Necking growth and mechanical properties of sintered Ag particles with different shapes under air and N2 atmosphere
Source abstract
Abstract
Ag sinter joint is gaining greater attention for use with wide-bandgap die attach modules in high-temperature applications. In this study, we have investigated both the necking growth of Ag grain and the mechanical properties of sintered Ag with different Ag particle shapes in a low-temperature, pressure-less sintering process in air and N2. The necking growth ratio of Ag grains plays an important role in the mechanical properties of sintered Ag. Large necking growth corresponds to stronger tensile fracture strength of sintered Ag paste and stronger die shear strength. Self-generated Ag nanoparticles (AgNPs) with of a size less than 10 nm were observed under an air atmosphere, an atmosphere that produces larger necking growth than does that of N2. In addition, self-generated AgNPs were observed in sintered Ag flake particles specimens. Ag flake particles also lead to larger necking growth than that of sintered Ag spherical particle specimens. Self-generated AgNPs accumulated together due to their high surface energy, thus improving the necking growth of Ag grain and leading to a stronger fracture strength. In addition, it was revealed that both the oxygen element and the grain residual strain of initial Ag particles play important roles in the AgNPs self-generation during the sintering process. This study enhances our understanding of the sintering mechanism of Ag particles and the relationship between grain necking growth and its mechanical properties.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Aluminum Alloys Composites Properties · Powder Metallurgy Techniques and Materials
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (52)
Show source-provided references
1. Ryu SH, Hull BA, Dhar S, Cheng L, Zhang QCJ, Richmond J, Das MK, Agarwal AK, Palmour JW, Lelis AJ, Geil B, Scozzie C (2010) Performance, reliability, and robustness of 4H-SiC power DMOSFETs. Mater Sci Forum 645–648:969–97410.4028/www.scientific.net/MSF.645-648.969 ↗
2. Pearton SJ, Ren F, Zhang AP, Lee KP (2000) Fabrication and performance of GaN electronic devices. Mater Sci Eng R Rep 30:55–21210.1016/S0927-796X(00)00028-0 ↗
3. Chin HS, Cheong KY, Ismail AB (2010) A review on die attach materials for SiC-based high-temperature power devices. Metal Mater Trans B 41:824–83210.1007/s11663-010-9365-5 ↗
4. Tu KN, Zeng K (2001) Tin-lead (SnPb) solder reaction in flip chip technology. Mater Sci Eng R 34:1–5810.1016/S0927-796X(01)00029-8 ↗
5. Abtew M, Selvaduray G (2000) Lead-free solders in microelectronics. Mater Sci Eng R 27:95–14110.1016/S0927-796X(00)00010-3 ↗
6. Manikam VR, Cheong KY (2011) Die attach materials for high temperature applications: a revie. IEEE Trans Compon Packag Manuf Technol 1:457–47810.1109/TCPMT.2010.2100432 ↗
7. Ramanathan LN, Jang JW, Lin JK, Frear DR (2005) Solid-state annealing behavior of two high-Pb solders, 95Pb5Sn and 90Pb10Sn, on Cu under bump metallurgy. J Electron Mater 34:43–4610.1007/s11664-005-0262-7 ↗
8. Kim KS, Yu CH, Kim NH, Kim NK, Chang HJ, Chang EG (2003) Isothermal aging characteristics of Sn-Pb micro solder bumps. Microelectron Reliab 43:757–76310.1016/S0026-2714(03)00060-X ↗
9. Laurila T, Vuorinen V, Kivilahti JK (2005) Interfacial reactions between lead-free solders and common base materials. Mater Sci Eng R 49:1–6010.1016/j.mser.2005.03.001 ↗
10. Chen C, Nagao S, Suganuma K, Jiu J, Sugahara T, Zhang H, Iwashige T, Sugiura K, Tsuruta K (2017) Macroscale and microscale fracture toughness of microporous sintered Ag for applications in power electronic devices. Acta Mater 129:41–5110.1016/j.actamat.2017.02.065 ↗
11. Ide E, Angata S, Hirose A, Kobayashi KF (2005) Metal–metal bonding using Ag metallo-organic nanoparticles. Acta Mater 53:2385–239310.1016/j.actamat.2005.01.047 ↗
