journal article·2020-07-28

Supermetallophobic Functional Coatings Based on Silicate Clays and a Method To Pattern Liquid Metals

Qian Li, Ju Lin, Tianying Liu, Shijin Dong, Han Zheng, Jing Liu

Publisher page

Abstract

A convenient and easy approach to fabricate a coating capable of preventing adhesion of Ga-based liquid metal alloys (often containing a surface oxide “skin” adhering to substrates even with low surface energy) is reported in this work. By mixing silicate clays with a commercially available and inexpensive resin, a clay coating type that is nonwetting to liquid metals is prepared. The development of supermetallophobic coatings of liquid metals that can be applied in a flexible substrate could provide innovative insights into the design of a nonwetting surface of liquid metals for practical application. In addition, a multiscale and uniform liquid metal thin-film patterning method is introduced based on nonwetting properties. By combining conductive patterns fabricated using this technique with electronic component integration, various functional soft circuits are demonstrated that included (i) soft light-emitting diodes, (ii) a high-conversion frequency–temperature-sensing platform, and (iii) a soft double-deck composite function circuit. Fabrication and incorporation methods demonstrated in this work can be used in dense and multifunctional soft microsystems for various functional circuit applications. This clay coating enables fast patterning of liquid metals, which, in turn, provides low cost and rapid fabrication of a variety of liquid-metal-conductive trace devices.
Source: openalex_inverted_index · Quality: baseline

Research context

OpenAlex topics: Advanced Sensor and Energy Harvesting Materials · Surface Modification and Superhydrophobicity · Nanomaterials and Printing Technologies

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Beijing Key Lab of Cryo-Biomedical Engineering and Key Lab of Cryogenics, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing 100190, P. R. China

Department of Biomedical Engineering, School of Medicine, Tsinghua University, Beijing 100084, P. R. China

School of Engineering Science, University of Chinese Academy of Sciences, Beijing 100190, P. R. China

Beijing DREAM Ink Technologies Company Ltd., Beijing 100080, P. R. China

Funding

National Natural Science Foundation of China

References (54)

Show source-provided references
1. 10.1126/science.118238310.1126/science.1182383 ↗
2. 10.1002/adma.20080178810.1002/adma.200801788 ↗
3. 10.1039/c005159d10.1039/c005159d ↗
4. 10.1038/ncomms192910.1038/ncomms1929 ↗
5. 10.1002/adfm.20130322010.1002/adfm.201303220 ↗
6. 10.1039/c2lc21176a10.1039/c2lc21176a ↗
7. 10.1002/adma.20130546210.1002/adma.201305462 ↗
8. 10.1002/adma.20167015310.1002/adma.201670153 ↗
9. 10.1002/adma.20090420110.1002/adma.200904201 ↗
10. 10.1039/c6lc00046k10.1039/c6lc00046k ↗
11. 10.1002/admi.20160091310.1002/admi.201600913 ↗
12. 10.1103/physrevb.55.1078610.1103/physrevb.55.10786 ↗
13. 10.1016/0039-6028(83)90800-210.1016/0039-6028(83)90800-2 ↗
14. 10.1002/sia.181710.1002/sia.1817 ↗
15. 10.1109/jmems.2013.227862510.1109/jmems.2013.2278625 ↗
16. 10.1002/adfm.20120083710.1002/adfm.201200837 ↗
17. 10.1002/adfm.20070121610.1002/adfm.200701216 ↗
18. 10.1021/am302357t10.1021/am302357t ↗
19. 10.1039/c3lc50952d10.1039/c3lc50952d ↗
20. Kim, D.; Lee, Y.; Lee, D.W.; Choi, W.; Lee, J.B. J. Hydrochloric acid-impregnated paper for liquid metal microfluidics, Solid-State Sensors, Actuators and Microsystems Transducers & Eurosensors XXVII. IEEE, 2013; 2, pp 2620–262310.1109/Transducers.2013.6627343 ↗
21. 10.1088/0960-1317/24/5/05501810.1088/0960-1317/24/5/055018 ↗
22. 10.1016/j.jcis.2016.12.06110.1016/j.jcis.2016.12.061 ↗
23. 10.1039/c7tc03591h10.1039/c7tc03591h ↗
24. 10.1109/jmems.2013.227862510.1109/jmems.2013.2278625 ↗
25. 10.1021/la404356r10.1021/la404356r ↗
26. 10.1002/adfm.20120358910.1002/adfm.201203589 ↗
27. 10.1007/s11432-019-9918-410.1007/s11432-019-9918-4 ↗
28. 10.1038/182128a010.1038/182128a0 ↗
29. 10.1021/ie50320a02410.1021/ie50320a024 ↗
30. 10.1039/tf944400054610.1039/tf9444000546 ↗
31. 10.1088/0957-4484/14/10/30710.1088/0957-4484/14/10/307 ↗
32. 10.1038/nmat92410.1038/nmat924 ↗
33. 10.1002/adma.20160642510.1002/adma.201606425 ↗
34. 10.1039/c5tc00330j10.1039/c5tc00330j ↗
35. 10.1002/admt.20180006110.1002/admt.201800061 ↗
36. 10.1002/admt.20180026510.1002/admt.201800265 ↗
37. 10.1002/adfm.20190655110.1002/adfm.201906551 ↗
38. 10.1002/adem.20190040010.1002/adem.201900400 ↗
39. 10.1021/acsami.7b0552210.1021/acsami.7b05522 ↗
40. 10.1016/j.apsusc.2020.14535310.1016/j.apsusc.2020.145353 ↗
41. 10.1002/adfm.20190137010.1002/adfm.201901370 ↗
42. 10.1021/acsami.6b1308810.1021/acsami.6b13088 ↗
43. 10.1088/1361-6439/ab283910.1088/1361-6439/ab2839 ↗
44. 10.1109/tbcas.2019.293502610.1109/tbcas.2019.2935026 ↗
45. 10.1002/admt.20180037910.1002/admt.201800379 ↗
46. 10.1002/aelm.20190072110.1002/aelm.201900721 ↗
47. 10.1002/adfm.20180038010.1002/adfm.201800380 ↗
48. IEEE 27th Int. Conf. on Micro Electro Mechanical Systems: San Francisco, CA, 2014; pp 967–970.
49. 10.1038/srep0841910.1038/srep08419 ↗
50. 10.1039/c9tc04876f10.1039/c9tc04876f ↗
51. 10.3390/s14091631110.3390/s140916311 ↗
52. 10.1002/admt.20170033010.1002/admt.201700330 ↗
53. 10.1002/adma.20150220010.1002/adma.201502200 ↗
54. 10.1021/la203120810.1021/la2031208 ↗