journal article·1993-10

Nickel thin films prepared by chemical vapour deposition from nickel acetylacetonate

T. Maruyama, T. Tago

Journal of Materials Science· Volume 28· Issue 19
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Abstract

No abstract is available for this record. The assistant can identify its topic from the title, but cannot infer the study’s results.

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Research context

OpenAlex topics: Copper Interconnects and Reliability · Semiconductor materials and devices · Semiconductor materials and interfaces

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References (6)

Show source-provided references
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2. D. Peterson, “Non-Vacuum Deposition Techniques for Use in Fabricating Thin Film Circuits”, No. NObsr 91336, Final Report 1967.
3. V. G. Syrkin andYu. G. Kiryanov,J. Appl. Chem. USSR 43 (1970) 1076.
4. M. Skibo andF. A. Greulich,Thin Solid Films 113 (1984) 225.10.1016/0040-6090(84)90225-6 ↗
5. R. L. Van Hemert, L. B. Spendlove andR. E. Sievers,J. Electrochem. Soc. 112 (1965) 1123.10.1149/1.2423376 ↗
6. C. H. J. Van Den Brekel, R. M. M. Fonville, P. J. M. Van Der Straten andG. Verspui, in Proceedings of 8th International Conference on Chemical Vapor Deposition, edited by J. M. Blocher Jr, G. E. Vuillard and G. Wahl, Pennington, NJ (Electrochemical Society, Pennington, NJ, 1981) p. 142.