12. Carr J, Milhet X, Gadaud P, Boyer SAE, Thompson GE, Lee P (2015) Quantitative characterization of porosity and determination of elastic modulus for sintered micro-silver joints. J Mater Process Technol 225:19–2310.1016/j.jmatprotec.2015.03.037 ↗
13. Wang T, Chen X, Lu G-Q, Lei G-Y (2007) Low-temperature sintering with nano-silver paste indie-attached interconnection. J Electron Mater 36:1333–134010.1007/s11664-007-0230-5 ↗
14. Gadaud P, Caccuri V, Bertheau D, Carr J, Milhet X (2016) Ageing sintered silver: relationship between tensile behavior, mechanical properties and the nanoporous structure evolution. Mater Sci Eng A Struct 669:379–38610.1016/j.msea.2016.05.108 ↗
15. Chen C, Suganuma K, Iwashige T, Sugiura K, Tsuruta K (2018) High-temperature reliability of sintered microporous Ag on electroplated Ag, Au, and sputtered Ag metallization substrates. J Mater Sci Mater Electron 29:1785–179710.1007/s10854-017-8087-8 ↗
16. Chua ST, Siow KS (2016) Microstructural studies and bonding strength of pressureless sintered nano-silver joints on silver, direct bond copper (DBC) and copper substrates aged at 300 C. J Alloy Compd 687:486–49810.1016/j.jallcom.2016.06.132 ↗
17. Chen C, Nagao S, Suganuma K, Jiu J, Zhang H, Sugahara T, Iwashige T, Sugiura K, Tsuruta K (2016) Self-healing of cracks in Ag joining layer for die-attachment in power devices. Appl Phys Lett 109:09350310.1063/1.4962333 ↗
18. Hu A, Guo JY, Alarifi H, Patane G, Zhou Y, Compagnini G, Xu CX (2010) Low temperature sintering of Ag nanoparticles for flexible electronics packaging. Appl Phys Lett 97:15311710.1063/1.3502604 ↗
19. Yan J, Zou G, Wu A, Ren J, Yan J, Hu A, Zhou Y (2012) Pressureless bonding process using Ag nanoparticle paste for flexible electronics packaging. Scripta Mater 66:582–58510.1016/j.scriptamat.2012.01.007 ↗
20. Reich S, Mazur S, Avakian P, Wilson FC (1987) Sintering of silver interlayers in polyimide films. J Appl Phys 62:287–29210.1063/1.339142 ↗
21. Iwama S, Hayakawa K (1981) Sintering of ultrafine metal powders. II. Neck growth stage of Au, Ag, Al and Cu. Jpn J Appl Phys 20:335–34010.1143/JJAP.20.335 ↗
22. Wakuda D, Kim K-S, Suganuma K (2009) Room-temperature sintering process of Ag nanoparticle paste. IEEE Trans Compon Packag Technol 32:627–63210.1109/TCAPT.2009.2015874 ↗
23. Fang ZZ, Wang H (2008) Densification and grain growth during sintering of nanosized particles. Int Mater Rev 53:326–35210.1179/174328008X353538 ↗
24. Kim K-S, Kim Y, Jung S-B (2012) Microstructure and adhesion characteristics of a silver nanopaste screen-printed on Si substrate. Nanoscale Res Lett 7(1):4910.1186/1556-276X-7-49 ↗
25. Khazaka R, Mendizabal L, Henry D (2014) Review on joint shear strength of nano-silver paste and its long-term high temperature reliability. J Electron Mater 43:2459–246610.1007/s11664-014-3202-6 ↗
26. Knoer M, Schletz A, Oertel S, Jank M (2010) In: Proc. world congress on particle technology WCPT6
27. Mei Y, Lu G-Q, Chen X, Luo S, Ibitayo D (2011) Effect of oxygen partial pressure on silver migration of low-temperature sintered nanosilver die-attach material. IEEE Trans Device Mater Reliab 11:312–31510.1109/TDMR.2010.2056372 ↗
28. Siow KS (2014) Are sintered silver joints ready for use as interconnect material in microelectronic packaging? J Electron Mater 43:947–96110.1007/s11664-013-2967-3 ↗
29. Siow KS, Lin YT (2016) Identifying the development state of sintered silver (Ag) as a bonding material in the microelectronic packaging via a patent landscape study. J Electron Packag 138:02080410.1115/1.4033069 ↗
30. Suganuma K, Sakamoto S, Kagami N, Wakuda D, Kim K-S, Nogi M (2012) Low-temperature low-pressure die attach with hybrid silver particle paste. Microelectron Reliab 52:375–38010.1016/j.microrel.2011.07.088 ↗
31. Zhang H, Chen C, Jiu J, Nagao S, Suganuma K (2018) High-temperature reliability of low-temperature and pressureless micron Ag sintered joints for die attachment in high-power device. J Mater Sci Mater Electron 29:8854–886210.1007/s10854-018-8903-9 ↗
