Fabrication and thermo-mechanical behavior of ultra-fine porous copper
Source abstract
Abstract
Porous materials with ligament sizes in the submicrometer to nanometer regime have a high potential for future applications such as catalysts, actuators, or radiation tolerant materials, which require properties like high strength-to-weight ratio, high surface-to-volume ratio, or large interface density as for radiation tolerance. The objective of this work was to manufacture ultra-fine porous copper, to determine the thermo-mechanical properties, and to elucidate the deformation behavior at room as well as elevated temperatures via nanoindentation. The experimental approach for manufacturing the foam structures used high pressure torsion, subsequent heat treatments, and selective dissolution. Nanoindentation at different temperatures was successfully conducted on the ultra-fine porous copper, showing a room temperature hardness of 220 MPa. During high temperature experiments, oxidation of the copper occurred due to the high surface area. A model, taking into account the mechanical properties of the copper oxides formed during the test, to describe the measured mechanical properties in dependence on the proceeding oxidation was developed. The strain rate sensitivity of the copper foam at room temperature was ∼0.03 and strongly correlated with the strain rate sensitivity of ultra-fine grained bulk copper. Although oxidation occurred near the surface, the rate-controlling process was still the deformation of the underlying copper. An increase in the strain rate sensitivity was observed, comparably to that of ultra-fine-grained copper, which can be linked to thermally activated processes at grain boundaries. Important insights into the effects of oxidation on the deformation behavior were obtained by assessing the activation volume. Oxidation of the ultra-fine porous copper foam, thereby hindering dislocations to exit to the surface, resulted in a pronounced reduction of the apparent activation volume from ~800 to ~50 b 3, as also typical for ultra-fine grained materials.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Aluminum Alloys Composites Properties · Nanoporous metals and alloys · Microstructure and mechanical properties
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (53)
Show source-provided references
1. Weißmüller J, Viswanath RN, Kramer D et al (2003) Charge-induced reversible strain in a metal. Science 300:312–31510.1126/science.1081024 ↗
2. Misra A, Demkowicz MJ, Zhang X, Hoagland RG (2007) The radiation damage tolerance of ultra-high strength nanolayered composites. JOM 59:62–6510.1007/s11837-007-0120-6 ↗
3. Bringa EM, Monk JD, Caro A et al (2011) Are nanoporous materials radiation resistant? Nano Lett 12:3351–335510.1021/nl201383u ↗
4. Hodge AM, Biener J, Hayes JR et al (2007) Scaling equation for yield strength of nanoporous open-cell foams. Acta Mater 55:1343–134910.1016/j.actamat.2006.09.038 ↗
5. Biener J, Hodge AM, Hamza AV et al (2005) Nanoporous Au: a high yield strength material. J Appl Phys 97:2430110.1063/1.1832742 ↗
6. Volkert CA, Lilleodden ET, Kramer DE, Weissmüller J (2006) Approaching the theoretical strength in nanoporous Au. App Phys Lett 89:06192010.1063/1.2240109 ↗
7. Briot NJ, Kennerknecht T, Eberl C, Balk TJ (2014) Mechanical properties of bulk single crystalline nanoporous gold investigated by millimetre-scale tension and compression testing. Phil Mag 94:847–86610.1080/14786435.2013.868944 ↗
8. Zhang Z, Wang Y, Qi Z et al (2009) Generalized fabrication of nanoporous metals (Au, Pd, Pt, Ag, and Cu) through chemical dealloying. J Phys Chem C 113:12629–1263610.1021/jp811445a ↗
9. Baker H (1992) Alloy Phase Diagrams. ASM Met. Handb., Vol. 3. ASM Metal Handbook, pp 2–181
