journal article·2015-11

A new approach to the design of a low Si-added Al–Si casting alloy for optimising thermal conductivity and fluidity

Y. H. Cho, H. W. Kim, J. M. Lee, M. S. Kim

Journal of Materials Science· Volume 50· Issue 22
Publisher page

Abstract

The effect of Ni on the thermal conductivity and fluidity of a low Si-added Al–Si casting alloy was investigated. The room temperature thermal conductivity of an Al–2 wt%Si alloy instantly dropped when adding 0.5 wt%Ni, whereas further additions of Ni up to 3 wt% had little influence on the thermal conductivity, which was in the range of 180–185 W/mK. The thermal conductivity was also estimated for the alloys cast at various cooling rates by measuring the electrical conductivity using the Wiedemann–Franz law and increased nearly linearly with an increase in the cooling rates. At such a low level of 2 wt%Si, the castability of the Al–Si alloys, which was evaluated by a fluidity spiral test, was enhanced by the Ni additions, exhibiting the maximum fluidity length at 0.5 wt%Ni.
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Research context

OpenAlex topics: Aluminum Alloy Microstructure Properties · Aluminum Alloys Composites Properties · Advanced ceramic materials synthesis

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References (24)

Show source-provided references
1. Petroski J (2002) Thermal challenges facing new-generation light-emitting diodes (LEDs) for lighting applications. In: Proceedings of SPIE, 4776:215–496. doi:10.1117/12.45257910.1117/12.452579 ↗
2. Sce A, Caporale L (2014) High density die casting (HDDC): new frontiers in the manufacturing of heat sinks. J Phys 525:012020. doi: 10.1088/1742-6596/525/1/012020
3. Keller K (1998) Low cost, high performance, high volume heatsinks. In: Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium:113–118. doi: 10.1109/IEMTE.1998.72306910.1109/IEMTE.1998.723069 ↗
4. Keller KP (1998) Cast heatsink design advantages. In: Proceedings of the 6th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 112–118. doi: 10.1109/ITHERM.1998.68952710.1109/ITHERM.1998.689527 ↗
5. Mondolfo LF (1976) Aluminum alloys: structure and properties. Butterworths, London
6. http://www.matweb.com . Accessed 21 Jan 2015
7. Jou R-Y (2014) Numerical simulations of filling flows in die-casting molding of the thin-walled LED heat sink. In: Proceedings of the ASME 12th Biennial Conference on Engineering Systems Design and Analysis 1. doi: 10.1115/ESDA2014-2037310.1115/ESDA2014-20373 ↗
8. Jou R-Y (2012) Thermal analysis of LED heat sinks by high-vacuum die casting (HVDC). Adv Mater Lett 8:421–426. doi: 10.1166/asl.2012.2393
9. Rohatgi PK, Prabhakar KV (1975) Wroght aluminum-nickel alloys for high strength-high conductivity applications. Metall Trans A 6A:1003–100810.1007/BF02661353 ↗
10. Olafsson P, Sandstrom R, Karlsson Å (1997) Comparison of experimental, calculated and observed values for electrical and thermal conductivity of aluminium alloys. J Mater Sci 32:4383–4390. doi: 10.1023/A:101868002487610.1023/A:1018680024876 ↗
11. FactSage. http://factsage.com . Accessed 17 Mar 2015
12. Geiger AL, Hasselman DPH, Donaldson KY (1993) Effect of reinforcement particle size on the thermal conductivity of a particulate silicon carbide-reinforced aluminium-matrix composite. J Mater Sci Lett 12:420–423. doi: 10.1007/BF0060917210.1007/BF00609172 ↗
13. Terada Y, Ohkubo K, Mohri T, Suzuki T (2002) Thermal conductivity of intermetallic compounds with metallic bonding. Mater Trans 43(12):3167–3176. doi: 10.2320/matertrans.43.316710.2320/matertrans.43.3167 ↗
14. Hashin Z, Shtrikman S (1962) A variational approach to the theory of the elastic behaviour of multiphase materials. J Mech Phys Solid 11:127–140. doi: 10.1063/1.172857910.1016/0022-5096(63)90060-7 ↗
15. Gowri S, Samuel FH (1992) Effect of cooling rate on the solidification behavior of Al-7 pct Si-SiCp metal-matrix composites. Metall Trans A 23A:3369–3376. doi: 10.1007/BF0266344610.1007/BF02663446 ↗
16. España FA, Balla VK, Bandyopadhyay A (2011) Laser processing of bulk Al–12Si alloy: influence of microstructure on thermal properties. Philos Mag 91(4):574–588. doi: 10.1080/14786435.2010.52665010.1080/14786435.2010.526650 ↗
17. Prabhu KN, Ravishankar BN (2003) Effect of modification melt treatment on casting/chill interfacial heat transfer and electrical conductivity of Al-13% Si alloy. Mater Sci Eng A 360:293–298. doi: 10.1016/S0921-5093(03)00467-210.1016/S0921-5093(03)00467-2 ↗
18. Kayaa H, Böyük U, Çadırlı E, Maraşlı N (2012) Measurements of the microhardness, electrical and thermal properties of the Al–Ni eutectic alloy. Mater Des 34:707–712. doi: 10.1016/j.matdes.2011.05.03010.1016/j.matdes.2011.05.030 ↗
19. Flemings MC (1974) Solidification processing. McGraw-Hill, New York
20. Campbell J (2003) Castings, 2nd edn. Butterworths, Oxford
21. Sabatino MD (2005) Fluidity of aluminium alloys. PhD thesis, Norwegian University of Science and Technology, Trondheim
22. Gourlay CM, Reed J, Nogita K, Dahle AK (2008) The maximum flulidity length of solidifying Sn-Cu-Ag-Ni solder alloys. J Electron Mater 37(1):51–60. doi: 10.1007/s11664-007-0248-810.1007/s11664-007-0248-8 ↗
23. Thi HN, Dabo Y, Drevet B, Dupouy MD, Camel D, Billia B, Hunt JD, Chilton A (2005) Directional solidification of Al–1.5 wt% Ni alloys under diffusion transport in space and fluid-flow localisation on earth. J Cryst Growth 281:654–668. doi: 10.1016/j.jcrysgro.2005.04.06110.1016/j.jcrysgro.2005.04.061 ↗
24. Taylor JA, Schaffer GB, StJohn DH (1999) The role of iron in the formation of porosity in Al-Si-Cu-based casting alloys: part II. A phase-diagram approach. Metall Mater Trans A 30A:1651–1655. doi: 10.1007/s11661-999-0102-010.1007/s11661-999-0102-0 ↗