Effects of moisture on the thermal expansion of poly(methylmethacrylate)
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Abstract
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Research context
OpenAlex topics: Polymer crystallization and properties · Injection Molding Process and Properties · Epoxy Resin Curing Processes
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References (6)
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1. Plexiglas V product information, supplied by Rohm and Haas Co., Philadelphia, Pennsylvania.
2. J. Brand, ?Thermal Analysis of Multilayer Printed Wiring Boards,? IPC Technical Paper IPC-TP-152, Institute of Printed Circuits, Evanston, Illinois (1977).
3. M. J. Adamson,J. Mater. Sci. 15 (1980) 1736.10.1007/BF00550593 ↗
4. T. A. Hahn andR. K. Kirby, in ?Thermal Expansion 1971?, edited by M. G. Graham and H. E. Hagy, Proceedings of the 1971 Thermal Expansion Symposium, AIP Conference Proceedings No. 3 (American Institute of Physics, New York, 1972).
5. D. T. Turner,Polymer 23 (1982) 197.10.1016/0032-3861(82)90300-7 ↗
6. P. Masi,L. Nicodemo, C. Migliaresi andL. Nicolais,Polym. Commun. 25 (1984) 331.