10. Alkorta J, Martínez-Esnaola JM, Gil Sevillano J (2008) Critical examination of strain-rate sensitivity measurement by nanoindentation methods: application to severely deformed niobium. Acta Mater 56:884–89310.1016/j.actamat.2007.10.039 ↗
11. Peykov D, Martin E, Chromik RR et al (2012) Evaluation of strain rate sensitivity by constant load nanoindentation. J Mater Sci 47:7189–7200. doi: 10.1007/s10853-012-6665-y10.1007/s10853-012-6665-y ↗
12. Maier V, Merle B, Göken M, Durst K (2013) An improved long-term nanoindentation creep testing approach for studying the local deformation processes in nanocrystalline metals at room and elevated temperatures. J Mater Res 28:1177–118810.1557/jmr.2013.39 ↗
13. Maier V, Durst K, Mueller J et al (2011) Nanoindentation strain-rate jump tests for determining the local strain-rate sensitivity in nanocrystalline Ni and ultrafine-grained Al. J Mater Res 26:1421–143010.1557/jmr.2011.156 ↗
14. Wheeler JM, Maier V, Durst K et al (2013) Activation parameters for deformation of ultrafine-grained aluminium as determined by indentation strain rate jumps at elevated temperature. Mater Sci Eng A 585:108–11310.1016/j.msea.2013.07.033 ↗
15. Wei Q, Cheng S, Ramesh K, Ma E (2004) Effect of nanocrystalline and ultrafine grain sizes on the strain rate sensitivity and activation volume: fcc versus bcc metals. Mater Sci Eng A 381:71–7910.1016/j.msea.2004.03.064 ↗
16. Wang YM, Hamza AV, Ma E (2006) Temperature-dependent strain rate sensitivity and activation volume of nanocrystalline Ni. Acta Mater 54:2715–272610.1016/j.actamat.2006.02.013 ↗
17. Huang P, Wang F, Xu M et al (2010) Dependence of strain rate sensitivity upon deformed microstructures in nanocrystalline Cu. Acta Mater 58:5196–520510.1016/j.actamat.2010.05.055 ↗
18. Asaro RJ, Suresh S (2005) Mechanistic models for the activation volume and rate sensitivity in metals with nanocrystalline grains and nano-scale twins. Acta Mater 53:3369–338210.1016/j.actamat.2005.03.047 ↗
19. Cavaliere P (2008) Strain rate sensitivity of ultra-fine and nanocrystalline metals and alloys. Phys B Condens Matter 403:569–57510.1016/j.physb.2007.09.075 ↗
20. Champion Y, Nowak S (2008) Activation volume in fine grained metals from stress relaxation and nano-indentation. Mater Sci Forum 584–586:399–40410.4028/www.scientific.net/MSF.584-586.399 ↗
21. Chen J, Lu L, Lu K (2006) Hardness and strain rate sensitivity of nanocrystalline Cu. Scr Mater 54:1913–191810.1016/j.scriptamat.2006.02.022 ↗
22. Bachmaier A, Hohenwarter A, Pippan R (2009) New procedure to generate stable nanocrystallites by severe plastic deformation. Scr Mater 61:1016–101910.1016/j.scriptamat.2009.08.016 ↗
23. Perez M, Perrard F, Massardier V et al (2005) Low-temperature solubility of copper in iron: experimental study using thermoelectric power, small angle X-ray scattering and tomographic atom probe. Philos Mag 85:2197–221010.1080/14786430500079645 ↗
24. Everitt NM, Davies MI, Smith JF (2011) High temperature nanoindentation: the importance of isothermal contact. Philos Mag 91:1221–124410.1080/14786435.2010.496745 ↗
25. Wheeler JM, Michler J (2013) Indenter materials for high temperature nanoindentation. Rev Sci Instr 84:10130110.1063/1.4824710 ↗
26. Oliver WC, Pharr GM (1992) An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments. J Mater Res 7:1564–158310.1557/JMR.1992.1564 ↗
27. Gibson LJ, Ashby MF (1999) Cellular solids: structure and properties, 2nd edn. Cambridge University Press, Cambridge
28. Hart EW (1967) Theory of the tensile test. Acta Metall 15:351–35510.1016/0001-6160(67)90211-8 ↗
29. Mayo MJ, Nix WD (1988) A micro-indentation study of superplasticity in Pb, Sn, and Sn-38 wt% Pb. Acta Metall 36:2183–219210.1016/0001-6160(88)90319-7 ↗
