journal article·2023-04-25

Mixed-Dimensional MXene Nanocomposites/Aramid Nanofibers-Based Flexible Pressure and Strain Sensor for Electronic Skin

Hai Jiang, Mei Qin, Cheng Zhang, Zhiwei Weng, Jiabo Zhang, Xuan Weng

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Abstract

The implementation of tactile functions in array sensors has created an urgent need for high-performance force sensors with both high linearity and sensitivity so as to ensure the uniformity and accuracy of acquisition of multiple sensing units in the array sensors. In addition, it still remains challenging to fabricate exquisite geometric constructions for integrating highly sensitive materials, extraordinary sensitivity, high stretchability, wide sensing range, and flexibility into a single type of pressure/strain sensor. Herein, a sensitive flexible sensor was fabricated that was composed of mixed-dimensional MXene-based nanocomposites as piezoresistive layers and Ecoflex layers as the encapsulation. The resultant sensors with MXene (Ti 3 C 2 T x )-ANF (aramid nanofiber)-BP (black phosphorus)-gold (Au) nanocomposites exhibited excellent electrical conductivity, ultrahigh press sensitivity of 0.4986 kPa –1 (0–1 kPa), reliable linearity ( R 2 = 0.998), rapid response time of 12 ms, excellent durability over 4000 cycles, and ultrahigh tensile sensitivity of 9188.583. An 8 × 8 pixel electronic skin was fabricated by the as-prepared mixed-dimensional MXene-based sensors and tested in the identification of sliding movements and surface shape, and the good performance shows great potential applications in the fields of wearable devices, human–machine interaction, and robotics.
Source: openalex_inverted_index · Quality: baseline

Research context

OpenAlex topics: Advanced Sensor and Energy Harvesting Materials · MXene and MAX Phase Materials · Dielectric materials and actuators

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

School of Mechanical and Electrical Engineering, University of Electronic Science and Technology of China, Chengdu, Sichuan 611731, China

Institute of Electronic and Information Engineering of UESTC in Guangdong, Dongguan, Guangdong 523808, China

Funding

University Scientific Research and Innovation Team Program of Sichuan · University of Electronic Science and Technology of China · Ministry of Industry and Information Technology of the People's Republic of China · National Natural Science Foundation of China · International S and T Cooperation Program of Sichuan Province · Guangdong Basic and Applied Basic Research Foundation

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