journal article·2014-02

Mechanical and dielectric properties of epoxy–clay nanocomposites

A. Guevara-Morales, A. C. Taylor

Journal of Materials Science· Volume 49· Issue 4
Publisher page

Abstract

Epoxy–clay nanocomposites were prepared using two types of surface-treated montmorillonite (Closite 30B and Nanomer I28E). Wide angle X-ray scattering showed that all the nanocomposites had an intercalated structure. Improvements in tensile and fracture properties were found. The pure epoxy polymer was very brittle with a fracture energy, G c, of 131 J m−2. The addition of the nanoclays significantly increased the value of G c, up to 240 J m−2 for 5 wt% C30B. The toughening mechanisms acting in the nanocomposites were identified using scanning electron microscopy as crack deflection and plastic deformation of the epoxy matrix around the clay platelets following debonding. From electrical testing, the permittivity and loss angle of the nanocomposites decreased, and their breakdown strength increased as desired for insulation applications. The breakdown strength of the pure epoxy was found to be 11.7 kV mm−1, while for a 2 wt% C30B nanocomposite, it increased to 14.7 kV mm−1. It was concluded that the restriction of chain mobility inhibited electrical polarisation and thus decreased the permittivity and loss angle. The electrical damage zone was analysed using scanning electron microscopy. It was found that the higher resistance-to-surface degradation by partial discharges and the creation of a tortuous electrical path, which delayed the propagation of the electrical tree, were the main factors which improved the breakdown strengths of the nanocomposites.
Source: openaire · Quality: candidate unverified · Source record ↗

Research context

OpenAlex topics: High voltage insulation and dielectric phenomena · Polymer Nanocomposites and Properties · Dielectric materials and actuators

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (35)

