Formation of Thermally Conductive Network Accompanied by Reduction of Interface Resistance for Thermal Conductivity Enhancement of Silicone Rubber
Source abstract
Abstract
Utilizing the synergetic effects of different-sized fillers to effectively construct a thermally conductive network in polymer-based composites is an important strategy to dissipate the heat produced by electronic equipment. In this work, a remarkable synergetic efficiency is achieved in silicone rubber (SR) composites loaded with boron nitride-polydopamine-silver (BN-PDA-Ag) and carbon nanotube-polydopamine-silver (CNT-PDA-Ag) systems by constructing a hybrid heat conductive network. Specifically, PDA decreases the interface thermal resistance by improving the compatibility between the fillers and the polymeric matrix, while Ag nanoparticles further enhance thermal conductivity (TC). Finally, the TC value for SR composites reaches 0.655 W/mK, 4.17 times that of SR matrix. Additionally, a high dielectric constant and a relatively low electrical conductivity are obtained for SR composites. Overall, this strategy offers a valuable basis to prepare thermal management materials for application in electronic components.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Thermal properties of materials · Dielectric materials and actuators · Thermal Radiation and Cooling Technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Beijing Key Laboratory of Advanced Functional Polymer Composites, College of Materials Science and Engineering, Beijing University of Chemical Technology, Beijing 100029, China
State Key Laboratory of Organic−Inorganic Composites, College of Materials Science and Engineering, Beijing University of Chemical Technology, Beijing 100029, China
Funding
Beijing Municipal Science and Technology Commission · Central University Basic Research Fund of China · National Natural Science Foundation of China
References (34)
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