journal article·2010-06

AFM indentation method used for elastic modulus characterization of interfaces and thin layers

M. A. Monclus, T. J. Young, D. Di Maio

Journal of Materials Science· Volume 45· Issue 12
Publisher page

Abstract

Atomic force microscopy (AFM) is increasingly being used as a nanoindentation tool to measure local elastic properties of surfaces. In this article, a method based on AFM in force volume (force curve mapping) mode is employed to measure the elastic modulus distribution at the interface of a glass flake-reinforced polypropylene sample and at a lead-free Cu–solder joint. Indentation arrays are performed using a diamond AFM tip. The processing of experimental AFM indentation data is automated by customized software that can analyse and calibrate multiple force curves. The analysis algorithm corrects the obtained force curves by selecting the contact point, discarding the non-contact region and subtracting the cantilever deflection from the measured force curve in order to obtain true indentation curves. A Hertzian model is then applied to the resulting AFM indentation data. Reference materials are used to estimate the tip radius needed to extract the elastic modulus values. With the proposed AFM measurement method, we are able to obtain high-resolution maps showing elastic modulus variations around a composite interface and a Cu–solder joint. No distinct interphase region is detected in the composite case, whereas a separate intermetallic layer (1–2 μm thick) of much higher Young’s modulus (~131 GPa) than Cu and solder material is identified in the Cu–solder joint. Elastic modulus results obtained for the Cu (~72 GPa), solder (~50 GPa) and glass (~65 GPa) materials are comparable to the results obtained by instrumented indentation [~73, ~46 and ~61 GPa], which accentuates the potential of this method for applications requiring high lateral resolution.
Source: openaire · Quality: candidate unverified · Source record ↗

Research context

OpenAlex topics: Force Microscopy Techniques and Applications · Metal and Thin Film Mechanics · Adhesion, Friction, and Surface Interactions

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (20)

Show source-provided references
1. Oliver WC, Pharr GM (1992) J Mater Res 7(6):156410.1557/JMR.1992.1564 ↗
2. Broughton WR, Crocker LE, Loderio MJ (2006) NPL Report DEPC-MPR 055
3. Hodizc A, Stachurski ZH, Kim JK (2000) Polymers 41:689510.1016/S0032-3861(99)00890-3 ↗
4. Hodizc A, Kim JK, Stachurski ZH (2001) Polymers 42:570110.1016/S0032-3861(01)00029-5 ↗
5. VanLandingham MR, Dagastine RR, Eduljee RF, McCullough RL, Gillespie JR (1999) Composites A 30:7510.1016/S1359-835X(98)00098-0 ↗
6. Kim JK, Sham ML, Wu J (2001) Composites A 32:60710.1016/S1359-835X(00)00163-9 ↗
7. Budiansky B, O’Connel RJ (1976) Int J Solids Struct 12(2):8110.1016/0020-7683(76)90044-5 ↗
8. Li D, Liu C, Conway PP (2005) Mater Sci Eng A 391:9510.1016/j.msea.2004.10.007 ↗
9. Jang GY, Lee JW, Duh JG (2004) J Electron Mater 33(10):110310.1007/s11664-004-0111-0 ↗
10. Chromik RR, Vinci RP, Allen SL, Notis MR (2003) J Mater 55(6):66
11. Yang PF, Lai YS, Jian SR, Chen J, Chen RS (2008) Mater Sci Eng A 458:30510.1016/j.msea.2007.07.093 ↗
12. Chromik RR, Vinci RP, Allen SL, Notis MR (2003) J Mater Res 18(9):225110.1557/JMR.2003.0314 ↗
13. Lin DC, Dimitriadis EK, Horkay F (2007) Trans ASME 129(3):430
14. Butt HJ, Capella B, Kappl M (2005) Surf Sci Rep 59:110.1016/j.surfrep.2005.08.003 ↗
15. Khanna SK, Winter RM, Ranganathan P, Yedla SB, Kalukanimuttam M, Paruchuri K (2003) Composites A 34(1):5310.1016/S1359-835X(02)00231-2 ↗
16. Mesa B, Magonov S (2007) J Phys Conf Ser 61:77010.1088/1742-6596/61/1/154 ↗
17. Sneddon IN (1965) Int J Eng Sci 3(1):4710.1016/0020-7225(65)90019-4 ↗
18. Johnson KL (1985) Contact mechanics. Cambridge University Press, Cambridge10.1017/CBO9781139171731 ↗
19. Rabe U, Amelio S, Kester E, Scherer V, Hirsekorn S, Arnold W (2000) Ultrasonics 38:43010.1016/S0041-624X(99)00207-3 ↗
20. Oliver WC, Pharr GM (2004) J Mater Res 19(1):1310.1557/jmr.2004.19.1.3 ↗