Atomic structure of Al/Al interface formed by surface activated bonding
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OpenAlex topics: Intermetallics and Advanced Alloy Properties · Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies
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References (10)
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10. M. Shamzuzzoha, P. A. Deymier and D. J. Smith, Phil. Mag. A 64(1) (1991) 245–253.10.1080/01418619108206138 ↗