Diffusion bonds in copper
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Abstract
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Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Adhesion, Friction, and Surface Interactions · Copper Interconnects and Reliability
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References (16)
Show source-provided references
1. B. Derby and E. R. Wallach, Met. Sci. 16 (1982) 49.10.1179/030634582790427028 ↗
2. B. Derby and R. E. Wallach, ibid. 18 (1984) 426.
3. Y. A. Chang and L. Himmel, J. Appl. Phys. 37 (1966) 3567.10.1063/1.1708903 ↗
4. H. Jones, Met. Sci. 5 (1951) 15.10.1179/030634571790439342 ↗
5. N. L. Peterson, Sol. State Phys. 22 (1968) 409.10.1016/S0081-1947(08)60034-X ↗
6. J. Y. Choi and P. G. Shewmon, Trans. AIME 224 (1962) 589.
7. S. Dushman and J. M. Laffety, (eds.) ?Scientific Foundations of Vacuum Technology?, Wiley. (1962).10.1063/1.3058326 ↗
8. H. J. Frost and M. F. Ashby, O.N.R. Report NO-031-72.
9. A. A. L. White and D. J. Allen, presented at the Conference on ?Advances in Welding Progress? (1978) Harrogate, England, unpublished.
10. S. Elliot, ?Diffusion Bonding Copper ? a Literature Survey?, Welding Institute Report (The Welding Institue, Abington, Cambridge, 1978).
11. H. J. Frost and M. F. Ashby, ?Deformation Mechanism Maps? (Pergamon, Oxford 1982).
12. J. M. Bradford and V. Nagpal, Trans. AIME 95H (1973) 170.
13. O. Ohashi and T. Hashimoto, J. Jap. Welding Soc. 45 (1976) 76.10.2207/qjjws1943.45.76 ↗
14. Idem, ibid. 45 (1976) 47.
15. Idem, ibid. 45 (1976) 71.
16. B. Derby and E. R. Wallach, J. Mater. Sci. 19 (1984) 3149.10.1007/BF00549798 ↗