Copper pastes using bimodal particles for flexible printed electronics
Source abstract
Abstract
Copper paste is poised to replace silver paste in some applications because of its low cost. However, a high temperature (>900 °C) is required for sintering a film printed with a copper micro-flakes paste, while film cracking might occur if the paste is made up of copper nanoparticles. In this study, these problems are ameliorated by using a mixture of copper micro-flakes and nanoparticles in the paste. The film printed with the paste containing bimodal particles could be sintered at a much lower temperature, and the presence of flakes could suppress the formation of cracks during sintering. The optimal formulation of the screen-print paste was determined to be 20 wt% copper flakes and 80 wt% copper nanoparticles in this study, leading to a volume resistivity of 28 µΩ cm for a film sintered with intense-pulsed light.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Nanomaterials and Printing Technologies · Advanced Sensor and Energy Harvesting Materials · Additive Manufacturing and 3D Printing Technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (23)
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