Effect of isothermal aging on intermetallic compound layer growth at the interface between Sn-3.5Ag-0.75Cu solder and Cu substrate
Source abstract
Abstract
Intermetallic compound (IMC) growth during solid-state isothermal aging at temperatures between 100 and 200°C up to 60 days for Sn-3.5Ag-0.75Cu solder on Cu substrate was investigated. A quantitative analysis of the IMC layer thickness as a function of aging time and temperature was performed. Diffusion couples showed a composite IMC layer comprised of Cu6Sn5 and Cu3Sn. After isothermal aging at temperature over 120°C, the solder/Cu interface exhibited a duplex structure of Cu6Sn5 and Cu3Sn intermetallics. The growth of IMCs followed diffusion-controlled kinetics and the layer thickness reached 13 μm after 60 day of aging at 170°C. The apparent activation energies calculated for the growth of the total IMC (Cu6Sn5 + Cu3Sn), Cu6Sn5 and Cu3Sn intermetallic are 62.6, 49.1 and 80.1 kJ/mol, respectively.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Intermetallics and Advanced Alloy Properties · Aluminum Alloy Microstructure Properties
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
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