Show source-provided references
1. Liu HY, Wang GT, Mai YW, Zeng Y (2011) On fracture toughness of nano-particle modified epoxy. Compos Part B 42(8):2170–217510.1016/j.compositesb.2011.05.014 ↗
2. Lee H, Neville K (1957) Epoxy resins: their applications and technology. McGraw-Hill Book Company, New York
3. Veena MG, Renukappa NM, Suresha B, Shivakumar KN (2011) Tribological and electrical properties of silica-filled epoxy nanocomposites. Polym Compos 32(12):2038–205010.1002/pc.21221 ↗
4. Azeez AA, Rhee KY, Park SJ, Hui D (2013) Epoxy clay nanocomposites—processing, properties and applications: a review. Compos Part B 45(1):308–32010.1016/j.compositesb.2012.04.012 ↗
5. Jumahat A, Soutis C, Abdullah SA, Kasolang S (2012) Tensile properties of nanosilica/epoxy nanocomposites. Procedia Eng 41:1634–164010.1016/j.proeng.2012.07.361 ↗
6. Yasmin A, Luo JJ, Abot JL, Daniel IM (2006) Mechanical and thermal behavior of clay/epoxy nanocomposites. Compos Sci Technol 66(14):2415–242210.1016/j.compscitech.2006.03.011 ↗
7. Dissado LA, Fothergill JC (1992) Electrical degradation and breakdown in polymers, IEE Materials and Devices Series 9. Peter Peregrinus Ltd, London10.1049/PBED009E ↗
8. Tanaka T, Matsunawa A, Ohki Y, Kozako M, Kohtoh M, Okabe S (2006) Treeing phenomena in epoxy/alumina nanocomposite and interpretation by a multi-core model. IEEJ Trans 126(11):1128–113510.1541/ieejfms.126.1128 ↗
9. Sarathi R, Sahu RK, Rajeshkumar P (2007) Understanding the thermal, mechanical and electrical properties of epoxy nanocomposites. Mater Sci Eng A Struct 445–446:567–57810.1016/j.msea.2006.09.077 ↗
10. Tanaka T, Montanari GC, Mülhaupt R (2004) Polymer nanocomposites as dielectrics and electrical insulation-perspectives for processing technologies, material characterization and future applications. IEEE Trans Dielectr Electr Insulation 11(5):763–78410.1109/TDEI.2004.1349782 ↗
11. Tanaka T (2005) Dielectric nanocomposites with insulating properties. IEEE Trans Dielectr Electr Insulation 12(5):914–92810.1109/TDEI.2005.1522186 ↗
12. Nelson JK, Fothergill JC (2004) Internal charge behaviour of nanocomposites. Nanotechnology 15(5):586–59510.1088/0957-4484/15/5/032 ↗
13. Vouyovitch L, Alberola ND, Flandin L, Beroual A, Bessede JL (2006) Dielectric breakdown of epoxy-based composites: relative influence of physical and chemical aging. IEEE Trans Dielectr Electr Insulation 13(2):282–29210.1109/TDEI.2006.1624273 ↗
14. Triantafillidis CS, LeBaron PC, Pinnavaia TJ (2002) Thermoset epoxy–clay nanocomposites: the dual role of α ω-diamines as clay surface modifiers and polymer curing agents. J Solid State Chem 167(2):354–36210.1016/S0022-4596(01)99541-6 ↗
15. Sun Y, Zhang Z, Moon K, Wong CP (2004) Glass transition and relaxation behavior of epoxy nanocomposites. J Polym Sci 42(21):3849–385810.1002/polb.20251 ↗
16. Ray SS, Okamoto M (2003) Polymer/layered silicate nanocomposites: a review from preparation to processing. Prog Polym Sci 28(11):1539–164110.1016/j.progpolymsci.2003.08.002 ↗
17. Yasmin A, Abot JL, Daniel IM (2003) Processing of clay/epoxy nanocomposites by shear mixing. Scr Mater 49(1):81–8610.1016/S1359-6462(03)00173-8 ↗
18. Velmurugan R, Mohan TP (2004) Room temperature processing of epoxy-clay nanocomposites. J Mater Sci 39(24):7333–7339. doi: 10.1023/B:JMSC.0000048748.35490.9f10.1023/B:JMSC.0000048748.35490.9f ↗
19. Sarathi R, Sahu R, Kumar P, Tanaka T (2006) Understanding the performance of epoxy nanocomposites—a physico-chemical approach. IEEJ Trans 126(11):1112–112010.1541/ieejfms.126.1112 ↗
20. Kinloch AJ, Taylor AC (2006) The mechanical properties and fracture behaviour of epoxy-inorganic micro- and nano-composites. J Mater Sci 41(11):3271–3297. doi: 10.1007/s10853-005-5472-010.1007/s10853-005-5472-0 ↗
21. Tarrant A (2004) Themoset-acrylic/layered-silicate nanocomposites: synthesis and structure property relationships. PhD Dissertation, Imperial College London
22. Williams JG (1984) Fracture mechanics of polymers, Ellis Horwood Series in Engineering Science. Ellis Horwood Limited, Chichester
23. Kinloch AJ, Young RJ (1983) Fracture behaviour of polymers. Elsevier Applied Science, London
24. Akbari B, Bagheri R (2007) Deformation mechanism of epoxy/clay nanocomposite. Eur Polym J 43(3):782–78810.1016/j.eurpolymj.2006.11.028 ↗
25. Kinloch AJ, Taylor AC (2003) The toughening of cyanate-ester polymers. Part II Chemical modification. J Mater Sci 38(1):65–79. doi: 10.1023/A:102110973167210.1023/A:1021109731672 ↗
26. Faber KT, Evans AG (1983) Crack deflection processes—I. Theory. Acta Metall 31(4):565–57610.1016/0001-6160(83)90046-9 ↗
27. Hsieh TH, Kinloch AJ, Masania K, Sohn Lee J, Taylor AC, Sprenger S (2010) The toughness of epoxy polymers and fibre composites modified with rubber microparticles and silica nanoparticles. J Mater Sci 45:1193–1210. doi: 10.1007/s10853-009-4064-910.1007/s10853-009-4064-9 ↗
28. Tanaka T, Kozako M, Fuse N, Ohki Y (2005) Proposal of a multi-core model for polymer nanocomposite dielectrics. IEEE Trans Dielectr Electr Insulation 12(4):669–68110.1109/TDEI.2005.1511092 ↗
29. Nelson JK, Fothergill JC, Dissado LA and Peasgood W (2002) Towards an understanding of nanometric dielectrics, 2002. In: Annual report conference on electrical insulation and dielectric phenomena, pp. 295–29810.1109/CEIDP.2002.1048793 ↗
30. Tuncer E, Sauers I, James DR, Ellis AR, Paranthaman MP, Aytug T, Sathyamurthy S, More KL, Li J, Goyal A (2007) Electrical properties of epoxy resin based nano-composites. Nanotechnology 18(2):02570310.1088/0957-4484/18/2/025703 ↗
31. National Communications System Technology & Standards Division (1996) Telecommunications: glossary of telecommunication terms. General Service Administration Information Technology Service
32. Kozako M, Fuse N, Yoshimichi O, Okamoto T, Tanaka T (2004) Surface degradation of polyamide nanocomposites caused by partial discharges using IEC (b) electrodes. IEEE Trans Dielectr Electr Insulation 11(5):833–83910.1109/TDEI.2004.1349788 ↗
33. Flandin L, Vouyovitch L, Beroual A, Bessede JL, Alberola ND (2005) Influences of degree of curing and presence of inorganic fillers on the ultimate electrical properties of epoxy-based composites: experiment and simulation. J Phys D 38(1):144–15510.1088/0022-3727/38/1/023 ↗
34. Nelson JK, Hu Y (2005) Nanocomposite dielectrics—properties and implications. J Phys D 38(2):213–22210.1088/0022-3727/38/2/005 ↗
35. Imai T, Sawa F, Ozaki T, Shimizu T, Kido R, Kozako M, Tanaka T (2006) Influence of temperature on mechanical and insulation properties of epoxy-layered silicate nanocomposites. IEEE Trans Dielectr Electr Insulation 13(1):445–45210.1109/TDEI.2006.1624291 ↗