys Rev B 37:790. doi: 10.1103/PhysRevB.37.79010.1103/PhysRevB.37.790 ↗