journal article·2020-02-25

All-Printed Conformal High-Temperature Electronics on Flexible Ceramics

Zheng Li, Scott Scheers, Lu An, Aditya Chivate, Saurabh Khuje, Kevin Xu, Yong Hu, Yulong Huang, Shuquan Chang, Kathy Olenick, John Olenick, Jun Hwan Choi, Chi Zhou, Shenqiang Ren

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Abstract

Each year, Cu is used in more than 60% of electrical applications due to its excellent electrical, thermal, and mechanical properties. Here, we report all-printed flexible conformal electronics consisting of Cu nanowire features (>106 S/m) and dielectric substrates. High aspect ratio Cu nanowires enable a conductive percolation network after printing to produce a conductive trace onto a variety of artificial substrates. The electrical conductivity of printed Cu nanowires can be controlled by aqueous-based reaction and printing conditions, while the stability of printed features is shown by Cu/Ni alloying to effectively protect it from oxidation. We demonstrate a reflection coefficient of −60 dB at the resonant frequency of 2.5 GHz using flexible radio-frequency antenna by printing Cu nanowires on flexible ceramics. Such flexible antenna electronics also exhibit high sensitivity (0.05% °C–1) and accuracy (15 °C) for real-time high-temperature sensing. The findings shown here suggest the potential of high-temperature hybrid conformal electronics using all-printed Cu ink and flexible ceramic materials.
Source: openalex_inverted_index · Quality: baseline

Research context

OpenAlex topics: Nanomaterials and Printing Technologies · Advanced Sensor and Energy Harvesting Materials · Thermal Radiation and Cooling Technologies

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Department of Mechanical and Aerospace Engineering, Research and Education in Energy Environment & Water Institute, University at Buffalo, The State University of New York, Buffalo, New York 14260, United States

College of Material Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China

Department of Industrial System Engineering, University at Buffalo, The State University of New York, Buffalo, New York 14260, United States

Department of Electrical Engineering, University at Buffalo, The State University of New York, Buffalo, New York 14260, United States

ENrG Inc., Buffalo, New York 14207, United States

Department of Chemistry, University at Buffalo, The State University of New York, Buffalo, New York 14260, United States

Funding

Army Research Laboratory

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