30. Gibbs GB (1965) The thermodynamics of thermally-activated dislocation glide. Phys status solidi 10:507–51210.1002/pssb.2220100212 ↗
31. Johnson KL (1987) Contact mechanics. Cambridge University Press, Cambridge
32. Straumanis ME, Yu LS (1969) Lattice parameters, densities, expansion coefficients and perfection of structure of Cu and of Cu-In (α) phase. Acta Crystallogr Sect A 25:676–68210.1107/S0567739469001549 ↗
33. Samsonov GV (1973) The oxide handbook. IFI/Plenum, New York10.1007/978-1-4615-9597-7 ↗
34. Dao M, Lu L, Shen YF, Suresh S (2006) Strength, strain-rate sensitivity and ductility of copper with nanoscale twins. Acta Mater 54:5421–543210.1016/j.actamat.2006.06.062 ↗
35. Meyers MA, Mishra A, Benson DJ (2006) Mechanical properties of nanocrystalline materials. Prog Mater Sci 51:427–55610.1016/j.pmatsci.2005.08.003 ↗
36. Tan EPS, Zhu Y, Yu T et al (2007) Crystallinity and surface effects on Young’s modulus of CuO nanowires. Appl Phys Lett 90:16311210.1063/1.2723654 ↗
37. Manghnani MH, Brower WS, Parker HS (1974) Anomalous elastic behavior in Cu2O under pressure. Phys status solidi 25:69–7610.1002/pssa.2210250103 ↗
38. Ogata S, Li J, Yip S (2002) Ideal pure shear strength of aluminum and copper. Science 298:807–81110.1126/science.1076652 ↗
39. Hosemann P, Kiener D, Wang Y, Maloy SA (2012) Issues to consider using nano indentation on shallow ion beam irradiated materials. J Nucl Mater 425:136–13910.1016/j.jnucmat.2011.11.070 ↗
40. Rösler J, Harders H, Bäker M (2008) Mechanisches Verhalten der Werkstoffe. Vieweg + Teubner, Wiesbaden
41. Chawla KK (2012) Composite materials: science and engineering. Springer, Luxemburg
42. Zhu Y, Mimura K, Isshiki M (2002) Oxidation mechanism of copper at 623–1073 K. Mater Trans 43:2173–217610.2320/matertrans.43.2173 ↗
43. Cocke DL, Schennach R, Hossain MA et al (2005) The low-temperature thermal oxidation of copper, Cu3O2, and its influence on past and future studies. Vacuum 79:71–8310.1016/j.vacuum.2005.01.010 ↗
44. Cho S, Paik K (1998) Oxidation studies on a Cu-base leadframe alloy between 150 and 300°C. Scr Mater 38:1149–115410.1016/S1359-6462(98)00012-8 ↗
45. Ramirez M, Henneken L, Virtanen S (2011) Oxidation kinetics of thin copper films and wetting behaviour of copper and organic solderability preservatives (OSP) with lead-free solder. Appl Surf Sci 257:6481–648810.1016/j.apsusc.2011.02.048 ↗
46. Rhodin TN Jr (1950) Low temperature oxidation of copper I. Physical mechanism. J Am Chem Soc 72:5102–510610.1021/ja01167a079 ↗
47. Lenglet M, Kartouni K, Machefert J et al (1995) Low temperature oxidation of copper: The formation of CuO. Mater Res Bull 30:393–40310.1016/0025-5408(95)00025-9 ↗
48. Fries E (1978) Substructure formation during Cu2O single crystal creep. Rev Phys Appl 2:48910.1051/rphysap:019780013010048900 ↗
49. May J, Höppel HW, Göken M (2005) Strain rate sensitivity of ultrafine-grained aluminium processed by severe plastic deformation. Scr Mater 53:189–19410.1016/j.scriptamat.2005.03.043 ↗
50. Vevecka-Priftaj A, Böhner A, May J et al (2008) Strain rate sensitivity of ultrafine grained aluminium alloy AA6061. Mater Sci Forum 586:741–74710.4028/www.scientific.net/MSF.584-586.741 ↗
51. Bach J, Liebig JP, Höppel HW, Blum W (2013) Influence of grain boundaries on the deformation resistance: insights from an investigation of deformation kinetics and microstructure of copper after predeformation by ECAP. Phil Mag 93:4331–435410.1080/14786435.2013.828161 ↗
52. Torres G, Radcliffe V (1978) The mechanical behaviour of cuprous oxide. J Mater Sci 13:2164–2170. doi: 10.1016/j.carbpol.2014.04.03010.1007/BF00541670 ↗
53. Vagnard G, Washburn J (1967) Plastic deformation of cuprous oxide. J Am Ceram Soc 51:88–9410.1111/j.1151-2916.1968.tb11843.x ↗