journal article·1999-01

Effect of rolling temperature on interface and bond strength development of roll bonded copper/aluminium metal laminates

X. K. Peng, G. Heness, W. Y. Yeung

Journal of Materials Science· Volume 34· Issue 2
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Abstract

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Research context

OpenAlex topics: Advanced Welding Techniques Analysis · Material Properties and Applications · Electronic Packaging and Soldering Technologies

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References (13)

Show source-provided references
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5. X. K. Peng, G. Heness and W. Y. Yeung, in Proceedings of the International Conference on Thermomechanical Processing of Steels and Other Materials, Wollongong, Australia, July 1997, eds. T. Chandra and T. Sakai (TMS, US, 1997) 2 p. 1263.
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11. Y. W. Lu, in "Metallurgical Equilibrium Diagrams of Binary Alloys" (Sci. Technol. Press, Shanghai 1987) p. 135.
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