32. Sakamoto S, Nagao S, Suganuma K (2013) Thermal fatigue of Ag flake sintering die-attachment for Si/SiC power devices. J Mater Sci Mater Electron 24:2593–260110.1007/s10854-013-1138-x ↗
33. Zhao S, Li X, Mei Y, Lu G (2016) Novel interface material used in high power electronic die-attaching on bare Cu substrates 27:10941–10950
34. Chen C, Nagao S, Sugahara T, Zhang H, Jiu J, Suganuma K, Iwashige T, Sugiura K, Tsuruta K (2017) In: IEEE international conference on electronics packaging (ICEP), pp 97–100
35. Zhang H, Nagao S, Lin S, Yokoi E, Chen C, Suganuma K (2016) A novel mechanism of silver microflakes sinter joining. In: IEEE China semiconductor technology international conference (CSTIC), pp 1–310.1109/CSTIC.2016.7463950 ↗
36. Chen C, Nagao S, Zhang H, Jiu J, Sugahara T, Suganuma K, Iwashige T, Sugiura K, Tsuruta K (2017) Mechanical deformation of sintered porous Ag die attach at high temperature and its size effect for wide-bandgap power device design. J Electron Mater 46:1576–158610.1007/s11664-016-5200-3 ↗
37. Kuczynski GC (1949) Self-diffusion in sintering of metallic particles. Trans Metal Soc AIME 185:169–178
38. Kuczynski GC (1956) The mechanism of densification during sintering of metallic particles. Acta Metall 4:58–6110.1016/0001-6160(56)90110-9 ↗
39. Jiu J, Zhang H, Nagao S, Sugahara T, Kagami N, Suzuki Y, Akai Y, Suganuma K (2016) Die-attaching silver paste based on a novel solvent for high-power semiconductor devices. J Mater Sci 51:3422–3430. https://doi.org/10.1007/s10853-015-9659-810.1007/s10853-015-9659-8 ↗
40. Zhang H, Gao Y, Jiu J, Suganuma K (2017) In situ bridging effect of Ag2O on pressureless and low-temperature sintering of micron-scale silver paste. J Alloy Compd 696:123–12910.1016/j.jallcom.2016.11.225 ↗
41. Matsuhisa N, Inoue D, Zalar P, Jin H, Matsuba Y, Itoh A, Yokota T, Hashizume D, Someya T (2017) Printable elastic conductors by in situ formation of silver nanoparticles from silver flakes. Nat Mater 16:834–84010.1038/nmat4904 ↗
42. Chen C, Noh S, Zhang H, Choe C, Jiu J, Nagao S, Suganuma K (2018) Bonding technology based on solid porous Ag for large area chips. Scripta Mater 146:123–12710.1016/j.scriptamat.2017.11.035 ↗
43. Zhang Z, Chen C, Yang Y, Zhang H, Kim D, Sugahara T, Nagao S, Suganuma K (2019) Low-temperature and pressureless sinter joining of Cu with micron/submicron Ag particle paste in air. J Alloy Compd 780:435–44210.1016/j.jallcom.2018.11.251 ↗
44. Lin S-K, Nagao S, Yokoi E, Oh C, Zhang H, Liu Y-C, Lin S-G, Suganuma K (2016) Nano-volcanic eruption of silver. Sci Rep 6:3476910.1038/srep34769 ↗
45. Ma E, Shen TD, Wu XL (2006) Dislocation propagation versus dislocation nucleation. Nat Mater 5:841–84210.1038/nmat1764b ↗
46. Xu S, Su Y (2018) Dislocation nucleation from symmetric tilt grain boundaries in body-centered cubic vanadium. Phys Lett A 382:1185–118910.1016/j.physleta.2018.03.002 ↗
47. Swygenhoven HV, Spaczer M, Caro A (1999) Microscopic description of plasticity in computer generated metallic nanophase samples: a comparison between Cu and Ni. Acta Mater 47:3117–312610.1016/S1359-6454(99)00109-3 ↗
48. Swygenhoven HV, Weertman JR (2006) Deformation in nanocrystalline metals. Mater Today 9:24–3110.1016/S1369-7021(06)71494-8 ↗
49. Schiotz J, Di Tolla FD, Jacobsen KW (1998) Softening of nanocrystalline metals at very small grain sizes. Nature 391:561–56310.1038/35328 ↗
50. Yamakov V, Wolf D, Salazar M, Phillpot SR, Gleiter H (2001) Length-scale effects in the nucleation of extended dislocations in nanocrystalline Al by molecular-dynamics simulation. Acta Mater 49:2713–272210.1016/S1359-6454(01)00167-7 ↗
51. Ni S, Wang YB, Liao XZ, Figueiredo RB, Li HQ, Ringer SP, Langdon TG, Zhu YT (2012) The effect of dislocation density on the interactions between dislocations and twin boundaries in nanocrystalline materials. Acta Mater 60:3181–318910.1016/j.actamat.2012.02.026 ↗
52. Chen C, Suganuma K (2019) Microstructure and mechanical properties of sintered Ag particles with flake and spherical shape from nano to micro size. Mater Design 162:311–32110.1016/j.matdes.2018.11.062 ↗